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LCD TV
SERVICE MANUAL
CHASSIS : LA96C

MODEL : 32LH250H 32LH250H-UB

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL62195519 (1006-REV00) Printed in Korea


CONTENTS

CONTENTS ............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

TROUBLE SHOOTING .......................................................................... 16

BLOCK DIAGRAM.................................................................................. 22

EXPLODED VIEW .................................................................................. 24

SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE


Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)


Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC Do not use a line Isolation Transformer during this check.
power line. Use a transformer of adequate power rating as this Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
protects the technician from accidents resulting in personal injury between a known good earth ground (Water Pipe, Conduit, etc.)
from electrical shocks. and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
It will also protect the receiver and it's components from being with 1000 ohms/volt or more sensitivity.
damaged by accidental shorts of the circuitry that may be Reverse plug the AC cord into the AC outlet and repeat AC voltage
inadvertently introduced during the service operation. measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
If any fuse (or Fusible Resistor) in this TV receiver is blown, 0.5mA.
replace it with the specified. In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
When replacing a high wattage resistor (Oxide Metal Film Resistor, repaired before it is returned to the customer.
over 1W), keep the resistor 10mm away from PCB.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed


metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
shock. such as WATER PIPE,
To Instrument’s CONDUIT etc.
0.15uF
Leakage Current Cold Check(Antenna Cold Check) exposed
METALLIC PARTS
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500°F to 600°F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500°F to 600°F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500°F to 600°F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

Copyright LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.

Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Copyright LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.

Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Copyright LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application Range 3. Test method


This specification sheet is applied to the LCD TV used LA96C 1) Performance : LGE TV test method followed.
chassis. 2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC : FCC, ICE, IEC specification
2. Specification
Each part is tested as below without special appointment

1) Temperature : 25 ± 5°C (77 ± 9ºF), CST : 40 ± 5ºC


2) Relative Humidity : 65 ±10%
3) Power Voltage : Standard input voltage
(100-240V@ 50/60Hz)
* Standard Voltage of each products is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.

4. General Specification(TV)
No Item Specification Remark
1 Receivable System 1) VSB/64 & 256 QAM/NTSC-M
2 Available Channel VHF : 02 ~ 13
UHF : 14 ~ 69
DTV : 02 ~ 69
CATV : 01 ~ 135
CADTV : 01 ~ 135
3 Input Voltage 1) AC 100 ~ 240V 50/60Hz
4 Market North America
5 Screen Size 32 inch Wide(1366 x 768) FHD 32LH250H-UB
6 Aspect Ratio 16:9
7 Tuning System FS
8 LCD Module T315XW03-V1 AUO 32LH250H-UB
9 Operating Environment Temp : 0 ~ 40 deg
Humidity : ~ 80 %
10 Storage Environment Temp : -20 ~ 60 deg
Humidity : -85 %

Copyright LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
6. Component Video Input (Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed


1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.0 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 33.75 60.00 74.25 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 67.500 60 148.50 HDTV 1080P
10. 1920*1080 67.432 59.94 148.352 HDTV 1080P
11. 1920*1080 27.000 24.000 74.25 HDTV 1080P
12. 1920*1080 26.97 23.976 74.176 HDTV 1080P
13. 1920*1080 33.75 30.000 74.25 HDTV 1080P
14. 1920*1080 33.71 29.97 74.176 HDTV 1080P

7. RGB input (PC)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed


PC
1 640*350 31.469 70.08 25.17 DOS
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
7 1280*768 47.776 59.87 79.50 CVT(WXGA) O
8 1360*768 47.720 59.799 84.75 CVT(WXGA) O

8. HDMI input (PC/DTV)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed


PC DDC
1. 640*480 31.469 59.94 25.17 VESA(VGA) O
2. 800*600 37.879 60.31 40.00 VESA(SVGA) O
3. 1024*768 48.363 60.00 65.00 VESA(XGA) O
4. 1280*768 47.776 59.87 79.50 CVT(WXGA) O
5. 1360*768 47.720 59.799 84.75 CVT(WXGA) O
DTV
1 720*480 31.47 60 27.027 SDTV 480P
2 720*480 31.47 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
6 1920*1080 33.72 59.94 74.176 HDTV 1080I
7 1920*1080 67.500 60 148.50 HDTV 1080P
8 1920*1080 67.432 59.939 148.352 HDTV 1080P
9 1920*1080 27.000 24.000 74.25 HDTV 1080P
10 1920*1080 26.97 23.976 74.176 HDTV 1080P
11 1920*1080 33.75 30.000 74.25 HDTV 1080P
12 1920*1080 33.71 29.97 74.176 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Object 3.2 Execution of download program (SAP
This spec sheet is applied all of the LCD TV with LA96C Configuration)
chassis.

2. Designation
2.1 The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2.2. Power Adjustment: Free Voltage
3.2.1 Execution of SAP Configuration
2.3. Magnetic Field Condition: Nil.
2.4. Input signal Unit: Product Specification Standard
2.5. Reserve after operation: Above 15 Minutes
2.6. Adjustment equipments: Color Analyzer (CA-210 or CA- 1
110), Pattern Generator (MSPG-925L or Equivalent),
DDC Adjustment Jig equipment, SVC remote controller

Caution : When still image is displayed for a period of 20 2


minutes or longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch),
there can some afterimage in the black level area.

3. Method of PTC MICOM Download


3.1 Connection of MICOM JIG 3 4
1) Connect port(3) with Power Code
2) Connect jack(1) with PTC Micom.
3) Connect USB Cable to the computer
4) Download Program execution (SAP Configuration)

1. Select HCS12
2. Target Frequency Settings :
A. Checking the factor -> Use Specified Target Frequency…,
Unsecure target….
B. Insert Target Bus Frequency -> 7372800
3. Specify Algorithm: 9S12dt128_128k .12P
4. Specify S Record: select download file.
5. Checking factor: Erase Device, Blank Check Device,
Program Device, Verify Device

• Notice!
Don’t check other checking boxes. You must follow fig.

6. Push the ‘Save Image to Cyclone PRO’ button, files


transfer from PC to the Download JIG.
• Notice!
Because PTC Download JIG has internal memory, it can save
download files using download program (SAP Configuration).
Push the START button (4) after file saving, then it execute
download.

Copyright LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
3.3 PTC download by USB 4. Main PCB check process
a. Attach the USB Memory to TV * APC - After Manual-Insult, executing APC
b. MENU > OPTION
-> press left arrow key once
-> press the key ‘7’ for 7 times 4.1 Download
4.1.1 Boot file Download
1. Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2. Set as below, and then click “Auto Detect” and check “OK”
message If display “Error”, Check connect computer, jig,
and set.
3. Click “Read” tab, and then load download file (XXXX.bin) by
clicking “Read”

(3)

filexxx.bin

c. Select PTC Software.

4. Click “Connect” tab.


If display “Can’t ”, Check connect computer, jig, and set.

(1) (4)

d. Select downloading file. (*.s19)


e. Downloading.
- When the downloading is completed, TV will reset itself
automatically.
- If you fail to download, retry to download with PC.
- Do not remove USB in downloading.

Please Check the Speed :


To use speed between
from 200KHz to 400KHz

5. Click “Auto” tab and set as below


6. Click “Run”.
7. After downloading, check “OK” message.

(5)

filexxx.bin
(5)

(7) .OK

(6)

Copyright LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
* USB DOWNLOAD(*.epk file download) * After downloading, have to adjust TOOL OPTION again.
1. Put the USB Stick to the USB socket 1. Push "Adj" key in service remote controller.
2. Automatically detecting update file in USB Stick 2. Select "Tool Option 1~ 4" and Push “OK” button.
- If your downloaded program version in USB Stick is Low, it 3. Punch in the number. (Each model has their number.)
didn’t work. But your downloaded version is High, USB data
is automatically detecting Model Tool option1 Tool option1 Tool option1 Tool option1
3. Show the message “Copying files from memory” 37LH260H-UB 33056 1576 33056 1024
42LH260H-UB 26769 1576 33056 1024
32LH250H-UB 18499 1576 33056 1024

4. Completed selecting Tool option

4. Board-level adjustment
4.1 ADC adjustment
4.1.1 Overview
ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation.

4.1.2 Equipment & Condition


1) Jig (RS-232C protocol)
4. Updating is staring. 2) Input : MSPG-925FS(Model : 209 ,Pattern : 65, Only
component))
3) RGB Adjust use internal pattern.

4.1.3 Adjustment
4.1.3.1 Method
• Using RS-232, adjust items listed in 3.1 in the order shown in
“4.1.3.3”.

4.1.3.2 Adj. protocol

Protocol Command Set ack

Enter adj. ad 00 00 d 00 OK00x

mode

Begin adj. ad 00 10

Return adj. OKx (Success)

result NGx (Fail)

Read adj. (main) (main)

data ad 00 20 000000000000000000000000007c007b006dx

(sub ) (Sub)

ad 00 21 000000070000000000000000007c00830077x

Confirm adj. ad 00 99 NG 03 00x (Fail)

NG 03 01x (Fail)

NG 03 02x (Fail)

5. Updating Completed, The TV will restart automatically. OK 03 03x (Success)


6. If your TV is turned on, check your updated version and Tool End adj. ad 00 90 d 00 OK90x
option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel Ref.) ADC adj. RS232C Protocol_Ver1.0
recover. if all channel data is cleared, you didn’t have a
DTV/ATV test on production line. 4.1.3.3 Adj. order
• ad 00 00 [Enter ADC adj. mode]
• ad 00 10 [Adjust 480i Comp1/1080p Comp1/1024*768 RGB]
• ad 00 90 End adj.

Copyright LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
5. ADC Process 5.1.2 Confirmation
• We confirm whether “0xAA (RGB)” address of EEPROM
5.1 PC input ADC “0xA2” is “0xAA” or not.
5.1.1 Auto RGB Gain/Offset Adjustment • If “0xAA (RGB)” address of EEPROM “0xA2” isn’t “0xAA”, we
• Convert to PC in Input-source. adjust once more.
• Signal equipment displays. • We can confirm the ADC values from “0xA4~0XA9 (RGB)”
Output Voltage : 700 mVp-p addresses in a page “0xA2”
- Impress Resolution XGA (1024 x 768 @ 60Hz)
* Manual ADC process using Service Remocon. After enter
Service Mode by pushing “ADJ” key, execute “ADC Adjust” by
pushing “•” key at “ 5. ADC Calibration” and click “Start”.

Model : 60 in Pattern Generator


Pattern : 65 in Pattern Generator (MSPG-925 SERISE)

Adjustment pattern (PC)

• Adjust by commanding AUTO_COLOR_ADJUST.

5.2 COMPONENT input ADC


5.2.1 Component Gain/Offset Adjustment
• Convert to Component in Input-source.
• Signal equipment displays.
- Impress Resolution 480i

Copyright LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
MODEL: 209 in Pattern Generator(480i Mode) 5.3 Function Check
PATTERN : 65 in Pattern Generator( MSPG-925 SERISE) 5.3.1 Check display and sound
- Impress Resolution 1080p • Check Input and Signal items. ( cf. work instructions)
1.TV
2. AV (CVBS/ S-Video)
3.COMPONENT (480i)
4.RGB (PC : 1024 x 768 @ 60hz)
5.HDMI
6.PC Audio In and H/P Out
* Display and Sound check is executed by Remote controller.

5.4 EDID(The Extended Display Identification Data)


/ DDC(Display Data Channel) download
5.4.1 Overview
It is a VESA regulation. A PC or a MNT will display an optimal
MODEL: 223 in Pattern Generator(1080p Mode) resolution through information sharing without any necessity of
PATTERN: 65 in Pattern Generator( MSPG-925 SERISE) user input. It is a realization of “Plug and Play”.

5.2.2 Confirmation 5.4.2 Equipment


• We confirm whether “0xB3 (480i)/0xBC (1080p)” address of • Adj. R/C
EEPROM “0xA2” is “0xAA” or not. • Since embedded EDID data is used, EDID download jig,
• If “0xB3 (480i)/0xBC(1080i)” address of EEPROM “0xA2” HDMI cable and D-sub cable are not need.
isn’t “0xAA”, we adjust once more.
• We can confirm the ADC values from “0xAD~0XB2 5.4.3 Download method
(480i)/0XB6~BB(1080p)” addresses in a page “0xA2” 1) Press Adj. key On the Adj. R/C, press Adj. key then select
EDID D/L. By pressing Enter key, EDID download will
* Manual ADC process using Service Remocon. After enter begin.
Service Mode by pushing “ADJ” key, execute “ADC Adjust” by 2) If Download is successful, OK is displayed.
pushing “•” key at “ 5. ADC Calibration” and then click “Start”. 3) If Download is a failure, NG is displayed.
4) Re-try download.
- Impress Resolution 480i/1080p/RGB
5.4.4 EDID DATA
•Reference: Download is only possible in POWER ON MODE.

• HDMI I [C/S: 1DBA]

Copyright LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
• HDMI II [C/S: 1DAA] 6.1.3 Equipment connection map

Color Analyzer

Probe RS-232C

RS-232C Computer
RS-232C

# Pattern Generator
Signal Source

* If TV internal pattern is used,not needed

• RGB [C/S: 71FF] 6.1.4 Adj. Command (Protocol)


•Protocol
<Command Format>

START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS A STOP

- LEN: Number of Data Byte to be send


- CMD: Command
- VAL: FOS Data
- CS: Checksum of sent Data
- A: Acknowledge
Ex) [Send: JA_00_DD] / [Ack: A_00_okDDX]

RS-232C COMMAND Explanation


[CMD ID DATA]
Wb 00 00 Begin White Balance adjust.
Wb 00 10 Begin Gain adjust (internal white pattern)

6. Final Assembly adj. Wb 00 1f End Gain adjust


Wb 00 20 Begin Offset adjust (internal white pattern)
6.1 White Balance adj.
Wb 00 2f End Offset adjust
6.1.1 Overview
•W/B adj.: Objective & How-it-works Wb 00 ff End White Balance adjust(internal pattern
- Objective: To reduce each Panel’s W/B deviation disappears )
- How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. •Adj. Map
In order to prevent saturation of Full Dynamic - Applied model:
range and data, one of R/G/B is fixed at 192,
Item Command Data Range Default
and the other two is lowered to find the (lower case ASCII) (Hex.) (Decimal)
desired value. CMD1 CMD2 MIN MAX
Cool R Gain j g 00 C0 TBD
6.1.2 Equipment G Gain j h 00 C0 TBD
1) Color Analyzer : CA-210 (NCG: CH 9 / WCG: CH12 /LED
B Gain j i 00 C0 TBD
Module:CH14)
R Cut TBD
2) Adj. Computer (During auto adj., RS-232C protocol is
G Cut TBD
needed)
B Cut TBD
3) Adj. R/C
4) Video Signal Generator MSPG-925F 720p/216Gray Medium R Gain j a 00 C0 TBD
(Model:217, Pattern:78) G Gain j b 00 C0 TBD
-> Only when internal pattern is not available B Gain j c 00 C0 TBD
R Cut TBD
•Color Analyzer Matrix should be calibrated using CS-1000 G Cut TBD
B Cut TBD
Warm R Gain j d 00 C0 TBD
G Gain j e 00 C0 TBD
B Gain j f 00 C0 TBD
R Cut TBD
G Cut TBD

Copyright LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
6.1.5 Adj. method 6.1.6 Reference (White Balance adj. coordinate and color
6.1.5.1 Auto adj. method temperature)
1) Set TV in adj. mode using POWER On Key 6.1.6.1 Adjustment Preparation
2) Zero calibrate probe then place it on the center of the • W/B Equipment condition
Display CA210: CH 9, Test signal: Inner pattern (85IRE)
3) Connect Cable(RS-232C) • Above 5 minutes H/run in the inner pattern. (“power on” key
4) Select mode in adj. Program and begin adj. of adjust remote control)
5) When adj. is complete (OK Sign), check adj. status per • 15 Pin D-Sub Jack is connected to the AUTO W/B
mode (Warm, Medium, Cool) EQUIPMENT.
6) Remove probe and RS-232C cable to complete adj. • Adjust Process will start by execute I2C Command (Inner
pattern (0xF3, 0xFF)).
• Adj. must begin w/ command “wb 00 00”, and end w/“wb 00
ff”and adj. offset if needed. X=0.276 ± 0.003 <Test Signal>
Cool 11,000 K
Y=0.283 ± 0.003 Inner pattern
6.1.5.2 Manual adj. method Color X=0.285 ± 0.003
Medium 9,300 K
Temperature Y=0.293 ± 0.003 (216gray, 85 IRE)
Dynamic contrast : off
X=0.313 ± 0.003
Dynamic color : off Warm 6,500 K
Y=0.329 ± 0.003
OPC : Off
Energy saving mode : Off
∆ Manual White Balance adjust process using Service Remo-
1) Set TV Picture Mode to Standard and in Advanced Control, con. After enter Service Mode by pushing “ADJ” key, enter
set Dynamic Contrast and Color ‘Off’. “White Balance” by pushing “•” key at “ 6. White Balance”.
2) Set TV in adj. mode using POWER On Key (CA-210, CH-9)
3) Press ADJ key -> EZ adjust using adj. R/C
4) Using CH + / - KEY, select 10.TEST PATTERN then press
Enter to place in HEAT RUN mode and wait for 30 minutes.
5) Zero calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10 cm of the surface.
6) Press ADJ key -> 7. White-Balance then press the cursor
to the right (KEY )
(When is pressed Full White internal pattern will be
displayed)
7) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
8) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature

•If internal pattern is not available, use HDMI input. In EZ Adj. *Adjust “R/G/B - GAIN” by pushing “ ”, “ ” key at “Cool”
menu 7.White Balance, you can select one of 3 options: *Adjust “R/G/B - GAIN” by pushing “ ”, “ ” key at “Medium”
None, Inner, HDMI. Default is inner. By selecting HDMI, you *Adjust “R/G/B - GAIN” by pushing “ ”, “ ” key at “Warm”
can adjust using HDMI signal.

• Adj. condition and cautionary items


1) Lighting condition in surrounding area
Surrounding lighting should be lower than 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
- LCD: Color Analyzer (CA-210) probe should be within 10cm
and perpendicular of the module surface (80°~ 100°)
- In case of LCD, B/L on should be checked using no signal or
Full white Pattern

Copyright LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
TROUBLESHOOTING
1. Power-up boot check
No OK OK
Check stand-by Voltage. Check Power connector
Check Fuse. Replace Power board.
P701 10pin : +3.5V_ST and AC S/W on?

OK

No
Check X100 clock Replace X100.

OK

No OK
Check P701 PWR_ON.
Re-download software. Replace Mstar(IC100) or Main board
1pin : 3.5V

OK

No
Check Multi Voltage
Replace Power board
P701 7pin : 12V, 2pin : 24V

OK

No
Check Q706 Output.
Replace Q706
12V, 5V

OK

Check inverter control & error No


P701 24pin : Low Check Power board or Module
P701 18pin : high

OK
No
Check Mstar LVDS output
Replace Mstar(IC100) or Main board
R812, R813,..., R821

Copyright LG Electronics. Inc. All right reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
2. Digital TV Video
Check RF cable & Signal.

OK

No
Check Tuner 5V Power Check IC1002
IC1001 4pin (19",22")Check IC1002.

OK
No
Check IF_P/N Signal Replace Tuner.

OK

No
Check Check Demodulator Input
Replace X1005.
Clock(X1005)

OK

No
Check IC1004(LGDT) Output
Replace IC1004.
- AR1070, AR1071

OK

No
Check Mstar LVDS output
Replace Mstar(IC100) or Main board.
R812, R813,..., R821

3. Analog TV Video

Check RF cable.

OK

No
Check Tuner 5V Power. Check IC1002
IC1001 4pin Check IC1005(19",22")

OK

No
Check CVBS signal.
Bad Tuner.
TU1001 #19 Pin

OK
No
Check Mstar LVDS output Replace Mstar(IC100) or Main board.

Copyright LG Electronics. Inc. All right reserved. - 17 - LGE Internal Use Only
Only for training and service purposes
4. Component Video
Check input signal format.
Is it supported?

OK

Check Component Cable.

OK
No
Check JK1200. Replace Jack.

OK
No
Check Mstar LVDS output Replace Mstar(IC100) or Main board.

5. RGB Video
Check input signal format.
Is it supported?

OK

Check RGB Cable conductors for


damage.

OK
No
Check JK1204. Replace Jack.

OK
No
Check EDID. Replace the defective IC or re-download EDID data

OK

No
Check signal R/G/B/H/V-Sync Check other set.
C113, C108, C114, R146, R149 If no problem, check signal line.

OK
No
Check Mstar LVDS output Replace Mstar(IC100) or Main board.

Copyright LG Electronics. Inc. All right reserved. - 18 - LGE Internal Use Only
Only for training and service purposes
6. AV Video
Check input signal format.
Is it supported?

OK

Check AV Cable for damage or open conductor.

OK
No
Check JK1200(*JK1202). Replace Jack.

OK
No
Check Mstar LVDS output Replace Mstar(IC100) or Main board.

7. HDMI Video
Check input signal format.
Is it supported?

OK

Check HDMI Cable conductors for


damage of open conductor.

OK
No
Check JK500, 501, 502 Replace Jack.

OK

No
Check EDID & EEPROM Replace the defective IC or re-download
IC500, 501, 502. EDID data.
I2C Signal (#5, #6)

OK

No
Check HDCP key NVRAM(IC105)
Replace the defective IC.
power & I2C Signal (#5, #6)

OK
No No
Check other set.
Check HDMI Signal Replace Main board.
If no problem, check signal line.
OK
No
Check Mstar LVDS output Replace Mstar(IC100) or Main board.

Copyright LG Electronics. Inc. All right reserved. - 19 - LGE Internal Use Only
Only for training and service purposes
8. All Source Audio
Make sure you can’t hear any audio.

OK
No
Check Mstar AUDIO_MASTER_CLK Replace Mstar(IC100) or Main board.

OK

No
Check Mstar I2S Output
Check signal line. Or replace IC100.
R604, R605, R606

OK

No
Check IC500 Power
Check Regulator IC601, IC704
*24V, 3.3V, 1.8V.

OK
No
Check Output Signal P600 1, 2, 3, 4 pin. Replace NTP(Audio AMP) IC500

OK
No
Check Connector & P600 Replace connector if found to be damaged.

OK

No
Check speaker resistance
Replace speaker.
and connector damage.

Copyright LG Electronics. Inc. All right reserved. - 20 - LGE Internal Use Only
Only for training and service purposes
9. Digital TV Audio
No
Check Tuner 5V Power Check IC1002.
TU1001 4pin. Check IC1005(19”, 22”)

OK
No No
Check IF_P/N Signal. Bad Tuner. Replace Tuner Bad Tuner.

OK
No
Check Demodulator Input Clock(X1005). Replace X1005.

OK

No
Check IC400(LGDT) Output
Replace IC400.
- AR1070, AR1071

OK

No
Check Output Signal Replace NTP3100L
P600 1, 2, 3, 4 pin (Audio AMP) IC500

OK
No
Replace connector
Check Connector & P600
if found to be damaged.

OK

No
Check speaker resistance
Replace speaker.
and connector damage.

10. Analog TV Audio


Check RF Cable.

OK
No No
Check Tuner 5V Power Check IC1002. Bad Tuner
TU1001 4pin Check IC1005(19”, 22”). Replace Tuner.

OK
No
Check SIF buffer signal. Check SIF Signal line.

OK

No
Follow procedure All source audio Replace Mstar(IC100)
trouble shooting guide. or Main board.

Copyright LG Electronics. Inc. All right reserved. - 21 - LGE Internal Use Only
Only for training and service purposes
BLOCK DIAGRAM

Copyright LG Electronics. Inc. All right reserved. - 22 - LGE Internal Use Only
Only for training and service purposes
Copyright
MPI Control
SCL, SDA_3.3V
VSB
PTC
MPEG2, IF +/- Demod. TS In[0…7]
LINUX TS_clk, SOP, Val
TU_CVBS
TR Buffer
SIF

SDA/SCL_5V LVDS
LCD Module
Reset / IF_AGC …

Only for training and service purposes


Half-NIM Tuner
CVBS, L/R
AV
Y Pb Pr, L/R
Component 1
Saturn6 Reset IC
Reset Switch

LG Electronics. Inc. All right reserved.


12MH
(ATSC z X-tal
EEPROM
RGB/H/V US)
D-sub RGB Data [0 … 7]
Audio L/R NAND Flash
Audio L/R (for RGB) Addr[0…1], CS … (256Mb)
EEPROM
MPEG2/4

- 23 -
HDMI 1
EEPROM
JACK PACK Linux
at REAR DDR_Data[0:15], DQS, DM …
HDMI 2
Scaler DDR2 (512Mbit)
Qimonda / Hynix
RJP Control Addr.[ ], ctrl. data
RJP PIP : x
IR OUT DDR2 (512Mbit)
Qimonda / Hynix
Speaker Out(8ohm) AMP Data[16:31]

RX/TX RX/TX Digital AMP


RS-232C (Ctrl./SVC) MAX3232 I2S
NTP3100A
CVBS, L/R
Side AV
SCL, SDA_3.3V EEPROM
512Kb
JACK PACK DP/D
at SIDE M SCL, GPIO
USB2.0 IO Expander
+5V O.C. Protector +5V SDA_3.3V

Audio L/R CLK,TDI,TDO,MS,RST


Headphone(opt) Out H/P Amp. JTAG

LGE Internal Use Only


EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
400 Do not modify the original design without permission of manufacturer.

900
590

520
540
804

805

801
803
800

806
550
LV1

530

802

810
200

120

A10
300

A5
500
510

A2

Copyright LG Electronics. Inc. All right reserved. - 24 - LGE Internal Use Only
Only for training and service purposes
PStoPDF trial version. http://www.oakdoc.com
SIDE_AV

R,G,B PC&DDC
D1215 L1208
ADUC30S03010L BG2012B080TF
30V 008:D26
JK1202 SIDEAV_CVBS_IN
PPJ218-01 R1238 C1227
OPT 75 +3.3V 100pF
[YL]O_SPRING OPT
4A
R1248
10K R1254
5A [YL]CONTACT 1K 009:P28
SIDEAV_SW
D1221
2A [YL]U_CAN ADMC5M03200L C1219
100pF
5.6V
[WH]C_LUG
+5V_ST_PTC
3B L1206 R1259
BG2012B080TF 10K 008:R33
2B [WH]U_CAN SIDEAV_L_IN
R1246 C1224 R1264
D1213 100pF 12K
OPT ADMC5M03200L 470K 50V
4C [RD]O_SPRING
5.6V
L1207
[RD]CONTACT BG2012B080TF R1258
5C 10K 008:R33
C1225 SIDEAV_R_IN
[RD]U_CAN D1214 R1247 100pF R1263
2C OPT ADMC5M03200L 470K 50V 12K D1223
5.6V
ENKMC2838-T112
A1
C
A2

IC1200
C1228
AT24C02BN-10SU-1.8 0.1uF
R1249 R1253 R1262 16V
4.7K 4.7K 10K
A0 VCC
1 8

COMPONENT1,AV1 A1
2 7
WP
R1269
100
EEPROM_WP
008:AP22;002:S21;002:S8
A2 SCL
D1242 3 6
ADMC5M03200L ISP_RXD
R1205 L1218 008:AB27
BG2012B080TF 5.6V
10K GND SDA
AV_R_IN
4 5 ISP_TXD
008:R32 C1250 008:AB27;008:AR31
R1207 R1206 OPT
12K 100pF 470K C1222 C1223 R1257
50V 18pF 18pF 22 R1265
JK1200 D1212 50V 50V 22
ADMC5M03200L R1251
PPJ228-01 5.6V 10K D1224
L1217 COMP1_R_IN ADMC5M03200L
R1211 D1222 5.6V
10K BG2012B080TF [RD]CONTACT-S R1245 C1221 008:R33 ADMC5M03200L OPT
AV_L_IN OPT 470K R1255 5.6V
1000pF 12K OPT
008:R32 [RD]CONTACT-L 6H 3E 50V
R1210
C1251
R1208
[RD]O-SPRING-S
100pF OPT
12K 470K 0 R1232
50V R1252
[RD]O-SPRING-L 5H 4E [RD]E-LUG_2 10K 008:D29DSUB_VSYNC
COMP1_L_IN
9E R1244 C1220 008:R33 0 R1233
D1243 [WH]C-LUG-S OPT 470K 1000pF
R1256
12K 008:D29DSUB_HSYNC
ADMC5M03200L
5.6V D1211 50V D1216
[WH]C-LUG-L 7G 8D [WH]E-LUG ADMC5M03200L ADUC30S03010L
5.6V D1207
ADUC30S03010L 30V
30V
9D [RD]C-LUG-S
COMP1_PR

[YL]CONTACT-L 6F 8C D1210 R1243 008:D31


OPT ADUC30S03010L 75
AV_CVBS_IN 30V 008:D28 DSUB_B
008:D26 [YL]O-SPRING-L 5F [RD]E-LUG_1 D1217
R1234 C1216
C1252 D1209 75 30V
R1215 D1245 0.1uF
47pF 75 OPT
ADUC30S03010L 9C [BL]C-LUG-S ADUC30S03010L OPT
30V
50V 1% 30V COMP1_PB
8B 008:D31 +5V_GENERAL
[BL]E-LUG R1242
75
OPT
9B [GN]CONTACT-S
008:D29 DSUB_G
R1270
C1217 D1218 OPT 10K
3A R1235 ADUC30S03010L
[GN]O-SPRING-S 75 0.1uF SIGN25
COMP1_Y OPT 30V
4A [GN]E-LUG D1208
OPT R1241 008:D31
ADUC30S03010L 75

R1268
30V

OPT
0
9A D1225
ADMC5M03200L
5.6V
008:D29 DSUB_R OPT
R1236 C1218 D1219
0.1uF ADUC30S03010L
75 OPT 30V

11

12

13

14

15
JK1204

16
10
6

9
PC AUDIO KCN-DS-1-0089

5
JK1205
PEJ024-01

3 E_SPRING

6A T_TERMINAL1
D1234
5.6V
R1300 R1305
B_TERMINAL1 ADMC5M03200L 10K
7A 0
PC_R_IN
008:R32
R_SPRING C1240 R1303
4 OPT 100pF R1297
470K 12K
50V
5 T_SPRING
D1235
5.6V R1301 R1307
7B B_TERMINAL2 ADMC5M03200L 10K 0
PC_L_IN
008:R31
6B T_TERMINAL2
C1241 R1298
OPT 100pF R1304
50V 470K 12K
8 SHIELD_PLATE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 32/37/42 AUO
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. IN/OUT 1 14
UNER
PStoPDF trial version. http://www.oakdoc.com
2010_PWR BLOCK
HDMI1 EDID +3.5V_ST
12V_DCDC

2010_PWR 2010_PWR
L4005 D4000
22uH MBRA340T3G

2010_PWR
2010_PWR2010_PWR

2010_PWR
40V
100K R4048 C4035
R4045
1K 22uF
1%
25V
+3.3V_ST 2010_PWR
IC4003 R4046 30K C4034
2010_PWR 100pF
BD9306AFVM Q4008 1%
5V_HDMI_1 50V
R556 Si4800BDY 2010_PWR
C 47K R4040
R513
10K OPT FB RT 20K
Q504 B 8 1
2SC3052 D8 S1
HPD1 C4023 8 1
22 E 008:D37 COMP CT 100pF
C4013 R4030 7 2
D7 S2
0.1uF 1K 50V 7 2 15K
19 R552

2010_PWR
+5V_GENERAL 5V_HDMI_1 R4047
1K GND ENB 1%
6 3
AVRL161A1R1NT

18 C501 D6 S3
R501
VR500

0 .JP502
1uF 2010_PWR 6 3
17 16V
820 VCC GD
R510 0 IC4002 5 4
OPT

D5 G

ENKMC2838-T112
16 DDC_SDA_1 SC632ULTRT [EP]GND 5 4
008:D38;002:R20

A1

A2
15 0 DDC_SCL_1
R511

D501
JP503 008:D37;002:R21 GND C2-
14 1 8
R509 0 C4009

THERMAL
2.2uF
13
R569 0 008:D39 C1+ C2+ 10V +5V_ST_PTC

9
CK-_HDMI1 2 7
12 IC500 C4004
CAT24C02WI-GT3 C509 +3.5V_ST 2.2uF
11 008:D39 0.1uF 10V C1- OUT
R570 0 50V 3 6
CK+_HDMI1 R542
10 10K
R571 0 008:D39 A0 VCC
1 8 OPT IN EN 2010_PWR
D0-_HDMI1 R536 R539 2010_PWR
9
4.7K 4.7K
4 5 C4015 2010_PWR
C4019 C4021
R545 2010_PWR 10uF
8 A1 WP 100 47uF 47uF

JP500
R572 008:D39 2 7 IC6000 25V 10V 10V
0 EEPROM_WP
D0+_HDMI1 SC632ULTRT
7
R573 008:D38 HDMI1 R530
[EP]GND
0 A2 SCL
D1-_HDMI1 22 2010_PWR
6 3 6 009:N25;009:AU17 R4034
DDC_SCL_1
GND C2- +5V_ST_PTC DCDC_EN
5 R531 1 8 0
VSS SDA C6001

2010_PWR
R574 0 008:D38 22
4 5 R4033

THERMAL
D1+_HDMI1 DDC_SDA_1 2.2uF

L6000
4 10V 47K
R575 008:D38 C1+ C2+

OPT
9
0 2 7
D2-_HDMI1
3 C6000
C512 C515 2.2uF
2 8pF 8pF 10V C1- OUT
R576 008:D38 3 6
0 50V 50V
D2+_HDMI1 OPT OPT
1
IN EN 2010_PWR
2010_PWR
20 4 5 C6002 2010_PWR
C6003 C6004
10uF 47uF 47uF
21 25V 10V 10V

GND
QJ41193-CFEE1-7F
JK500
R4003 R4009 R4015 R4018
10K 5.1K 200 47K
5V_ST
1% 1/10W 1/10W 1%
5% 5%
+12V 5V_ST
+5V_ST_PTC 5V_ST +5V_ST

2010_PWR
IC4001
AOZ1073AIL 2010_PWR

2010_PWR
Q4007
2010_PWR AO4813

OPT
L4004 R4039
22K R4042

HDMI2 EDID 2010_PWR


PGND
1 8
LX_2 3.6uH 22K
2010_PWR
C4027
2010_PWR
C4030
S2 1 8 D2_2

L4001
MLB-201209-0120P-N2 +12V 2.2uF 100uF
VIN LX_1 25V G2 2 7 D2_1
2 7 16V
C4036
220uF

R4035
C4018 0 . 1 u F
S1 3 6 D1_2 16V

2010_PWR
2010_PWR 2010_PWR

OPT
C4002 AGND EN 10K R4041

1K
C4003 3 6 2010_PWR
0.1uF C4014 C4020
22uF 15K
16V R4024 10uF 22uF 2010_PWR G1 4 5 D1_1
16V Q4005
FB COMP 10V 16V
4 5 C
2SC3875S(ALY)
B

1/10W
R4022
R4037

11K
10K

5%
MSTAR_POWER_ON 2010_PWR E
008:Q29;002:R11 +3.3V_ST 002:AE6;004:AG4;009:N27
5V_HDMI_2

R4027
R557 C4008

47K
C 47K 1000pF
R514 OPT 50V
Q505 B 10K
22
2SC3052
HPD2
R553 E 008:D35
19
1K C502
0.1uF
JP504

18 16V +5V_GENERAL 5V_HDMI_2


R502
17 VR501
820 R506 0 008:D35;002:R7
AVRL161A1R1NT
OPT

16 DDC_SDA_2
008:D35;002:S7
JP505

ENKMC2838-T112

15 0 DDC_SCL_2
R507
A1

A2

14 R4050 R4007 R4012


D502

R508 0 10K 4.7K 27K


+3.3V
13
R577 0 008:D37 1% 1% 1%
C

BLM18PG121SN1D
CK-_HDMI2 3.3V
12

2010_PWR
IC501 3.3V 3.3V

L4009
11 008:D37
R578 0 CAT24C02WI-GT3 C510
CK+_HDMI2 0.1uF +12V 2010_PWR
10 2010_PWR Q4009
R579 0 008:D36 50V R543 AO4813
9
D0-_HDMI2 10K IC4000
A0 VCC

2010_PWR
1 8 OPT AOZ1073AIL
R537 R540
8 2010_PWR S2 1 8 D2_2
R580 008:D36 4.7K 4.7K R4043 OPT
0 R546 L4003 C4028
D0+_HDMI2 A1 WP 100 10K
7 3.6uH 10uF
JP501

R581 008:D36 2 7 EEPROM_WP PGND LX_2 16V G2 2 7 D2_1


0 1 8
D1-_HDMI2 HDMI2 2010_PWR
6 R532

R4036
L4000
A2 SCL 22 MLB-201209-0120P-N2 S1 3 6 D1_2
3 6 VIN LX_1 +12V R4044

OPT
5 DDC_SCL_2 C4037

1K
R582 008:D36 2 7 220uF
0 0
D1+_HDMI2 R533 16V
G1 4 5 D1_1

C4011 0 . 1 u F
4 VSS SDA 2010_PWR 2010_PWR
R583 008:D35 22 Q4006

2010_PWR
0 4 5 AGND EN 10K
D2-_HDMI2 DDC_SDA_2 C4000 C4001 3 6 008:AR31;004:Q27;004:T24 C
3 C4010 2SC3875S(ALY)
0.1uF 22uF C4012 POWER_ON/OFF1 2010_PWR
16V R4017 10uF 22uF B
16V
2 FB COMP 10V 16V R4032 0 R4038
R584 0 008:D36 C513 C516 4 5 2010_PWR
D2+_HDMI2 2010_PWR 10K
1 8pF 8pF E
50V 50V R4031 0 OPT

1/10W
R4016
OPT OPT MSTAR_POWER_ON

11K
20 002:AG13;004:AG4;009:N27

5%
21

2010_PWR

R4021
C4007

47K
1000pF
QJ41193-CFEE1-7F 50V
JK501 GND

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 32/37/42 AUO
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. HDMI 2 14
HDMI
PStoPDF trial version. http://www.oakdoc.com
+1.8V_AMP & +24V_AMP EXTERNAL SPEAKER OUT +5V_GENERAL

L300
CB3216PA501E

C2143 C2144
10uF 0.1uF
16V

R2238
OPT
IC300
TPA6011A4PWPRG4

R2225
R2223
10K

1K
PGND_1 ROUT+
1 24
IC601 E
2SA1530A-T112-1R OPT SHIELD_PLATE 8

Q1104 ROUT- SE/BTL R2235


2 23
+3.3V AZ1117H-1.8TRE1(EH13A) +1.8V_AMP B SUB_MUTE T_TERMINAL2 6B

R2232
100
C 008:AB19;003:AC20
PVDD_1 HP/LINE
3 22 B_TERMINAL2 7B
R2231
EXT_SPK_L-
INPUT ADJ/GND 0 R2234 5

C2140
003:P20 0
3 1 RHPIN VOLUME 3.3K T_SPRING

10uF
6.3V
C 4 21 R2250
EXT_SPK_L+
B Q1103 003:W20 0 R_SPRING 4
2 EXT_SPK
008:V28
2SC3875S(ALY) RLINEIN
5 20
SEDIFF R2251

E B_TERMINAL1 7A
C646
C647
OUTPUT C2139
R2227
RIN SEMAX C2148 C2149

R2224
22uF 15pF 6 19
T_TERMINAL1 6A

R2236
16V 0.1uF 1.6K OPT 1uF OPT 1uF
GND 50V R2229

6.8K
3K
16V 10V

OPT
OPT 10V
VDD AGND 3
7 18 +5V_GENERAL E_SPRING

R2226
OPT

390
C2141 PEJ024-01
C648 C649 0.1uF LIN BYPASS
8 17 JK300

C2142
0.1uF 22uF
16V 16V

10V
1uF
C2145 4.7K
LLINEIN FADE OPT 1uF R2240
9 16
50V
R2230
R2237
LHPIN SHUTDOWN 100
10 15

+24V_AUDIO +24V_AMP PVDD_2 LOUT+ R2239


11 14
9.1K

R2242
4.7K
EXT_SPK_L+
LOUT- PGND_2 C
12 13 003:AF24
003:AF24 EXT_SPK_L-

R2233
B
SUB_MUTE

R2228

1K
L602 Q1105 008:AB19;003:Z25
CB3216PA501E E 2SC3052

1K
NTP3100L
SPK_L+ 003:AK13
SPEAKER_L
+24V_AMP C639
L606 0.01uF

SIGN97
R613 50V
D601 DA-8580

SIGN75
100V 5.6 C635 R617
R625 EAP38319001 R621
OPT 0.1uF 4.7K
3.3 C629 2S 2F 50V
1000pF 3.3
50V C633
0.47uF
C615 C643 50V
0.01uF 1S 1F R622
C602 0.01uF

SIGN73
50V C620 C630 C636 3.3
C625 68uF 1000pF

SIGN76
0.1uF 0.1uF D602 0.1uF R618
50V 50V C640
50V 50V 100V WAFER-ANGLE
OPT R614 4.7K 0.01uF
50V
MLB-201209-0120P-N2

C614 5.6 SPK_L- 003:AK13 L608


+3.3V 22000pF 120-ohm
50V C618 003:AD16 SPK_L+
22000pF 4
50V L609
L605 120-ohm
003:AD14 SPK_L-
PGND1A_2
PGND1A_1

PVDD1A_2
PVDD1A_1
PVDD1B_2
PVDD1B_1

PGND1B_2
PGND1B_1

C619 3
OUT1A_2
OUT1A_1

OUT1B_2
OUT1B_1

SIGN91

1uF L611
16V
VDR1B
BST1B

R601 120-ohm SIGN88


008:AB21 100 003:AD12 SPK_R+
AMP_RST 2
L610
C606 120-ohm SIGN68
56
55
54
53
52
51
50
49
48
47
46
45
44
43

1000pF 003:AD9 SPK_R-


50V 1
008:V26
R603
0 C611
BST1A 1 42 NC C622
SPK_R+ 003:AK12 SPEAKER_R
AUDIO_MASTER_CLK VDR1A VDR2A 16V1uF C624 P600
2 41
1uF 10V RESET BST2A SIGN85 22000pF
3 40
SIGN102

+1.8V_AMP R615 L607 C641


AD PGND2A_2 50V
39 DA-8580

SIGN89
4
MLB-201209-0120P-N2

+1.8V_AMP D603 5.6 0.01uF


DVSS_1 38 PGND2A_1 EAP38319001 C634 C637 R619
C608 5 100V 0.47uF 50V
2S 2F 50V 0.1uF 4.7K R623
MLB-201209-0120P-N2

0.1uF VSS_IO 6 IC600 37 OUT2A_2 OPT C631


1000pF 50V
CLK_I 36 OUT2A_1 50V 3.3
L604 7
C607 VDD_IO 8 35 PVDD2A_2 1S 1F
R600 C604 1000pF R624
L603 50V DGND_PLL EAN60664001 PVDD2A_1 C632
0 9 34 1000pF
SIGN69

100pF D604 3.3


R602 AGND_PLL PVDD2B_2 50V C638 R620
50V 10 33 100V
OPT 0.1uF 4.7K C642
3.3K LFM 11 NTP-3100L 32 PVDD2B_1 R616 0.01uF
50V 50V
AVDD_PLL 12 31 OUT2B_2 5.6
SPK_R- 003:AK12
DVDD_PLL 13 30 OUT2B_1
TEST0 14 29 PGND2B_2
C600 C603 C605
10uF C601 10uF +24V_AMP
0.1uF 0.1uF
15
16
17
18
19
20
21
22
23
24
25
26
27
28

16V 16V
16V 16V
R626
3.3
SCL
DVSS_2

BST2B
SDA
WCK
BCK

FAULT
DVDD

PGND2B_1
VDR2B
SDATA

MONITOR_0
MONITOR_1
MONITOR_2

+1.8V_AMP C644
C626 C645
Mstar Application C627 C628 0.01uF
0.1uF
0.01uF 0.1uF 68uF 50V
50V
50V 50V
C610 C617
10uF 1uF
C613 10V C623
10V 0.1uF
16V
22000pF
50V
R604 100
008:V26 MS_LRCH
R605 100 C616
008:V26 MS_LRCK 33pF
R606 100 50V
008:V26 MS_SCK OPT
R607 100
0 0 8 : A I 4 ; 0 1 0 : B SDA_SUB/AMP
8
R608 100 R627 47K
0 0 8 : A I 4 ; 0 1 0 : B 1SCL_SUB/AMP
0 POWER_DET

C609 C612
33pF 33pF
50V 50V +3.3V_ST

R611
R610 0 10K
C
B R612
R609 Q600 AMP_MUTE
33K OPT 2SC3052 10K
E 008:C13

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 32/37/42 AUO
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Audio Amp 3 14
AMP
+3.5V_ST
+5V_ST_PTC

PStoPDF trial version. http://www.oakdoc.com +5V_ST_PTC


+5V & PANEL POWER Stand-by +3.3V

2010_PWR

2009_PWR
L4012

L4013
4.7K
+3.5V_ST R411 R705
PWR ON 1 2 24V 2010_PWR
L721 OPT
24V 3 4 24V L701 RT1P141C-T112 OPT +5V_ST
Q701 5V_ST
GND GND BG2012B121F R771
5 6 0
GND GND C795 POWER_ON_DELAY
7 8 220uF OPT +5V_ST +3.3V_ST
3.5V 3.5V 16V
3 1 R706
9 10 2010_PWR R703 OPT +12V
10K 0 SIGN192 +5V

2009_PWR
2010_PWR
3.5V 11 12 3.5V C711 R708 2 R751

L4010

L4011
33K 0

CB3216PA501E
GND 13 14 GND INV_ON_DEBUG 15pF OPT RELAY_PTC
50V L715
GND GND/V-sync A_DIM_10
C 004:E14;009:U27 C749 CB3216PA501E
15 16 R702

L729
L708
12V 17 18 INV ON DIM_10 Q700 B 10K OPT
POWER_ON/OFF1 CB3216PA501E IC702
2SC3875S(ALY) 0.1uF C756 C758

SIGN150
12V 19 20 A.DIM ERROR_OUT_10 R752 0 008:AR31;002:AE6;004:T24 AP1117E33G-13
Q706 10uF 0.1uF
12V 21 22 P.DIM1 E +5V_ST AO4813 16V
GND/P.DIM2 Err OUT R701 +5V_GENERAL
23 24 120K +5V_ST L714 IN 3 1 ADJ/GND
P700 OPT CB3216PA501E
2010_PWR R729 S2 1 8 D2_2
FM20020-24 C704 C705 2 C708 C710
OR_RELAY_ON 10K C742
25 C757 10uF 0.1uF 10uF 0.1uF
2009_PWR R25430 004:L14 10uF OPT C760 OUT C2254
G2 2 7 D2_1 10uF 0.1uF 10V 16V 6.3V 16V
FM20020-24 16V
NC PWR ON R747 10V 16V
P701 1 2 10K R730 220uF
GND GND +5V_ST_PTC OPT S1 3 6 D1_2
3 4 +3.3V_ST 560
GND GND C752
5 6 L706 22uF
5.2V 5.2V Q703 G1 4 5 D1_1 16V
7 8 OPT R750 2SC3052 C
+12V 5.2V 9 10 5.2V CB4532UK121E C730 0
C726 R718 B
GND GND 2009_PWR 220uF 22uF 10K R739 C743
L707 11 12 +24V_AUDIO 008:V17;004:Q28
MLB-201209-0120P-N2 2009_PWR 16V 16V 47K 4.7uF
12V 13 14 12V C PANEL_POWER
OPT POWER_ON_DELAY R745 0 R726 E 25V
C731 GND 15 16 GND L704 10K
C728 C722 CB4532UK121E B
22uF C720 24V 24V Q707
0.1uF 47uF 0.1uF 17 18 2SC3052
16V 25V R746 0
50V 50V NC INV ON POWER_ON/OFF1 OPT L728
19 20 C727 C761 C762
OPT C723 R725 4.7uF 4.7uF E CB3216PA501E
A.DIM 21 22 Err OUT C721 68uF 1uF 68uF 008:AR31;002:AE6;004:Q27 +3.3V_AVDD_MPLL
120K 6.3V 6.3V +3.3V_ST
NC PWM_DIM C719 35V 50V 35V OPT OPT OPT
23 24 0.1uF R740
50V 47K
+3.3V R732
22K C748 MSTAR CORE ON
C755

2010_PWR
25 +5V_GENERAL 1uF L703
C794 +3.3V_ST 22uF
25V BLM18PG121SN1D
0.1uF 25V

R741
3.3K
50V 2009_PWR
A_DIM_10 R714 100 R717 C
R728
3.3K C717
R720 10K OPT B Q705
DIM_10 0.1uF
R715 C 10K 2SC3052
INV_ON_DEBUG 6.8K R719 16V
ERROR_OUT_10 L906 Q704
OPT Q702 B 10K R759 0 R727 2SC3052 C E
BLM18PG121SN1D 2SC3052 C 008:AR32 PANEL_CTL
10K B R735
OPT R760 22K
R776 INV_CTL
008:AB20 4.7K A_DIM E Q708 B 10K
C921 2SC3875S(ALY) 008:AR32
ERROR_OUT 37/42INCH 1uF 008:AF11 OPT E
L905

R721
25V 10K
E
OPT

R772 C920 R773


4.7K OPT OPT
0.1uF 0
16V OPT
OPT R775 L907 0 R777
0 PWM_DIM
OPT C922 008:AF11;007:O20;007:Z21
37/42INCH
1uF
L908 25V
OPT 0 R778
32INCH
OPC_OUT
32INCH OPT 007:O20;007:Z21
R774
4.7K

+24V_AUDIO +12V
+5V_EXT
+3.3V L734
CB3216PA501E
L735
CB3216PA501E
008:AR30;004:X17;005:AA6
OPT
OPT OPT R765
+5V 008:AR30;004:AM17;005:AA6
R762 100
POWER_EN
+3.3V_FE 10K Close to IC
POWER_EN 1/10W
C767 OPT

CB3216PA501E
R2550

R756
0 1000pF
L727

OPT
100
BLM18PG121SN1D R763 68K

L716
+3.3V C780
OPT
R1
+5V_ST_PTC 0.1uF IC703

BLM18PG121SN1D
OPT 16V Close to IC
R733 MP2212DN

2009_PWR
10K +5V_EXT

L720
IC706 Close to IC
74LVC1G32GW R761 FB EN/SYNC
Vout=0.8*(1+R1/R2) 1 8
13K
1/8W L737
OPT B VCC IC704 1uF
1% R2
GND SW_2 3.6uH
RL_ON 1 5 C411 R770 Close to IC MP2212DN OPT 2 7
82K 10V
008:AR33 R25410 560pF 56K R1 R422 C412 OPT
1/10W OPT OPT OPT
OPT A 50V 1% IN SW_1 C771
RELAY_PTC 2 OPT FB EN/SYNC 3 6 C772 C773
004:Q27;009:U27 R25400 1 8 22uF 0.1uF 0.1uF
Placed on SMD-TOP 16V
R769 L710 16V 16V
GND Y 18K D704 OPT BS VCC 3216
3 4 OPT OR_RELAY_ON R2 3.6uH 4 5 C770
1/10W GND SW_2 C763 C764 0.1uF OPT
R25420 2 7 Placed on SMD-TOP 100V 50V PI Result
004:Q26 1% 22uF 22uF OPT
R421 NR8040T3R6N 16V 16V 1N4148W_DIODES
100K OPT OPT R764 +5V_GENERAL
IN SW_1 C751 C750 0
3 6 5% C746 22uF
10uF 0.1uF OPT R767 OPT
C2253 6.3V 16V 16V
0.1uF D700 OPT BS VCC C741 10K
16V 4 5 0.1uF R766 OPT
C768
C732 C733 100V 50V
1uF 10
22uF 22uF 1N4148W_DIODES 10V
OPT
16V OPT R737 +5V_GENERAL +5V_EXT

R734 0
Placed on SMD-TOP
L736
10 C737 CB3216PA501E
1/10W 1uF
1% 10V
C765 C766 C769
10uF 0.1uF 1uF
10V 16V 10V

+1.26 Core for Saturn5


+5V_GENERAL
465 mA @85% efficiency
+5V_ST ON

+3.3V
+1.8V for Saturn5 DDR +3.3V
+1.8V_DDR
IC701
SC4215ISTRT CB3216PA501E
L711 R738 MAX 3A +5V_ST
1/10W +5V_ST_PTC +5V_ST_PTC
BLM18PG121SN1D NC_1 GND R711
OPT 10K +1.26V_VDDC
1 8 12K R731
L702
1%
R710 10K C790
3.3K EN ADJ 1/10W Close to IC 0.1uF 2009_PWR
2 7 Vout=0.8*(1+R1/R2) 16V OPT Q404
R736 24K AO4813
Close to IC IC705 1/8W
1600 mA
VIN VO R723
3 6 MP2212DN 2009_PWR S2 1 8 D2_2
22K
R1 R414 C405
1/10W $0.07 22K C406
NC_2 NC_3 R713 C714 C715 1% 4.9A 0.0150OHM 34MHZ 2.2uF 100uF
4 5 25V G2 2 7 D2_1
C712 C713 9.1K 22uF 0.1uF FB EN/SYNC 3A, DCR=0.025 ohm 16V
1 8 C407
10uF 0.1uF 1% 16V 16V R722 220uF
10V 75K L726 16V

R412
16V L717 S1 3 6 D1_2
R2 2009_PWR

OPT
1/8W 3.6uH BLM18PG121SN1D R415

1K
GND SW_2
1% 2 7 2.2K
$0.24 G1 4 5 D1_1
2009_PWR
R1/R2 : 27K / 20K => Vout=1.88 NR8040T3R6N Q403
C OUT C
R1/R2 : 15K / 12K => Vout=1.80 IN SW_1 2SC3875S(ALY)
Placed on SMD-TOP 3 6 C793 002:AE6;002:AG13;009:N27
R1/R2 : 12K / 9.1K => Vout=1.85 C791 C792 0.1uF B
MSTAR_POWER_ON
22uF 22uF R413
D703 OPT BS VCC 16V 16V 10K
4 5 C789 E
C IN C786 C787 0.1uF
22uF 100V 50V
22uF Placed on SMD-TOP
OPT 1N4148W_DIODES
R744

R724 0

10
C788
1uF
16V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 37LH250H 09.05.19
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Power 4 14
PStoPDF
TUNERtrial version. http://www.oakdoc.com LGDT3305
+5V_TU

L1003
500

C1007 C1005 C1011 C1013 C2250


C1008
0.01uF 0.1uF 0.1uF 10uF 220uF 220uF
TU1001 25V 50V 50V 10V 16V 16V
+3.3V_AVDD_PVSB
TDVW-H104P
+5V_TU
1N4148W
NC_1 R1074 D1000
1 47K
NC_2 C1071 C1072
2 27pF X1005 27pF
C1073 R1075 VSB_RESET
GND_1 OPT
3 1uF
R1013 R1017 25MHz 10V
+B1[5V]
4 4.7K 4.7K
OPT Close to tuner R1072 1M
RF_AGC C1027
5 100pF +3.3V_AVDD_PVSB
GND_2 50V (I2C Channel 6)
6

R1073 0
R1023 22 R1026 0 FE_TUNER_SDA +1.2V_DVDD_PVSB
DATA +3.3V_DVDD_PVSB
7
R1022 22 R1027 0 FE_TUNER_SCL
CLOCK L1219
8 OPT CB3216PA501E
C1015 C1017 OPT
AS R1031 0 C1024 C1025 0 L1013
9 100pF 100pF 27pF
50V 50V 27pF IF_N
DIF[+] OPT 50V 50V 1/10W C2138
10 5% 0.1uF
DIF[-] R1032 R1068 50V
0

48
47
46
45
44
43
42
41
40
39
38
37
11 5.1K
R1033 C1006 OPT
IF_AGC 0 47pF L1002

XM

VSS33
VSS

XTALI
VDD

OPM
NRST
VDD33
VSSAD10

XTALO

SLIM_SCAN
VCCAAD10A
12 270nH
SIF IF_AGC 1 36
C1069 VROA PLLAVSS
13 R1061 100 2 35
0 L1014 0.01uF PLLAVDD
IF_P VINA2
14
NC_3 +5V_TU IF_P 0.01uF C1070 3 34
L1004 6.8uH IF_N VINA1 VSS33
1/10W R1062 100 4 33
AUDIF
15 5%
5
INCAP
IC1004 VSS
32
VSSAAD10A VDD
VIDEO R1007 0 . 1 u FC1068 R1064 100
16 12K
R1010
470
6
I2CSEL LGDT3305 VSS
31
R1009 R1003 OPT 0 7 30 22 R1077
OPT 0 0 R1065 ANTCON SCL
17 FE_SIF 8 29 FE_DEMOD_SCL
VDD VDD33
R1066 9 28 22 R1078
C1009 OPT I2CRPT_SCL SDA
0.01uF E 10 27 FE_DEMOD_SDA
SHIELD 50V R1067 OPT I2CRPT_SDA NIRQ
SIGN273 11 26
ISA1530AC1 IF_AGC IF OUT TPSOP
B Q1000 R1060 R1063 1K 12 25

TPDATA[0]

TPDATA[1]

TPDATA[2]
TPDATA[3]

TPDATA[4]
TPDATA[5]

TPDATA[6]

TPDATA[7]
1K RF OUT TPCLK
R1008

TPVALID
C R1076

VSS33
TPERR

VDD33
10K OPT
C1066 C1067

13
14
15
16
17
18
19
20
21
22
23
24
R1004 0.1uF 0.1uF
2.2K +3.3V_DVDD_PVSB
OPT AR1079
100
1/16W
0.1uF
470
SIFMO TS_SYNC
R1016 R1069
C1021 LD1000 TS_CLK
47 OPT
OPT +5V_TU TS_VALID

MStar Option

50V
C1014
0.1uF
R1019
270 R1021 AR1070 100
R1005 R1018
0 0 OPT 0 FE_VMAIN TS_0
008:D24 TS_0
TS_1 TS_1
R1020 TS_2 TS_2
270
L1001
FM Rejection Option TS_3 TS_3

ISA1530AC1 E
Q1001 AR1071 100
TS_4
TS_4
TS_5
B C1004 TS_5
82pF TS_6
C TS_6
50V TS_7
R1006 TS_7
10K C1012
0.047uF
OPT 50V

VCOMO

MStar Option The value of coil & cap’ could be changed to optimized each

Mercury Option LGDT3305 POWER


TUNER 5V
+5V_GENERAL
OPT
IC1001 +3.3V_PVSB +3.3V_FE
L1000 SC156515M-1.8TR
MLB-201209-0120P-N2 L1005
OPT 500

VIN VO
VSB +3.3V B+ BLOCK
2 4
R1001
4.7K OPT R1014 +3.3V_PVSB +3.3V_AVDD_PVSB +3.3V_PVSB
R1002 OPT +3.3V_DVDD_PVSB
VSB_CTRL OPT 1K EN ADJ 15K
1 5
GND2

R1015 L1007
OPT L1008
IC1002 3 8.2K 500 500
KIA78R05F C1002 C1003 C1018 C1020
100uF 0.1uF GND 100uF 0.1uF C1023 C1026 C1028 C1030 C1032 C1033
6 16V 50V 16V 50V 10uF 0.1uF 10uF 0.1uF 0.1uF 0.1uF
OPT OPT
16V 50V 16V 50V 50V 50V
3216 3216

1 2 3 4 5
PANEL_POWER
VIN

+5V_TU
VC

NC

GND1
VOUT

L1012
IC1003 008:AR30;004:X17;004:AM17
AS7809DTRE1 POWER_EN
IC1000
INPUT 1 3 OUTPUT
L1010
BG2012B800
R1028
100 SC4215ISTRT VSB +1.0V B+ BLOCK
2 OPT
OPT R1035 +1.2V_PVSB +1.2V_PVSB +1.2V_DVDD_PVSB
C1081 C1082 C1034 C1035 C1036 C1037 C1040 C1041 100 NC_1 GND
GND C1039
0.1uF 100uF 0.1uF 100uF 0.33uF 0.1uF 0.1uF 0.01uF OPT 1 8
16V 16V 47uF
16V 16V 16V 16V 16V 25V R1011
R1036 20K R2
20K EN ADJ R1034
2 7 0
R1012
C1076 10K R1
1uF VIN VO 1/4W
16V 3 6 5% C1043 C1044
C1038 0.1uF
V0 = 0.8(R1+R2) / R2 10uF 0.1uF
C1019 16V 50V 50V
NC_2 NC_3 C1079
C1077 C1078 4 5 100uF 0.1uF
2.2uF 2.2uF 16V 50V 3216
25V 25V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 37LH250H 09.05.19
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Tuner/3305 5 14
UNER
PStoPDF trial version. http://www.oakdoc.com
DDR DDR2 1.8V By CAP - Place these Caps near Memory

+1.8V_DDR +1.8V_S_DDR
L1
BLM18PG121SN1D

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF
0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF
10uF
C1 C22

0.1uF

0.1uF
10uF
10uF

10uF

C24

C27

C30

C31

C32

C33

C34

C35

C36

C37

C38

C39

C41
C23

C25

C29

C43
C13
0.1uF 0.1uF

C10

C11

C12

C14

C15

C17

C19

C20

C21
C3

C5

C6

C7

C8

C9
+1.8V_S_DDR
+1.8V_S_DDR +1.8V_S_DDR

1K 1%

1K 1%

R47

1%
R23

1K
R4

0.1uF
0.1uF
1000pF

1K 1%

1%
1G_HYNIX 512M_HYNIX

1000pF
C40 C42
IC100

R24

R44
IC1 IC2

1%
0 . 1 u F 1000pF

1K
1K

C18
C16
HY5PS1G1631CFP-S6 LGE3369A (SATURN6 NON RM) H5PS5162FFR-S6C

R5
C4
C2
SDDR_D[0] DQ0 G8 J2 VREF AR1 D15 VREF J2 G8 DQ0 TDDR_D[0]
SDDR_A[5] ADDR2_A[5] A_MVREF
SDDR_D[1] DQ1 G2 AR13 G2 DQ1 TDDR_D[1]
SDDR_A[3] ADDR2_A[3] BDDR2_A[9] TDDR_A[9]
SDDR_D[2] DQ2 H7 H7 DQ2 TDDR_D[2]
M8 A0 SDDR_A[0] SDDR_A[1] ADDR2_A[1] ADDR2_A[0] C13 T26 BDDR2_A[0] BDDR2_A[3] TDDR_A[3] TDDR_A[0] A0 M8
SDDR_D[3] DQ3 H3 A_DDR2_A0 B_DDR2_A0 H3 DQ3 TDDR_D[3]
A1 SDDR_A[1] SDDR_A[10] 56 56 ADDR2_A[10] ADDR2_A[1] A22 AF26 BDDR2_A[1] BDDR2_A[1] TDDR_A[1] TDDR_A[1] A1
DQ4 M3 M3 DQ4
SDDR_D[4] H1 A_DDR2_A1 B_DDR2_A1 H1 TDDR_D[4]
A2 SDDR_A[2] ADDR2_A[2] B13 T25 BDDR2_A[2] BDDR2_A[10] 56 TDDR_A[10] TDDR_A[2] A2

SDDR_A[0-12]
M7 M7

TDDR_D[0-15]
DQ5 AR3 DQ5

ADDR2_A[0-12]
SDDR_D[5] H9 A_DDR2_A2 B_DDR2_A2 H9 TDDR_D[5]
SDDR_D[0-15]

A3 SDDR_A[3] ADDR2_A[3] C22 AF23 BDDR2_A[3] AR12 TDDR_A[3] A3


DQ6 N2 SDDR_A[9] ADDR2_A[9] N2 DQ6
SDDR_D[6] F1 A_DDR2_A3 B_DDR2_A3 F1 TDDR_D[6]
N8 A4 SDDR_A[4] SDDR_A[12] ADDR2_A[12] ADDR2_A[4] A13 T24 BDDR2_A[4] TDDR_A[4] A4 N8
BDDR2_A[5] TDDR_A[5]

TDDR_A[0-12]
DQ7 DQ7

BDDR2_A[0-12]
SDDR_D[7] F9 A_DDR2_A4 B_DDR2_A4 F9 TDDR_D[7]
N3 A5 SDDR_A[5] SDDR_A[7] ADDR2_A[7] ADDR2_A[5] A23 AE23 BDDR2_A[5] TDDR_A[5] A5 N3
SDDR_D[8] DQ8 A_DDR2_A5 B_DDR2_A5 BDDR2_A[12] TDDR_A[12] DQ8 TDDR_D[8]
C8 A6 AR2 C12 R26 BDDR2_A[6] A6 C8
N7 SDDR_A[6] ADDR2_A[6] BDDR2_A[7] 56 TDDR_A[7] TDDR_A[6] N7
SDDR_D[9] DQ9 C2 SDDR_A[0] ADDR2_A[0] A_DDR2_A6 B_DDR2_A6 C2 DQ9 TDDR_D[9]
P2 A7 SDDR_A[7] ADDR2_A[7] B23 AD22 BDDR2_A[7] AR14 TDDR_A[7] A7 P2
SDDR_D[10] DQ10 D7 SDDR_A[2] ADDR2_A[2] A_DDR2_A7 B_DDR2_A7 BDDR2_A[0] TDDR_A[0] D7 DQ10 TDDR_D[10]
P8 A8 SDDR_A[8] ADDR2_A[8] B12 R25 BDDR2_A[8] TDDR_A[8] A8 P8
SDDR_D[11] DQ11 D3 SDDR_A[4] ADDR2_A[4] A_DDR2_A8 B_DDR2_A8 BDDR2_A[2] TDDR_A[2] D3 DQ11 TDDR_D[11]
P3 A9 SDDR_A[9] ADDR2_A[9] C23 AC22 BDDR2_A[9] TDDR_A[9] A9 P3
SDDR_D[12] DQ12 D1 SDDR_A[6] 56 ADDR2_A[6] A_DDR2_A9 B_DDR2_A9 BDDR2_A[4] TDDR_A[4] D1 DQ12 TDDR_D[12]
M2 A10/AP SDDR_A[10] ADDR2_A[10] B22 AD23 BDDR2_A[10] TDDR_A[10] A10/AP M2
SDDR_D[13] DQ13 SDDR_A[11] R21 56 ADDR2_A[11] A_DDR2_A10 B_DDR2_A10 BDDR2_A[6] 56 TDDR_A[6] DQ13 TDDR_D[13]
D9 A11 D9
P7 SDDR_A[11] ADDR2_A[11] A12 R24 BDDR2_A[11] TDDR_A[11] A11 P7
SDDR_D[14] DQ14 B1 SDDR_A[8] R22 56 ADDR2_A[8] A_DDR2_A11 B_DDR2_A11 BDDR2_A[11] R27 56 TDDR_A[11] B1 DQ14 TDDR_D[14]
R2 A12 SDDR_A[12] ADDR2_A[12] A24 AE22 BDDR2_A[12] TDDR_A[12] A12 R2
SDDR_D[15] DQ15 B9 A_DDR2_A12 B_DDR2_A12 BDDR2_A[8] R28 56 TDDR_A[8] B9 DQ15 TDDR_D[15]
+1.8V_S_DDR
+1.8V_S_DDR
L2 BA0 SDDR_BA[0] R6 56 ADDR2_BA[0] C24 AC23 BDDR2_BA[0] R29 56 TDDR_BA[0] BA0 L2
A_DDR2_BA0 B_DDR2_BA0
L3 BA1 SDDR_BA[1] R7 56 ADDR2_BA[1] B24 AC24 BDDR2_BA[1] R30 56 TDDR_BA[1] BA1 L3
VDD5 A1 A_DDR2_BA1 B_DDR2_BA1 A1 VDD5
L1 BA2 R49 0 ADDR2_BA[2] D24 AB22 BDDR2_BA[2] R50 OPT 0 TDDR_BA[2]
VDD4 E1 A_DDR2_BA2 B_DDR2_BA2 E1 VDD4
SDDR_CK R8 33 ADDR2_MCLK B14 V25 BDDR2_MCLK R31 33 TDDR_MCLK
VDD3 J9 A_DDR2_MCLK B_DDR2_MCLK CK J8 J9 VDD3
OPT

OPT
R45
VDD2 CK CK VDD2
150

150
M9 J8 K8 M9
R2

VDD1 R1 K8 CK R9 33 /ADDR2_MCLK A14 V24 /BDDR2_MCLK R32 33 CKE K2 R1 VDD1


/A_DDR2_MCLK /B_DDR2_MCLK
K2 CKE SDDR_CKE R10 56 ADDR2_CKE D23 AB23 BDDR2_CKE R33 56 TDDR_CKE
A_DDR2_CKE B_DDR2_CKE
ODT K9
VDDQ10 A9 K9 ODT SDDR_ODT R11 56 ADDR2_ODT D14 U26 BDDR2_ODT R34 56 CS L8 A9 VDDQ10
A_DDR2_ODT B_DDR2_ODT
VDDQ9 C1 L8 CS RAS K7 C1 VDDQ9
VDDQ8 C3 K7 RAS /SDDR_RAS R12 56 /ADDR2_RAS D13 U25 /BDDR2_RAS R35 56 CAS L7 C3 VDDQ8
/A_DDR2_RAS /B_DDR2_RAS
VDDQ7 C7 L7 CAS /SDDR_CAS R13 56 /ADDR2_CAS D12 U24 /BDDR2_CAS R36 56 WE K3 C7 VDDQ7
/A_DDR2_CAS /B_DDR2_CAS
VDDQ6 C9 K3 WE /SDDR_WE R14 56 /ADDR2_WE D22 AB24 /BDDR2_WE R37 56 /TDDR_WE C9 VDDQ6
/A_DDR2_WE /B_DDR2_WE
VDDQ5 E9 E9 VDDQ5
LDQS F7
VDDQ4 G1 G1 VDDQ4
F7 LDQS SDDR_DQS0_P R15 56 ADDR2_DQS0_P B18 AB26 BDDR2_DQS0_P R38 56 UDQS B7
VDDQ3 G3 A_DDR2_DQS0 B_DDR2_DQS0 G3 VDDQ3
B7 UDQS SDDR_DQS1_P R16 56 ADDR2_DQS1_P C17 AA26 BDDR2_DQS1_P R39 56
VDDQ2 G7 A_DDR2_DQS1 B_DDR2_DQS1 G7 VDDQ2
VDDQ1 G9 LDM F3 G9 VDDQ1
F3 LDM SDDR_DQM0_P R17 56 ADDR2_DQM0_P C18 AC25 BDDR2_DQM0_P R40 56 UDM B3
A_DDR2_DQM0 B_DDR2_DQM0
B3 UDM SDDR_DQM1_P R18 56 ADDR2_DQM1_P A19 AC26 BDDR2_DQM1_P R41 56TDDR_DQM1_P
A_DDR2_DQM1 B_DDR2_DQM1
VSS5 A3 LDQS E8 A3 VSS5
VSS4 E3 E8 LDQS SDDR_DQS0_N R19 56 ADDR2_DQS0_N A18 AB25 BDDR2_DQS0_N R42 56 UDQS A8 E3 VSS4
A_DDR2_DQSB0 B_DDR2_DQSB0
VSS3 J3 A8 UDQS SDDR_DQS1_N R20 56 ADDR2_DQS1_N B17 AA25 BDDR2_DQS1_N R43 56TDDR_DQS1_N J3 VSS3
A_DDR2_DQSB1 B_DDR2_DQSB1
VSS2 N1 N1 VSS2
AR4 AR10 NC4 L1
VSS1 P9 SDDR_D[11] ADDR2_D[11] ADDR2_D[0] B15 W25 BDDR2_D[0] BDDR2_D[11] TDDR_D[11] P9 VSS1
R3 NC5 A_DDR2_DQ0 B_DDR2_DQ0 NC5 R3
SDDR_D[12] ADDR2_D[12] ADDR2_D[1] A21 AE26 BDDR2_D[1] BDDR2_D[12] TDDR_D[12]
R7 NC6 A_DDR2_DQ1 B_DDR2_DQ1 NC6 R7
SDDR_D[9] ADDR2_D[9] ADDR2_D[2] A15 W24 BDDR2_D[2] BDDR2_D[9] TDDR_D[9] R51
A_DDR2_DQ2 B_DDR2_DQ2 0
OPT SDDR_D[14] 56 ADDR2_D[14] ADDR2_D[3] B21 AF24 BDDR2_D[3] BDDR2_D[14] TDDR_D[14]
VSSQ10 B2 A_DDR2_DQ3 B_DDR2_DQ3 AR8 B2 VSSQ10
NC1 R48 AR6 ADDR2_D[4] C21 AF25 BDDR2_D[4] 56 NC1
VSSQ9 A2 SDDR_D[4] ADDR2_D[4] BDDR2_D[4] TDDR_D[4] A2 VSSQ9
B8 0 A_DDR2_DQ4 B_DDR2_DQ4 B8
NC2 ADDR2_D[5] C14 V26 BDDR2_D[5] NC2

BDDR2_D[0-15]
VSSQ8 E2 SDDR_D[3] ADDR2_D[3] BDDR2_D[3] TDDR_D[3] E2 VSSQ8
A7 A_DDR2_DQ5 B_DDR2_DQ5 A7
ADDR2_D[0-15]

R8 NC3 ADDR2_D[6] C20 AE25 BDDR2_D[6] NC3 R8


VSSQ7 SDDR_D[1] ADDR2_D[1] A_DDR2_DQ6 B_DDR2_DQ6 BDDR2_D[1] TDDR_D[1] VSSQ7
D2 C15 W26 D2
SDDR_D[6] 56 ADDR2_D[6] ADDR2_D[7] BDDR2_D[7] BDDR2_D[6] 56 TDDR_D[6]
VSSQ6 D8 A_DDR2_DQ7 B_DDR2_DQ7 D8 VSSQ6
AR5 ADDR2_D[8] C16 Y26 BDDR2_D[8] AR11
VSSQ5 SDDR_D[15] ADDR2_D[15] A_DDR2_DQ8 B_DDR2_DQ8 BDDR2_D[15] TDDR_D[15] +1.8V_S_DDR VSSQ5
E7 J7 VSSDL C19 AD25 VSSDL J7 E7
ADDR2_D[9] BDDR2_D[9]
VSSQ4 F2 SDDR_D[8] ADDR2_D[8] A_DDR2_DQ9 B_DDR2_DQ9 BDDR2_D[8] TDDR_D[8] F2 VSSQ4
+1.8V_S_DDR ADDR2_D[10] B16 Y25 BDDR2_D[10]
VSSQ3 F8 SDDR_D[10] ADDR2_D[10] A_DDR2_DQ10 B_DDR2_DQ10 BDDR2_D[10] TDDR_D[10] F8 VSSQ3
ADDR2_D[11] B20 AE24 BDDR2_D[11]
VSSQ2 H2 SDDR_D[13] 56 ADDR2_D[13] A_DDR2_DQ11 B_DDR2_DQ11 BDDR2_D[13] TDDR_D[13] H2 VSSQ2
AR7 ADDR2_D[12] A20 AD26 BDDR2_D[12] AR9 56
VSSQ1 H8 J1 VDDL A_DDR2_DQ12 B_DDR2_DQ12 VDDL J1 H8 VSSQ1
SDDR_D[7] ADDR2_D[7] ADDR2_D[13] A16 Y24 BDDR2_D[13] BDDR2_D[7] TDDR_D[7]
SDDR_D[0] ADDR2_D[0] A_DDR2_DQ13 B_DDR2_DQ13 BDDR2_D[0] TDDR_D[0]
ADDR2_D[14] B19 AD24 BDDR2_D[14]
SDDR_D[2] ADDR2_D[2] A_DDR2_DQ14 B_DDR2_DQ14 BDDR2_D[2] TDDR_D[2]
ADDR2_D[15] A17 AA24 BDDR2_D[15]
SDDR_D[5] ADDR2_D[5] A_DDR2_DQ15 B_DDR2_DQ15 BDDR2_D[5] 56 TDDR_D[5]
56

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 37LH250H 09.05.19
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. DDR2 6 14
DDR
PStoPDF trial version. http://www.oakdoc.com
LVDS

FHD
P801
TF05-51S

+3.3V_ST 52

51

OPT 50
R862
10K 49

Except FHD 48

R863 0
P800 OPT 47
FI-X30SSL-HF
46
008:AR30;007:O14 OPT
LVDS_SEL 45
0 R841
GND OPT
1 PWM_DIM 44
0 R840
OPT
2 43
OPC_OUT 0 R842
OPT
3 OPC_EN 42
0 R843
4 R858 0 41
PWM_DIM 008:AF11;004:M20;007:Z21
OPT
5 R857 0 40
OPC_OUT 004:M19;007:Z21
OPT TXA4+[0]
6 39
TXA4-[1]
7 LVDS_TXA3+ 38
TXA3+[2]
0 R847 8 37
TXA1-[9] LVDS_TXA3+ LVDS_TXA3-
Except FHD TXA3-[3]
0 R848 9 36
TXA1+[8] LVDS_TXA3-
Except FHD TXAC+[4]
10 LVDS_TXAC+ 35
TXAC-[5]
TXA2-[7] 0 R849 11 34
LVDS_TXAC+ LVDS_TXAC-
Except FHD
0 R850 12 33
TXA2+[6] LVDS_TXAC-
Except FHD TXA2+[6]
13 LVDS_TXA2+ 32
0 R851 TXA2-[7]
TXAC-[5] LVDS_TXA2+ 14 LVDS_TXA2- 31
Except FHD
0 R852 15 30
TXAC+[4] LVDS_TXA2-
Except FHD TXA1+[8]
16 LVDS_TXA1+ 29

0 R853 TXA1-[9]
TXA3-[3] LVDS_TXA1+ 17 LVDS_TXA1- 28
Except FHD
R854 TXA0+[10]
TXA3+[2] 0 LVDS_TXA1- 18 27
Except FHD TXA0-[11] 0 R844
19 LVDS_TXA0+ BIT_SEL 26
OPT
0 R855 R845 0
TXA4-[1] LVDS_TXA0+ 20 LVDS_TXA0- 25
Except FHD
0 R856 21 24
TXA4+[0] LVDS_TXA0-
Except FHD TXB4+[0]
R859 0
22 OPC_EN 23
008:AQ28;007:Z20
OPT TXB4-[1]
23 R860 0 008:AR30;007:Z21 22
LVDS_SEL
OPT +3.3V_ST TXB3+[2]
24 21

R861 10K
TXB3-[3]
25 20

OPT
TXBC+[4]
26 19
TXBC-[5]
27 18
PANEL_POWER
0
28 17
R4000

TXB2+[6]
OPT

29 16
TXB2-[7]
30 15

31 14
GND TXB1+[8]
32 13
TXB1-[9]
33 12
TXB0+[10]
11
TXB0-[11]
10

3
PANEL_POWER
2

25V

1000pF
0.1uF
OPT

C2257
C2258
C2259
22uF
GAS1
MDS61887701

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 37LH250H 09.05.19
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. LVDS 7 14
+3.3V
+3.3V_VDDP

PStoPDF trial version. http://www.oakdoc.com +1.26V_VDDC

C164
0.1uF
C167
0.1uF
C170
0.1uF
C173
0.1uF
C176
0.1uF
C179
0.1uF
C184
0.1uF
C189
0.1uF
L101
BLM18PG121SN1D

C195
0.1uF
C196
0.1uF
TXB0+[10],TXB0-[11],TXB1+[8],TXB1-[9],TXB2+[6],TXB2-[7],TXB3+[2],TXB3-[3],TXB4+[0],TXB4-[1],TXBC+[4],TXBC-[5]
C163 C166 C169 C172 C175 C178 C183 C188 C193 C198 C2104 C2109 C2115 C2119 C2120 C2123 C2124 C2125 C2126 C2127 C2128 C2129 C2130 C2131 C2132 C2133 C2134 C2135 C2136 C2137
330uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF

FHD LVDS
OPT
IC100
LGE3369A (SATURN6 NON RM) AR104 TXB3-[3]
22 TXB3+[2] +1.8V_DDR
FHD TXB4-[1]

002:H22 F1 RXACKP AE16 TXB4+[0]


CK+_HDMI1 LVA0P AR105 TXB2-[7]
002:H22 F2 RXACKN AD16 C2105
CK-_HDMI1 LVA0M 22 C165 C168 C171 C174 C177 C180 C185 C190 C194 C199 C2110 C2111
G2 AD15 TXB2+[6] 0.1uF
002:H21 RXA0P FHD 330uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 10uF
D0+_HDMI1 LVA1P TXBC-[5]
002:H22 G3 RXA0N AF16 OPT
D0-_HDMI1 LVA1M TXBC+[4]
002:H20 H3 RXA1P AF15
D1+_HDMI1 LVA2P AR106 TXB0-[11]
G1 AE15 S6_Reset 008:X13
D1-_HDMI1 002:H21 RXA1N
LVA2M 22 TXB0+[10]
IC100
002:H19 H1 RXA2P AD13
D2+_HDMI1 LVA3P FHD TXB1-[9] LGE3369A (SATURN6 NON RM)
002:H20 H2 RXA2N AF14 C186 20pF IC100 +1.26V_VDDC
D2-_HDMI1 LVA3M TXB1+[8]
R2113 0 A1 DDCD_A_DA AF13 LGE3369A (SATURN6 NON RM)
DDC_SDA_1 002:H24;002:R20 R252
LVA4P PCM_D[5-7]
002:H23;002:R21 R2114 0 B2 DDCD_A_CK AE13 1M X100
DDC_SCL_1 LVA4M D4 HWRESET B3 12MHz
002:I25 R2115 100 A2 HOTPLUG_A XIN
HPD1 A3 R231 0 C187 20pF E16 D16
AE14 XOUT GND_2 VDDC_1
LVACKP AC16 E17 D17
002:H9 C3 AD14 PCMD0/CI_D0 GND_3 VDDC_2
CK+_HDMI2 RXBCKP LVACKM AA15 E6 R232 0 E18 VDDC_3 D18
002:H9 B1 RXBCKN PCMD1/CI_D1 TESTPIN/GND GND_4
CK-_HDMI2 AA16 F7 D19
002:H8 C1 AE20 PCMD2/CI_D2 GND_5 VDDC_4
D0+_HDMI2 RXB0P AC6
LVB0P L9 VDDC_5 D20
002:H9 C2 RXB0N AD20 PCMD3/CI_D3 GND_6
HDMI 1/2

D0-_HDMI2 LVB0M Y10 AE11 R225 33 008:I9 SPI_DI L10 H18


D2 AD19 PCMD4/CI_D4 SPI_DI VDDC_6
D1+_HDMI2 002:H7 RXB1P Y11 AF12 GND_7
LVB1P AR107 TXA3-[3] PCM_D[5] 008:E10 SPI_DO L11 VDDC_7 H19
002:H8 D3 RXB1N AF20 PCMD5/CI_D5 SPI_DO GND_8
D1-_HDMI2 LVB1M 22 TXA3+[2] PCM_D[6] Y12 AE12 R226 33 008:E10 SPI_CS H20
E3 RXB2P AF19 PCMD6/CI_D6 /SPI_CS VDDC_8
D2+_HDMI2 002:H6 Y13 AD11
LVB2P TXA4-[1] PCM_A[0-7,10-11] PCM_D[7] R227 33 008:I9 SPI_CK VDDC_9 J20
002:H7 D1 RXB2N AE19 PCMD7/CI_D7 SPI_CK
D2-_HDMI2 LVB2M TXA4+[0] L12 K20
002:H11;002:R7 R2116 0 E1 DDCD_B_DA AD17 GND_9 VDDC_10
DDC_SDA_2 LVB3P PCM_A[0] AB16
AR108 TXA2-[7] L13 VDDC_11 L20
002:H10;002:S7 R2117 0 F3 DDCD_B_CK AF18 PCM_A[1] PCM_A0/CI_A0 GND_10
DDC_SCL_2 LVB3M 22 TXA2+[6] AC15 L14 M20
002:I12 R2118 100 E2 HOTPLUG_B AF17 PCM_A1/CI_A1 GND_11 VDDC_12
HPD2 LVB4P PCM_A[2] AC14
TXAC-[5] L15 VDDC_13 P7
AE17 PCM_A[3] PCM_A2/CI_A2 GND_12
LVB4M AB14 L16 R7
AE8
AD8
RXCCKP
RXCCKN LVBCKP
AE18 AR109
TXAC+[4]
TXA0-[11]
PCM_A[4]
PCM_A[5]
AC12
AB8
PCM_A3/CI_A3
PCM_A4/CI_A4 USB_DP_1
B5
A5
R801 0
R802 0
USB L17
L18
GND_13
GND_14
VDDC_14
VDDC_15 T7
T22
AD9 AD18 22 TXA0+[10] PCM_A5/CI_A5 USB_DM_1 GND_15
RXC0P PCM_A[6] AC13 AC10 VDDC_16
LVBCKM TXA1-[9] R233 0 M9 GND_16