Quantum Theory
Wave – Particle Duality Model
Most accepted structural model of the electron
In this model, the electron sometime behaves like a wave and sometimes behave like a particle but do not
behave both particle and wave at the same time
For example, electron behaves like a particle if you touch an object. You can feel material since it’s a particle.
The electron becomes wavelike if used on the operation of cathode ray tubes in TVs
Implication of Wave Particle Duality
Since electrons sometimes behave in a wavelike property, we can only determine the most probable position an
electron can be at a given time
Comparison of the (a) Bohr atom and (b) wave mechanical atom models in
terms of electron distribution.
From classical physics, the total resultant force is the sum of all the forces
acting on the particle. In this case, the resultant force is the sum of the
repulsive and attractive forces or
F resultant = F repulsive + F attractive
Therefore at the state of equilibrium, the resultant force is zero
Bonding Energy
Energy Eo required to separate 2 atoms to an infinite or very long distance
The bonding energy is dependent on the type of atomic bonding the atoms have
This implies that high bonding energies have high melting point/temperature
Solid substances are formed if there is high bonding energy
Gaseous State is favored for low bonding energy
PRIMARY INTERATOMIC BONDS
Ionic Bonds
Covalent Bonds
Metallic Bonds
Ionic Bonding
Type of chemical bond formed through an electrostatic attraction
between two oppositely charged ions.
Ionic bonds are formed between a cation, which is usually a metal, and
an anion, which is usually a nonmetal. Atoms of a metallic element
easily give up their valence electrons to the nonmetallic atoms. In the
process all the atoms acquire stable or inert gas configurations and
they become ions
Metallic Bond
Bond existing in metals wherein the electrons are freely roaming on the metal
Since the electrons are freely roaming, the electrons can be stated as “electron
clouds” inside the materials
Metallic bonding showing electron clouds
Secondary Bonding or Van der Waals Bonding. The Figure shows the schematic
representation of polar hydrogen chloride molecule. The hydrogen parts maybe
considered the positive part while the chlorine side denotes the negative part
Diamond have covalent bonds which are very stable. This is the reason why diamonds are very hard to
fracture
Metals are good conductors of electricity and heat because the electrons can freely move from one atom to
another
In contrast, ionic and covalent bonded materials are insulators due to lack of freely moving electrons
Knowledge Application - Volume Expansion of Water upon Freezing
The arrangement of water molecules in (a) solid ice, and (b) liquid water. In solid ice, the oxygen
molecule can combine with 2 other hydrogen atoms from nearby water molecule. This forms a
structure that is less dense than that of liquid water wherein there is less structure and thus,
molecules can pack more together
Crystalline Materials
A crystalline material is one in which the atoms are situated in a repeating or periodic array
over large atomic distances
All metals, many ceramic materials, and certain polymers form crystalline structures under normal solidification
conditions
Non-crystalline or amorphous materials have small or no repeating structures
Unit Cell
Basic structural unit or building block of the crystal structure and defines the crystal structure by virtue of its
geometry and the atom positions within
The atoms are located at the corners and center of the cubes faces
Structure of most metals Cu, Ag, Au, Al
Unit cell edge length a with radius R for face-centered cubic
a 2R 2
For the FCC crystal structure, each corner atom is shared among eight
unit cells, whereas a face-centered atom belongs to only two. Therefore, one-eighth of each of the eight corner
atoms and one-half of each of the six face atoms, or a total of four whole atoms, may be assigned to a given unit
cell
A cubic unit cell with atoms located at all eight corners and a single atom at the cube center.
Center and corner atoms touch one another along cube diagonals, and unit cell length a and atomic radius R are
related through
4R
a
3
a) Hard Sphere representation of BCC
b) Reduced sphere representation of BCC
c) Aggregate of many atoms with unit cell
The Hexagonal Close-Packed Crystal Structure
The top and bottom faces of the unit cell consist of six atoms that form
regular hexagons and surround a single atom in the center
Another plane that provides three additional atoms to the unit cell is
situated between the top and bottom planes
The equivalent of six atoms is contained in each unit cell; one-sixth of
each of the 12 top and bottom face corner atoms, one-half of each of
the 2 center face atoms, and all 3 mid-plane interior atoms
a) Reduced sphere unit-cell
b) Aggregate of many atoms
Lattice Parameter Relationships and Figures Showing Unit Cell Geometries for the Seven Crystal Systems
Single Crystals
Polycrystalline Materials
Anisotropy
Stress - Force or load per unit area of cross-section over which the force or load is acting.
Strain - Elongation change in dimension per unit length.
Young’s modulus - The slope of the linear part of the stress-strain curve in the elastic region, same as modulus of
elasticity.
Shear modulus (G) - The slope of the linear part of the shear stress-shear strain curve.
(c)2003 Brooks/Cole, a division of Thomson Learning, Inc. Thomson
Engineering Stress
F is defined as instantaneous load applied perpendicular to the specimen cross section, in units of newtons (N)
Ao is the original cross-sectional area before any load is applied (m2 or in2)
The units of engineering stress σ (referred to subsequently as just stress) are megapascals, MPa (SI) (where 1
MPa N/m2), and pounds force per square inch, psi
F
Ao
Engineering Strain
Shear Stress is computed as the ratio of the pure shear force applied parallel to the upper and lower faces, each
of which has an area of Ao
F
A0
Shear Strain - Defined as the tangent to the angle θ shown in the figure
l
tan
lo
Hooke’s Law
For most metals, stress and strain are proportional to each other as described by Hooke’s law. E is the constant
of proportionality (in Gpa or psi). E is called modulus of elasticity or Young’s modulus
E
Young’s modulus (Modulus of Elasticity)
This modulus may be thought of as stiffness, or a material’s resistance to elastic deformation. The greater the
modulus, the stiffer the material
Elastic Deformation
Deformation in which the stress and strain are directly proportional is called elastic
deformation
Shear Modulus
G
ELASTIC PROPERTIES OF MATERIALS
Poisson’s Ratio
For most metallic materials, elastic deformation persists only to strains of about 0.005. As
the material is deformed beyond this point, the stress is no longer proportional to strain
and permanent, non-recoverable, or plastic deformation occurs
The transition from elastic to plastic is a gradual one for most metals; some curvature
results at the onset of plastic deformation, which increases more rapidly with rising stress
Typical stress– strain behavior for a metal showing elastic and plastic deformations, the
proportional limit P, and the yield strength as determined using the 0.002 strain offset
method.
Tensile Properties
Proportional limit - For metals that experience this gradual elastic–plastic transition, the point of yielding may be
determined as the initial departure from linearity of the stress–strain curve
Yield Strength - The stress corresponding to the intersection of this line and the stress–strain curve as it bends over in
the plastic region
Tensile Strength - The stress at the maximum on the engineering stress–strain curve
Typical engineering stress– strain behavior to fracture, point F. The tensile strength TS
is indicated at point M. The circular insets represent the geometry of the deformed
specimen at various points along the curve.
Ductility
Toughness
t ln 1
True Stress-Strain curve
For some metals and alloys the region of the true stress–strain curve from the onset of plastic deformation to
the point at which necking begins may be approximated by
t K tn
log t log K n log tn
In this expression, K and n are constants and will depend on the condition of the material (i.e., whether it has
been plastically deformed, heat treated, etc.). The parameter n is often termed the strain hardening exponent
and has a value less than unity
By plotting the log of stress-strain curve, you will get the values for K and n
Hardness
Measure of a material’s resistance to localized plastic deformation (e.g., a small dent or a scratch)
Quantitative hardness techniques have been developed in which a small indenter is forced into the surface of a
material to be tested
The depth or size of the resulting indentation is measured, which in turn is related to a hardness number
The softer the material, the larger and deeper is the indentation, and the lower the hardness index number