Fe
Soldering
process
Customer feedback
Weller University | © 2007 Cooper Industries, Ltd. Proprietary CONFIDENTIAL | 7
Tip Appearance
• Surface Contamination of a
Soldering Tip
– A soldering tip becomes contaminated
and produces a non-wettable surface
– The typical appearance of a
contaminated soldering tip is shown in
the these photos
– The tips exhibit a “blackened or charred”
surface finish that is very difficult to
remove
– A contaminated tip can normally be
rejuvenated by a low solids, mildly active
wire core solder, Tip Activator (Tinner)or
Weller Polishing Bar (WPB1)
– The heat transfer of a contaminated
soldering tip is significantly reduced
– The risk of surface contamination grows
considerably when using higher tip
temperatures (840°F < 30 Sec.’s)
Durability
DurabilityHT-2
HT-2 SAC
SAC/ / Sn60
Sn60
9000
9000 8000
8000
8000
8000
7000
7000
6000
6000
Cycles
Cycles
5000
5000
4000
4000
3000
3000 1714
1714
2000
2000
1000
1000
00
11
lead
leadfree
Test with reduced Iron layer thickness @ SAC
725°F
free SAC leaded
leadedSn60
Sn60
2500
2000
a highly sophisticated plating
2000 operation.
1500
1500 – There is a linear relationship
1000 between the Iron thickness and
1000
the life of a tip.
500
500
1515 3030 5050 7575 100 120
– The Iron layer has 3 important
100 120 characteristics.
Iron
Ironlayer
layerthickness
thicknessµm
µm • +Plus—Long Life
• +Plus - Excellent wettability
Durability test of a HT 2 soldering tip with
• - Minus - Heat conductivity is
Sn/Ag/Cu (SAC) solder alloy. Tip temperature @
five times lower than Copper.
725°F
Weller University | © 2007 Cooper Industries, Ltd. Proprietary CONFIDENTIAL | 16
Tip Lifetime
Comparison
Comparison::LTD
LTD400µm
400µm/ /LTD
LTD200µm
200µm
15568
15568
16000
16000
14000
14000
12000
12000
10000
10000
Cycles
Cycles 8000 6325
8000 6325
6000
6000
4000
4000
2000
2000
00
11 22
LT-400
LT-400 LT-200
LT-200
Cu
– For that reason the Iron layer thickness is
limited by the geometry and is approximately
0.006” (150µm) for fine pointed tips.
Chrome layer
blocks flow – This represents the optimal balance between
of solder performance and durability.
Cross section of LT1S
Wettable Area
Chrome
Copper
Iron
Cross section LT1S 150µm Fe
400
350
300
250
Temperatur °C
150
0
0 20 40 60 80 100 120 140 160 180 200
Ze it se c.
Comparison
ComparisonSnAgCu
SnAgCu- -SnCu
SnCu- -SnAg
SnAgatat725°F
725°F • The wear process is also dependent on the
kind of solder alloy that’s used.
4000
4000 • Comparison between three common alloys.
3368
3368
3500
3500 • Sn 95,8 Ag 3,5 Cu 0,7 (SAC)
3000
3000 2478 • Sn 99,3 Cu 0,7 (SC)
2478
2500
2500 2163 SAC
2163 SAC • Sn 96,5 Ag 3,5 (SA)
ZZy yk klelenn
2000
2000 SC
SC • Compared to a SAC alloy, the Tin -Copper
1500 SA
SA
1500 and Tin-Silver alloys reduce the lifetime by:
1000
1000 • SC - 25%
500
500 • SA - 35%
00
HT2 Soldering tip / 725°F SAC
SAC/ /SC
SC/ /SA
SA
Cycles
Cyclesatatdifferent
differenttemperatures
temperatureswith
withSnCu
SnCualloy
alloy
Cycles20000
Cycles 20000 • Tip temperature has a significant influence
on the tip lifetime.
15000
15000 • The corrosion and migration rates increase
disproportionately.
00
680°F
680°F 725°F
725°F 770°F
770°F
Comparison
ComparisonSnCu
SnCu- -SnAgCu
SnAgCualloy
alloy The influence of the temperature also differs
with the solder alloy. We compared Sn Cu to
35000 31953
31953 SAC solder alloy.
35000
30000
30000 • SC solder at 770 °F---lasted for 7450 cycles
25000 SnCu
SnCuLot
Lotbei
bei360°
360° • SC solder at 680 °F---lasted for 19000 cycles
25000 19000
19000
CCy yc cleles s
20000
20000 SnCu
SnCuLot
Lotbei
bei410°
410° • SAC solder at 770 °F---lasted for 8390 cycles
15000 SnAgCu
15000 SnAgCuLot
Lotbei
bei410°
410° • SAC solder at 680 °F---lasted for 31953 cycles
7450 8390
10000
10000 7450 8390 SnAgCu
SnAgCuLot
Lotbei
bei360°
360°
5000
5000 This equates to a 77% spread between best
00 and worst.
11
360°+410°
360°+410°SnCu
SnCu/ 410°+360°
/ 410°+360°SnAgCu
SnAgCu
New Solder Alloys with Micro Additives have been developed to reduce Migration
from the Soldering Tip, Components and Boards
Erosion depending on flux content • Additives reduce the migration of the Iron layer
into the solder.
5000
• The additives are nickel, cobalt or rare earth in
4500 4300
very low percentages which do not change the
4000 physical characteristics of the solder.
3500
• Together with the new flux composition used in
3000 the micro alloys, the impact to tip lifetime is
Cycles
2610
2500 2250 significant ( up to 4 times ).
2000
• Rosin flux compositions (Kristall) create more
1500 1170 corrosion than halogen compositions (KS115).
1000
500
More info on the Weller blog in the article
titled: “Lead Free - What To Do?”
0
1 2 3 4
Solder material
w/o flowTin® with flowTin® w/o flowTin® with flowTin®
Kristall 2,2% Kristall 2,2% KS115 3% KS115 3%
• OKI
– Auto-sleep work stands
• Both wet and dry cleaning offered
– Smart Heat Power Tip
• Increased Iron plating
• Green band around the tip to indicate Lead Free
• Hakko
– First company to promote dry tip cleaning
– Nitrogen generator (which is not true Nitrogen
88 - 89 % efficient)
– Brass Tip Polisher
– Rotating V Groove Solder Cleaner to reduce
flux splatter
• Pace
– Nitrogen generators (more efficient than
Hakko - 98 % efficient)
– Diamond soldering tips (no true advantage)
• JBC
– Increased Iron plating