T810, T835
Features A2
600 to 800 V A1
A2
■ Triggering gate current, IGT (Q1) 5 to 50 mA A2
Description A1 A2
G
A1
A2
G
Available either in through-hole or surface-mount D2PAK
(T8-G) IPAK
packages, the BTA08, BTB08 and T8 triac series (T8-H)
is suitable for general purpose AC switching. They
A2
can be used as an ON/OFF function in
applications such as static relays, heating
A1 A2
regulation, induction motor starting circuits... or
G
for phase control operation in light dimmers,
motor speed controllers,... DPAK
(T8-B)
The snubberless versions (BTA/BTB...W and T8
series) are specially recommended for use on
A2
inductive loads, thanks to their high commutation
performances.
Logic level versions are designed to interface
A1 A1
directly with low power drivers such as A2
G A2
G
microcontrollers.
TO-220AB Insulated TO-220AB
By using an internal ceramic pad, the BTA series (BTA08) (BTB08)
provides voltage insulated tab (rated at 2500
VRMS) complying with UL standards (file ref.:
E81734).
1 Characteristics
IPAK/D2PAK/DPAK/
Tc = 110 °C
IT(RMS) On-state rms current (full sine wave) TO-220AB 8 A
TO-220AB Ins. Tc = 100 °C
I - II - III 25 50
IGT (1) MAX. mA
VD = 12 V, RL = 33 Ω IV 50 100
VGT ALL MAX. 1.3 V
VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C ALL MIN. 0.2 V
IH (2) IT = 500 mA MAX. 25 50 mA
I - III - IV 40 50
IL IG = 1.2 IGT MAX. mA
II 80 100
dV/dt (2) VD = 67 %VDRM gate open Tj = 125 °C MIN. 200 400 V/µs
(dV/dt)c
(2) (dI/dt)c = 5.3 A/ms Tj = 125 °C MIN. 5 10 V/µs
IDRM Tj = 25 °C 5 µA
VDRM = VRRM MAX.
IRRM Tj = 125 °C 1 mA
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
Figure 1. Maximum power dissipation versus Figure 2. On-state rms current versus case
rms on-state current (full cycle) temperature (full cycle)
P(W) IT(RMS)(A)
10 10
9 9 BTB / T8
8 8
7 7 BTA
6 6
5 5
4 4
3 3
2 2
1 1
IT(RMS)(A) TC(°C)
0 0
0 1 2 3 4 5 6 7 8 0 25 50 75 100 125
2.5
1E-1
2.0 TO-220AB/D2PAK
Zth(j-a)
1.5 DPAK
(S=0.5CM2)
1E-2
1.0
0.5
TC(°C) tp(s)
0.0 1E-3
0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
ITM(A) ITSM(A)
100 90
Tj max. Tj = Tj max.
Vto = 0.85V 80
Rd = 50 mΩ
70 t=20ms
60 One cycle
Non repetitive
50 Tj initial=25°C
10
Tj = 25°C.
40 Repetitive
TC=110°C
30
20
10
VTM(V) Number of cycles
1 0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1 10 100 1000
Figure 7. Non-repetitive surge peak on-state Figure 8. Relative variation of gate trigger
current for a sinusoidal current
2 2
ITSM(A), I t (A s) IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
1000 2.5
Tj initial=25°C holding current and latching current
versus junction temperature (typical values)
2.0
IGT
dI/dt limitation:
ITSM
50A/µs 1.5
360°
100
IH & IL
1.0
α I2t
tp(ms) Tj(°C)
10 0.0
0.01 0.10 1.00 10.00 -40 -20 0 20 40 60 80 100 120 140
Figure 9. Relative variation of critical rate of Figure 10. Relative variation of critical rate of
decrease of main current versus decrease of main current versus
(dV/dt)c (typical values) (dV/dt)c (typical values)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.2 2.0
Snubberless and Logic level types Standard types
2.0 TW
1.8
1.8
1.6
1.6
C
1.4 1.4
1.2 T835/CW/BW
1.2 B
1.0
0.8 1.0
T810/SW
0.6 0.8
0.4
0.2 0.6
(dV/dt)c (V/µs) (dV/dt)c (V/µs)
0.0 0.4
0.1 1.0 10.0 100.0 0.1 1.0 10.0 100.0
Figure 11. Relative variation of critical rate of Figure 12. DPAK and D2PAK thermal resistance
decrease of main current versus junction to ambient versus copper
junction temperature surface under tab
(dI/dt)c [Tj] / (dI/dt)c [Tj specified] Rth(j-a)(°C/W)
6 100
printed circuit board FR4, copper thickness: 35 µm
90
5 80
70
4
60
3 50 DPAK
40
2
30 D2PAK
1 20
Tj(°C) 10 S(cm²)
0 0
0 25 50 75 100 125 0 4 8 12 16 20 24 28 32 36 40
2 Package information
16.90
10.30 5.08
1.30
3.70
8.90
6.7 3 3 1.6
2.3
6.7
2.3
1.6
A
B 0.64 0.90 0.025 0.035
E
C2
B2 5.20 5.40 0.204 0.212
B2
L2 B3 0.95 0.037
B5 0.30 0.035
D C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.019 0.023
H B3
L1
L
B A1
D 6 6.20 0.236 0.244
V1 E 6.40 6.60 0.252 0.260
e 2.28 0.090
e B5 C
c2
c1 0.49 0.70 0.019 0.027
a1
c2 2.40 2.72 0.094 0.107
l2
a2
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
M
b1 c1
e
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
3 Ordering information
Triac series
Insulation
A = insulated
B = non insulated
Current
08 = 8A
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard BW = 50mA Snubberless
C = 25mA Standard CW = 35mA Snubberless
SW = 10mA Logic Level TW = 5mA Logic Level
Packing mode
RG = Tube
Triac series
Current
8 = 8A
Sensitivity
10 = 10 mA
35 = 35 mA
Voltage
600 = 600 V
800 = 800 V
Package
B = DPAK
H = IPAK
G = D2PAK
R = I2PAK
Packing mode
Blanck = Tube
-TR = Tape and reel
4 Ordering information
5 Revision history
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.