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Turret-based Wafer Handler

A N S W E R I N G the

HIGHEST CHALLENGES

IN THE IC AND LED

FINISHING PROCESS

Hi gh Pro d uc tiv ity Unique Vision Applications

n Up to 30,000 uph n NVcore on turret for WLCSP Bumped Die
n Complete finishing solution
- Full Vision inspection
- Test Contacting
n Full device traceability

F l ex i b i l i ty
n Wide applicable device range
(0.3 x 0.6 mm to 12 x 12 mm): 3DFlex for True Ball/ ViewMap for 100%
Bump co-planarity Wafer map matching
- WLCSP: Bare Die, Bumped Die
- QFN / DFN
- LED
- MEMS
ismecƒ ny32w
Turret-based Wafer Handler

Processes Capabilities
Input NVcore Vision Inspection
Wafer, De-taping, Bowl, Tube 1D/2DMC code reader, ViewMap,
Output 2D/3DFlex ball/bump co-planarity
Tape & Reel, Tube, Tray, Mark, Surface, 5S, Color Vision
Wafer output, LED 64 Bulk Sorting In-Tape, Post Sealing Inspection
Processes LED dedicated solutions
Device Flip Contactor
X-Y-T touchless precisor One Touch Socket “High Amps”
Test contacting Flat Test Kelvin
Electrical Tester (Discrete) Small Device Kelvin
LED optical test (Ambient & Temperature 85°C) Pogo pin socket
Laser marking LED dedicated solutions
6 Sides Vision inspection
Bulk, Tube, Tray Sorting
Waffle PAK, Wafer Sorting
Dual Tape & Reel with flip-flop
Automatic rejection & replacement in tape
Auto Reel Changer
Wafer map with full device traceability

Specifications
Wafer input media
Facility Requirements
Film frame carrier: 4’’ to 12’’
100VAC - 240VAC 50/60 Hz, One Phase
Round and rectangular / plastic and metal frame
2KVA / 3.5kVA with vacuum pump (optional)
Wafer cassette: 25 x 8’’, 13 x 12’’
Air Pressure range: 5-10 bar ± 0,5 bar
Device Range Air consumption: 5 m3/hour (typical)
WLP: 0.3 x 0.6 to 12 x 12 mm / thickness ≥ 0.10 mm Vacuum Network: -0.5 Bars ± 10%
QFN: 0.3 x 0.6 to 12 x 12 mm / thickness ≥ 0.30 mm Consumption: typ. 420 l/min (typical)
LED: 0.5 x 0.5 to 6 x 6 mm / thickness ≥ 0.10 mm
Dimensions
Index Time Overall dimension: 2.3 x 2.0 x 2.1 m
Down to 80 ms, depending on device and process Floor space requirement: 3.0 x 2.3 x 2.1 m
Performance Characteristics Weight: net typ. 1200 kg / gross typ. 1700 kg
WLP: up to 24,000 uph
With Wafer output configuration:
QFN: up to 30,000 uph
Overall dimension: 2.8 x 1.2 x 2.1 m
LED: up to 30,000 uph
Floor space requirement: 3.5 x 1.5 x 2.1 m
With Wafer output: up to 20,000 uph
Weight: net typ. 1500 kg / gross typ. 2000 kg
MTBA: typ. > 2 h
Standards
MTBF: typ. >168 h
Conversion time: typ. < 45 min
S2/S8 assessment
Interface
2006/42/EC Machinery
TTL parallel interface for Tester and Laser
2004/108/EC Electromagnetic compatibility (EMC)
RS232, GPIB (optional)
2006/95/EC Low Voltage
Network: Ethernet capability
Wafer Mapping: SECS GEM
(SEMI E4, 5, 30, 37, SEMIG84)
ESD
According to ANSI / ESD SP10.1
ESD Class 0 (optional)

12367 Crosthwaite Circle, Poway, CA 92064-6817

Tel. 858.848.8000 Email: info@cohu.com

For global sales locations and support, please visit

Specifications subject to change without notice. www.cohu.com
For detailed performance specifications, please contact Cohu.

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