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FDD3672
March 2015
FDD3672
N-Channel UltraFET® Trench MOSFET
100V, 44A, 28mΩ
Features Applications
• r DS(ON) = 24mΩ (Typ.), VGS = 10V, ID = 44A • DC/DC converters and Off-Line UPS
• Qg(tot) = 24nC (Typ.), VGS = 10V • Distributed Power Architectures and VRMs
• Low Miller Charge
• Primary Switch for 24V and 48V Systems
• Low Qrr Body Diode
• High Voltage Synchronous Rectifier
• Optimized efficiency at high frequencies
• UIS Capability (Single Pulse and Repetitive Pulse)
D
DRAIN
(FLANGE)
GATE
SOURCE G
TO-252AA
S
Thermal Characteristics
o
RθJC Thermal Resistance Junction to Case TO-252 1.11 C/W
o
RθJA Thermal Resistance Junction to Ambient TO-252 100 C/W
RθJA Thermal Resistance Junction to Ambient TO-252, 1in2 copper pad area 52 oC/W
Off Characteristics
B VDSS Drain to Source Breakdown Voltage ID = 250µA, VGS = 0V 100 - - V
VDS = 80V - - 1
IDSS Zero Gate Voltage Drain Current µA
VGS = 0V TC= 150oC - - 250
IGSS Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
VGS(TH) Gate to Source Threshold Voltage V GS = VDS, ID = 250µA 2 - 4 V
ID = 44A, VGS = 10V - 0.024 0.028
rDS(ON) Drain to Source On Resistance ID = 21A, VGS = 6V, - 0.031 0.047 Ω
ID=44A, VGS=10V, TC=175oC - 0.054 0.068
Dynamic Characteristics
CISS Input Capacitance - 1710 - pF
VDS = 25V, VGS = 0V,
COSS Output Capacitance - 247 - pF
f = 1MHz
CRSS Reverse Transfer Capacitance - 62 - pF
Qg(TOT) Total Gate Charge at 10V VGS = 0V to 10V - 24 36 nC
Qg(TH) Threshold Gate Charge VGS = 0V to 2V VDD = 50V - 3 4.5 nC
Qgs Gate to Source Gate Charge ID = 44A - 8.6 - nC
Qgs2 Gate Charge Threshold to Plateau Ig = 1.0mA - 5.6 - nC
Qgd Gate to Drain “Miller” Charge - 5.6 - nC
Notes:
1: Starting T J = 25°C, L = 0.6mH, IAS = 20A.
2: Pulse Width = 100s
1.2 50
VGS = 10V
1.0
POWER DISSIPATION MULTIPLIER
40
20
0.4
0.2 10
0 0
0 25 50 75 100 125 150 175
25 50 75 100 125 150 175
TC , CASE TEMPERATURE (oC) TC, CASE TEMPERATURE (oC)
2
DUTY CYCLE - DESCENDING ORDER
0.5
1 0.2
0.1
0.05
0.02
THERMAL IMPEDANCE
0.01
ZθJC, NORMALIZED
PDM
0.1
t1
t2
500
TRANSCONDUCTANCE TC = 25oC
MAY LIMIT CURRENT FOR TEMPERATURES
IN THIS REGION ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
IDM, PEAK CURRENT (A)
I = I 25 175 - TC
VGS = 10V
150
100
30
10 -5 10-4 10-3 10-2 10-1 100 10 1
t , PULSE WIDTH (s)
300 80
If R = 0 PULSE DURATION = 80µs
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
DUTY CYCLE = 0.5% MAX
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1] VDD = 15V
100
IAS, AVALANCHE CURRENT (A)
60
10
TJ = 25o C
STARTING TJ = 150 C o 20
TJ = -55oC
1 0
0.001 0.01 0.1 1 10 3.5 4.0 4.5 5.0 5.5 6.0 6.5
tAV, TIME IN AVALANCHE (ms) VGS , GATE TO SOURCE VOLTAGE (V)
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515 Figure 6. Transfer Characteristics
Figure 5. Unclamped Inductive Switching
Capability
80 40
PULSE DURATION = 80µs
TC = 25oC
DRAIN TO SOURCE ON RESISTANCE (m Ω)
35
60 VGS = 6V
VGS = 6V
ID, DRAIN CURRENT (A)
30
40
PULSE DURATION = 80µs 25 VGS = 10V
DUTY CYCLE = 0.5% MAX
20
20
VGS = 5V
0 15
0 0.5 1.0 1.5 2.0 2.5 3.0 0 10 20 30 40 50
VDS , DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)
2.5 1.2
PULSE DURATION = 80µs VGS = VDS, ID = 250µA
DUTY CYCLE = 0.5% MAX
NORMALIZED DRAIN TO SOURCE
2.0 1.0
THRESHOLD VOLTAGE
NORMALIZED GATE
ON RESISTANCE
1.5 0.8
1.0 0.6
0.5 0.4
-80 -40 0 40 80 120 160 200 -80 -40 0 40 80 120 160 200
TJ, JUNCTION TEMPERATURE ( oC) TJ, JUNCTION TEMPERATURE (o C)
Figure 9. Normalized Drain to Source On Figure 10. Normalized Gate Threshold Voltage vs
Resistance vs Junction Temperature Junction Temperature
1.2 3000
ID = 250µA
1000
BREAKDOWN VOLTAGE
C, CAPACITANCE (pF)
1.1
C RSS = CGD
100
1.0
0.9 10
-80 -40 0 40 80 120 160 200 0.1 1 10 100
TJ , JUNCTION TEMPERATURE (o C) VDS , DRAIN TO SOURCE VOLTAGE (V)
Figure 11. Normalized Drain to Source Figure 12. Capacitance vs Drain to Source
Breakdown Voltage vs Junction Temperature Voltage
10 200
VDD = 50V
100
VGS , GATE TO SOURCE VOLTAGE (V)
8
ID, DRAIN CURRENT (A)
100 us
6 10
THIS AREA IS
LIMITED BY rDS(on)
4
SINGLE PULSE 1 ms
1 TJ = MAX RATED
2
WAVEFORMS IN RTJC = 1.11 oC/W
DESCENDING ORDER: 10 ms
ID = 44A TC = 25 oC
DC
ID = 21A
0.1
0 1 10 100 300
0 5 10 15 20 25
VDS, DRAIN to SOURCE VOLTAGE (V)
Qg, GATE CHARGE (nC)
Figure 13. Gate Charge Waveforms for Figure 14. Forward Bias Safe
Constant Gate Currents Operating Area
VDS BVDSS
tP
VDS
L
IAS
VARY tP TO OBTAIN VDD
+
REQUIRED PEAK IAS RG
VDD
VGS -
DUT
tP
0V IAS 0
0.01Ω
tAV
Figure 14. Unclamped Energy Test Circuit Figure 15. Unclamped Energy Waveforms
VDS
VDD Qg(TOT)
VDS
L
VGS = 10V
VGS
+
VDD VGS
-
DUT VGS = 2V
0 Qgs2
Ig(REF)
Qg(TH)
Qgs Qgd
Ig(REF)
0
Figure 16. Gate Charge Test Circuit Figure 17. Gate Charge Waveforms
td(ON) td(OFF)
RL tr tf
VDS
90% 90%
+
VGS
VDD
10% 10%
- 0
DUT 90%
RGS
VGS 50% 50%
PULSE WIDTH
VGS 10%
0
Figure 18. Switching Time Test Circuit Figure 19. Switching Time Waveforms
RθJA (oC/W)
Equation 1 mathematically represents the relationship and
75
serves as the basis for establishing the rating of the part.
(T –T )
JM A (EQ. 1)
P D M = ----------------------------- 50
R θ JA
R
23.84
= 33.32 + -------------------------------------
θ JA (EQ. 2)
( 0.268 + Area )
Area in Inches Squared
R
154
= 33.32 + ----------------------------------
θ JA (EQ. 3)
( 1.73 + Area )
Area in Centimeters Squared
Vbat 22 19 DC 1
ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*98),3))}
.MODEL MmedMOD NMOS (VTO=3.6 KP=3 IS=1e-40 N=10 TOX=1 L=1u W=1u RG=1.5)
.MODEL MstroMOD NMOS (VTO=4.3 KP=59 IS=1e-30 N=10 TOX=1 L=1u W=1u)
.MODEL MweakMOD NMOS (VTO=3.09 KP=0.05 IS=1e-30 N=10 TOX=1 L=1u W=1u RG=15 RS=0.1)
.ENDS
Note: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank
Wheatley.
FDD3672
CTHERM1 TH 6 3.2e-3
CTHERM2 6 5 3.3e-3
CTHERM3 5 4 3.4e-3 RTHERM1 CTHERM1
CTHERM4 4 3 3.5e-3
CTHERM5 3 2 6.4e-3
CTHERM6 2 TL 1.9e-2
6
RTHERM1 TH 6 5.5e-4
RTHERM2 6 5 5.0e-3
RTHERM3 5 4 4.5e-2
RTHERM2 CTHERM2
RTHERM4 4 3 10.5e-2
RTHERM5 3 2 3.4e-1
RTHERM6 2 TL 3.5e-1
5
SABER Thermal Model
SABER thermal model FDD3672
template thermal_model th tl RTHERM3 CTHERM3
thermal_c th, tl
{
cctherm.ctherm1 th 6 =3.2e-3
4
ctherm.ctherm2 6 5 =3.3e-3
ctherm.ctherm3 5 4 =3.4e-3
ctherm.ctherm4 4 3 =3.5e-3
ctherm.ctherm5 3 2 =6.4e-3 RTHERM4 CTHERM4
ctherm.ctherm6 2 tl =1.9e-2
rtherm.rtherm1 th 6 =5.5e-4
rtherm.rtherm2 6 5 =5.0e-3 3
rtherm.rtherm3 5 4 =4.5e-2
rtherm.rtherm4 4 3 =10.5e-2
rtherm.rtherm5 3 2 =3.4e-1
RTHERM5 CTHERM5
rtherm.rtherm6 2 tl =3.5e-1
}
RTHERM6 CTHERM6
tl CASE
Authorized Distributor
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FDD3672