G630-U10 Advanced Maintenance Manual

G630-U10 Advanced
Maintenance Manual
Issue 01
Date 2014-04-01
HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2014. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: http://www.huawei.com
Email: support@huawei.com
Issue 01 (2014-04-01) Huawei Proprietary and Confidential i

Copyright © Huawei Technologies Co., Ltd.
G630-U20 Advanced Maintenance Manual About This Document
About This Document
Author
Prepared by Device R&D sector Date 2014-03-20
Reviewed by Maintenance support team Date 2014-03-20
Approved by Service representative Date 2014-03-20
Change History
Date Version Description Author
2014-03-20 V1.0 Released the first issue. Device R&D sector
Issue 01 (2014-04-01) Huawei Proprietary and Confidential ii

Copyright © Huawei Technologies Co., Ltd..
G630-U20 Advanced Maintenance Manual Contents
Contents
About This Document .................................................................................................................... ii

1 Overview ......................................................................................................................................... 1
1.1 Applicable Scope .............................................................................................................................................. 1
1.2 Brief Introduction ............................................................................................................................................. 1
1.3 How to Obtain Product and Repair Information .............................................................................................. 1
2 PCBA Working Principles ........................................................................................................... 2

2.1 G630-U10 's Conceptual Block Diagram ......................................................................................................... 2
2.2 PCBA Functions ............................................................................................................................................... 3
3 Components on the PCBA and BOM ........................................................................................ 7

3.1 Components on the PCBA ............................................................................................................................... 7
3.2 BOM List ......................................................................................................................................................... 8
4 Maintenance Tools ...................................................................................................................... 10

5 Troubleshooting .......................................................................................................................... 12
5.1 Integrated Device Maintenance Workflow ..................................................................................................... 12
5.2 Upgrading the Upgrade&Load Software........................................................................................................ 13
5.3 Writing the Board Bar Code and Work Station Information .......................................................................... 14
5.4 Conducting the CBT....................................................................................................................................... 14
5.5 Making a Bin File........................................................................................................................................... 16
5.6 Rewriting Physical Numbers .......................................................................................................................... 18
5.7 Writing Customization Information ............................................................................................................... 19
5.7.1 Writing PLMN Information .................................................................................................................. 19
5.7.2 Writing Country and Vendor Information ............................................................................................. 20
5.8 Uploading the Data File ................................................................................................................................. 21
5.9 Querying the Unlock Code ............................................................................................................................. 22
6 Phone Working Principles and Fault Analysis ..................................................................... 23

6.1 Baseband Subsystem ...................................................................................................................................... 23
6.1.1 Power-on/Power-off Sequence Diagram ............................................................................................... 23
6.1.2 MSM8212 Memory Interface ............................................................................................................... 24
6.1.3 LCD+Touchscreen Module ................................................................................................................... 29
6.1.4 Camera .................................................................................................................................................. 31
Issue 01 (2014-04-01) Huawei Proprietary and Confidential iii

G630-U20 Advanced Maintenance Manual Contents
6.1.5 FM Interface.......................................................................................................................................... 34
6.1.6 USIM and TFLASH interface ............................................................................................................... 34
6.1.7 Headset Jack.......................................................................................................................................... 36
6.1.8 Battery Connector ................................................................................................................................. 37
6.1.9 Proximity Sensor/Tri-color Indicator Interface ..................................................................................... 37
6.1.10 Accelerometer Interface ...................................................................................................................... 39
6.1.11 Motor/Key Interface ............................................................................................................................ 40
6.1.12 Audio Interfaces and Audio Scheme Codec ........................................................................................ 41
6.1.13 G630 System Power Supply................................................................................................................ 44
7 Troubleshooting Common Faults ............................................................................................ 46

7.1 Startup Failure ................................................................................................................................................ 46
7.2 Charging Failure ............................................................................................................................................. 55
7.3 Camera Failure ............................................................................................................................................... 56
7.4 Connection Failure Between the Phone and Computer .................................................................................. 57
7.5 Call Receiving Failure .................................................................................................................................... 58
7.6 Call Sending Failure ....................................................................................................................................... 59
7.7 Vibration Failure ............................................................................................................................................ 60
7.8 Ringtone Failure ............................................................................................................................................. 61
7.9 LCD Display Failure ...................................................................................................................................... 62
7.10 Key Failure ................................................................................................................................................... 63
7.11 No Sound Coming from the Headset During a Call ..................................................................................... 64
7.12 T-Flash Card Detection Failure .................................................................................................................... 65
7.13 GPS Signal Reception Failure ...................................................................................................................... 66
Issue 01 (2014-04-01) Huawei Proprietary and Confidential iv

G630-U20 Advanced Maintenance Manual 1 Overview
1 Overview
1.1 Applicable Scope

The G630-U10 Maintenance Manual is available in the simplified and advanced versions. The
two versions are respectively applicable to common service centers and advanced service
centers authorized by Huawei. This document provides repair instructions for technicians at
advanced service centers to conduct maintenance service of level 3. For maintenance services
of level 1 and level 2, see the G630-U10 Simplified Maintenance Manual. Being Huawei
proprietary, this document is accessible only for authorized service centers. Although every
effort was made to ensure the accuracy of the document, errors may still exist. If you find any
errors or have any suggestions, please report them through ComPartner.
1.2 Brief Introduction

This document introduces the product features, mechanical parts, assembly and disassembly
procedures, and common troubleshooting methods. You will be able to clear common faults of
the product after you learn this document.
1.3 How to Obtain Product and Repair Information

To obtain product and maintenance information, visit Huawei service website. You are
recommended to install the Huawei service platform software ComPartner.
To obtain the ComPartner installation package, log in to
http://support.huaweidevice.com/service/, search for ComPartner. You will find the
installation package.
Issue 01 (2014-04-01) Huawei Proprietary and Confidential 1

G630-U20 Advanced Maintenance Manual 2 PCBA Working Principles
2 PCBA Working Principles
2.1 G630-U10 's Conceptual Block Diagram

Figure 2-1 shows the G630-U10's conceptual block diagram.
Figure 2-1 Conceptual block diagram
MSM8212 is a baseband processor chip that processes input and output signals such as video,
audio, or radio frequency (RF) signals. Baseband interfaces include the interfaces for the
keyboard, LCD, microSD card, Bluetooth, camera, and microphone. PM8110 provides the
analog multi-way switch, real time clock (RTC) circuit, temperature compensated crystal
oscillator (TCXO), motor drive circuit, and programmable current source. WTR2605 is an RF
signal processor that implements conversion of uplink and downlink RF signals. The PCBs
can be divided into four logical subsystems, that is, the baseband, RF transceiver, power
management unit, and user interface.

PM8110 provides analog multi-channel switch, real-time clock circuit, TCXO clock circuit,
motor driver circuit, and programmable current source.
The WTR2605 is the RF signal processing chip, performing the uplink and downlink RF
signal conversion.
By function, the PCBA can be divided into four subsystems: baseband, RF, power, and user
interface subsystems.
2.2 PCBA Functions

Based on the logical functions, the PCBA can be divided into four subsystems: baseband, RF,
power, and user interfaces. Table 2-1 describes the modules and sub-modules of the baseband
and RF subsystems and their functions.
Table 2-1 Modules and sub-modules of each subsystem

Subsyste
Module Unit Function
m
QDSP6 functions as the modem processor (500
Modem system
MHZ).
Application Quad-core Cortex ARM A7 processor, 1.2 G 1 MB
subsystem L2 cache
Camera interface, RPM system, RF interface,
User interface HKADC, LCD interface, SD interface, USB
processing unit interface, UART interface, USIM card interface, SBI
MSM8212 interface, GPIO, JTAG/ETM interface
Four pairs of MIPI DSIs, supporting 720p resolution
Two pairs of MIPI CSIs, supporting an 8M rear
camera and a 5M front camera
Multimedia and
MDP 5 multimedia processor
game engine
QDSP6 audio processing function with low power
Baseband
consumption, working at 400 Hz
subsystem
128K L2 cache
Power supply Lists monitoring targets, such as external power
voltage input, Li-ion battery, button battery, VDD-phone,
monitoring and important LDO.
Temperature Battery temperature, PA temperature, and 19.2 MHz
PM8110
monitoring crystal oscillator temperature
Identifies batteries from different suppliers. Software
Battery ID charging and discharging is performed based on this
signal.
NAND feature,
power
eMMC Stores programs and NV items.
consumption, file
system support

Subsyste
m
Package on
LPDDR2RAM package (PoP) on 32-bit, 300 MHZ
MSM8930
GPS Failure GPS receiver Gen 8B, GPS, BDS, and GLONASS are supported.
The ARM9 processor:
Transmits and receives RF signals and implements
Bluetooth (BT)
BT module the Bluetooth, WLAN, and FM baseband function.
interface
Mainly includes the Bluetooth+Wi-Fi+FM module
and peripheral circuit.
Implements Wi-Fi baseband functions and transmits
and receives RF signals.
Wi-Fi interface Wi-Fi module
Includes the Wi-Fi module of WCN3620 and
RF peripheral circuits.
subsystem
Crystal oscillator VCTCXO and
Provides high precision 19.2 MHz local clock
and frequency MSM control
TCXVCO.
synthesizer circuit
External antenna, The phone uses internal antennas for wireless
internal interface communication, supporting WCDMA high and low
Antenna
component, frequency bands. The antennas include the main
antenna protection antenna, Wi-Fi/Bluetooth antenna, and GPS antenna.
Couples part of the output power of WCDMA power
Coupler Power coupler
amplifier to WTR2605 for power monitoring
The UART interface in MSM8212 subsystem is used
UART interface
for Bluetooth.
Indicates the peripheral circuit of the USB interface,
Driver, protection protection circuit, and interfaces in the MSM8x12
circuit, output subsystem, in compliance with USB 2.0. It is the
USB interface
interface major data service channel for the engineering
component sample, and can be used to debug and test devices
during product development.
Power supply,
User Mainly includes the USIM card holder and related
USIM card interface protection circuit,
interface connection circuits.
USIM card holder
subsystem
Keypad driver
circuit, external Performs interruption monitoring on volume keys
Keypad and
keypad, backlight using GPIO. Provides a side backlight LED. The
backlight
LED control backlight is on when a key is pressed.
circuit
LCD driver,
Color LCD and interface mode, The main LCD is of 1600 M color, 720 x 1280. LDC
backlight and backlight backlight brightness is controlled by CABC function.
control

Subsyste
m
Power supply,
protection circuit, Mainly includes microSD card connector and related
microSD card
interface circuit.
Connectors
Driver mode,
connection mode,
Speaker The speaker is output through a PM8110 chip.
speaker
component
Driver mode, The power of the receiver for calls must be less than
connection mode, 70 mW.
Receiver
receiver
component
Interface circuit,
connection mode, The phone has two built-in microphones to eliminate
Microphone
microphone the environmental noise.
component
Earphone, headset The phone provides a headset jack to output audio or
interface circuit, MP3 files. The microphone on the headset cable
Headset
microphone picks up audio. Only the iphone headset line order is
interface circuit supported.
Driver mode,
Vibration motor When there is an incoming call, the motor vibrates to
connection mode,
interface notify the user of the call.
motor
I2C interface
Accelerometer Senses acceleration to help realize game functions.
control
I2C interface Implements the E-Compass function or other
Compass
control auxiliary functions.
Li-ion battery, standard output is 3.7 V/1650 mAh. It
Li-ion battery, is required that the charge/discharge lifecycle is over
Internal backup
interface 500 times. The battery should pass the following
battery
component authentication: GB18287 safety requirements (Li-ion
battery)
The charger can be used in China, Europe, the USA,
and Australia: 90–240 V, 45–55 Hz, AC input. The
Power
model differs with different markets. The output
subsystem External power Adapter and
voltage of the charger is 5±0.25 V. The charger must
supply (travel interface
pass CE and CCC authentication. The charger's
charger) component
output current shall be adequate to charge the battery
and supply power to the phone for normal operation
at the same time.
Power distribution Power distribution Includes filtering networks and cabling for the power
network and power network supply.

Subsyste
m
management Backup battery It manages battery charging and discharging,
management, overcharging and over-discharging protection, and
charge circuit, also charges the capacitance used for RTC current
charge mode, maintenance.
charge protection
Indicates LDO, which manages power supply
Board circuit
flexibly; Based on the service status, protocol
power
requirements and power-saving analysis, the board
management
software manages power supply to unit circuits on
(power-on/off
the board to reduce power consumption. 32.768 KHz
analysis)
sleep clock is provided.
It has a built-in RTC circuit and uses a sleep clock of
RTC:
32.768 kHz that provides precise time.
16 channels of analog signals multiplex is supported,
HKADC interface a channel of signals is output to MSMS6245 for
ADC
The PM8038 provides a built-in TCXO driver to
TCXO diver and
output sine wave and reshape the sine wave to
other controls
required square wave.
Provides the Undervoltage-Lockout (UVLO)
function. When the input voltage is lower than the
UVLO
threshold for a specific period of time, the phone
PM8110 enhanced powers off.
functions
WDT reset Supports the WDT counter overflow reset function.
Overheat When the on-chip junction temperature exceeds
protection 150 , the phone powers off.
Internal driver Provides four LED drivers, one vibrator driver, and
circuit one speaker driver
Interrupt The built-in interrupt manager handles interrupted
management signals.
G6-U10 has a built-in OTG USB driver that supports
USB driver USB 2.0 HS and /B interface. The software does not
support OTG, and USB compatible with Buffer.

G630-U20 Advanced Maintenance Manual 3 Components on the PCBA and BOM
3 Components on the PCBA and BOM
3.1 Components on the PCBA

Figure 3-1 Layout of components and relevant failures (top)
LED2201 tri-color
HD1G630P proximity indicator
sensor FPC
Fault symptom:
Fault symptom:
Indicator fault
Proximity/Ambient
light sensor fault
J1901 headset jack

Fault symptom: J2404 6-pin connector
Headset fault Fault symptom:
Volume key fault, key
startup failure, motor
fault
U2202 gravity sensor

X201 19.2M oscillator
Fault symptom:
Gravity sensor fault Fault symptom:
Startup failure
U201 power
management chip
J2102 front camera
slot
Fault symptom:
Startup failure
Fault symptom:
Front camera fault U701 CPU chip
Fault symptom:
Startup failure
J2101 rear camera
slot
Fault symptom: U1500 EMM+DDR chip
Rear camera fault
Fault symptom:
Startup failure
U2002 backlight IC
Fault symptom:
LCD fault
U3801 WTR2605-RF
chip
Fault symptom:
U2003 LCD RF fault
positive/negative
voltage IC
Fault symptom:
LCD fault
U3301 RF PA
U3201 RF IC
Fault symptom:
RF fault
Fault symptom:
RF fault
MIC1801 main
microphone
J1701 speaker spring
Fault symptom:
Fault symptom: No voice transmitted
Speaker fault or noice transmitted

Figure 3-2 Layout of components and relevant failures (bottom)

J5003 5004
WLAN/BT antenna J5001 J5002 GPS
spring antenna spring
Fault symptom: Fault symptom:
WLAN/BT fault GPS fault
U4701 J2501 TP
WLAN/BT/FM IC connector
WLAN/BT/FM fault TP failure
J1601 battery MIC1802 secondary

connector microphone
Startup failure No voice transmitted,
or noise transmitted
J2401 motor
J2302 TF card slot
No or weak
TF card detection
vibration
failure
LED2101 flashlight
J2303 SIM card slot
Fault symptom:
Fault symptom: Flashlight fault
SIM card detection
failure
U2801 NFC
J2301 SIM card slot
module
SIM card detection
NFC malfunctional
failure
J5005 J5006 main

J2001 LCD
connector to the antenna spring
peer board Fault symptom:
Fault symptom: No or weak signal
LCD display fault
J1602 USB
J3201 RF connector connector
RF fault No charging or USB
communication fault
3.2 BOM List

Table 3-1 is provided for your reference only. It is subject to changes without notice. Obtain
the latest BOM information from Huawei TCS system. For details about how to query a BOM
code, see the simplified version.
Table 3-1 lists the BOM information about key components on the PCBA.
Table 3-1 BOM code list

Position BOM Description
X201 12020215 Crystal Unit,19.2MHz,7pF,+/-10ppm,70ohm,2.5*2.0*0.9mm,NTC
internal,Terminal Dedicated
U201 39200572 Power Management IC(PM8110),3.0~4.4V,118WLNSP(pb-free),Terminal
Dedicated

Position BOM Description

U701 39200574 Terminal Baseband process IC,WCDMA/GSM dualmode baseband
processor,1.2V/1.8V/2.85V,488NSP,Terminal Dedicated
U1500 40060543 MCP,4GB(x8) eMMC,52MHz,1024KB,3.3V/1.8V,FBGA162,8Gb(x32)
LPDDR2,Terminal Dedicated
U3801 39200439 Terminal Baseband process IC,RF Transceiver
WTR2605 -2.2V/1.8V/1.3V-62-WLNSP-Terminal Dedicated
J1601 14240576 Card Block Connector,BTF Connector,3*2,Female,1.3mm,Terminal Dedicated
J1701 51621023 108-5785,Ground Spring,U1250
MIC1801 22050099 Microphone,-42dB.,3.76*2.95*1.1mm,silicon
J2102 14240496 BTB Connector,Female,24Pin,0.4mm,SMT,Mating Height 0.8mm,Terminal
Dedicated
J2404 14240780 Card Socket,Spring Contact,6PIN,Horizontal,Center Line Spacing 1.6mm,Pin
Tail Length 0.4mm,SMT,Terminal Dedicated
U2101 39110800 Switching Regulators,1.5A LED Flash Driver
IC,2.5V~5.5V,1.5A,4MHz,CSP-9,Terminal Dedicated
U2201 38140098 Semiconductor Sensor,Accelerometer,LGA,3axis,Terminal Dedicated
J2101 14240579 BTB Connector,BTBconnector,34PIN,0.4mm,0.8mm,SMT,female,Terminal
Dedicated
J2501 14240831 FPC Connector,8,0.5mm,0.5mm,Back Lock&Double Touch,0.8mm,Terminal
Dedicated
J1901 14240830 Earphone Connector,12.66*6.7*4.2,6Pin,Arc,SMT,Reverse plate (pin inside plate
distance to the flat top surface 1.65mm),Terminal Dedicated
J5004 51624989 Edge mini Groung Spring
U4701 39210160 Connectivity IC,Wireless Connectivity
WCN3620,2.05V~2.17V,62-WLNSP,Terminal Dedicated
J2302 14240708 Card Connector,MicroSD card Connector,8PIN,Horizon,1.1mm,hinge
type,without post,Terminal Dedicated
J2301 14240772 Card Socket,Micro SIM Socket,8Pin,Horizontal,2.54mm,Without Hold
Peg,PUSH-PULL,height 1.3mm,Terminal Dedicated
J2001 14240579 BTB Connector,BTBconnector,34PIN,0.4mm,0.8mm,SMT,female,Terminal
Dedicated
J3201 14240004 Coaxial Connector,RF Switch,Straight,Female,SMT,Terminal Dedicated
J5001 51624989 Edge mini Groung Spring
Attachments
The G630-U10 circuit diagram and PCBA diagram are attached in the following.

G630-U20 Advanced Maintenance Manual 4 Maintenance Tools
4 Maintenance Tools
Figure 4-1 Tools for advanced maintenance

Name: GPIB card
Usage: used for the CBT test
Name: GPIB cable

Name: programmable power supply (model:

Keithley 2303/2306 or Agilent 66311B)
Usage: supplies power to the phone (CBT test)
Name: CMW500
Name: G630-U10 touchscreen removing fixture

Usage: removes the touchscreen (for advanced
service centers)

G630-U20 Advanced Maintenance Manual 4 Maintenance Tools
Name: G630-U10 touchscreen press-fitting tool

Usage: installs the press-fits the touchscreen
(advanced service center)
Name: physical number modification watchdog

Part No: GJ000078
Usage: used for modifying MEID numbers and
writing PLMN information (advanced service
center)
Name: JTAG watchdog

Part No: GJ000021
Usage: used to run the JTAG tool (software)
(advanced service center)

G630-U20 Advanced Maintenance Manual 5 Troubleshooting
5 Troubleshooting
5.1 Integrated Device Maintenance Workflow

Figure 5-1 Repair workflow
Table 5-1 Maintenance workflow

Step Description
Upgrade the phone's The version software is directly used by users. For details, see the
version software. simplified version.
Upload the phone's The upgrade&load software is used in the production line for RF

Step Description
upgrade&load calibration and the function test. The way to upgrade this software
software. is the same as upgrading the version software.
Conduct the MMI The MMI test is carried out by the self-check software provided
test. with the phone. The MMI test is used to check the phone functions.
For details, see the simplified version.
Conduct the MT. The MT is used to test the phone's signal transmission. For details,
see section5.4 "Conducting the CBT."
Make the bin files. Make the bin files of the MEID, SN, and PLMN information. For
details, see section 5.5 "Making a Bin File."
Modify the physical Modify the MEID, SN, BT, Wi-Fi information. Refer to the local
numbers. service policy to determine whether to modify the MEID. If MEID
modification is not required, skip this step. For details, see section
5.6 "Rewriting Physical Numbers."
Write the Write the PLMN, country, and service provider (vendor)
customization information. If there is no such information on the phone, skip this
information. step. For details, see section 5.7 "Writing Customization
Information."
Upload the data file. After you modify the MEID or PLMN information, a new data file
will be generated. Upload the new data file to ComPartner. For
details, see section 5.8 "Uploading the Data File."
Write the board bar Use the SDK tool to write the board bar code and work station
code using the SDK information. For details, see section 5.3 "Writing the Board Bar
tool. Code and Work Station Information."
Conduct the CBT. RF calibration optimizes the RF performance of the phone. The RF
function test tells whether the RF indicators are qualified. For
details, see section 5.4 "Conducting the CBT."
PCBA maintenance workflow:
To repair only the PCBA, refer to this workflow. However, MT is not required.
5.2 Upgrading the Upgrade&Load Software

For details, see the following attachment.
HUAWEI 8930
Loading Software User Guide.docx

5.3 Writing the Board Bar Code and Work Station

Information
To write the board bar code and work station information into the phone using the SDK tool:
Step 1 Log in to ComPartner, choose G630 > Congfig Tool, and double-click Config Tool Board
code Writing Tool SP SDK.
Step 2 Power on the phone, connect it to the computer, and check if the COM port to which the
phone is connected is correctly displayed.
Step 3 On the SDK tool window, enter the port number of the phone into USB port and click Diag
Unlock.
Step 4 Enter the bar code and click write barcode. Set set DT, set WT, set MT, set LT, set MMI,
and set PT to PASS. Click 正常模式.
----End
5.4 Conducting the CBT

CBT includes three tests: BT (RF function test), CT (RF calibration test), and MT (signal test).
To conduct the CBT:

Step 1 Prepare the CBT environment. For details, see the CBT Guide.
Step 2 Prepare the G630-U10 loading test fixture.
Step 3 Log in to ComPartner, and choose G630-U10 > Maintenance Tool.
Step 4 Double-click Maintenance Tool Calibration&Test SH7x30MS02 Ver1004.
The system automatically downloads and installs the CBT tool. On Maintenance Tool
Calibration&Test SH7x30MS02 Ver1004, sub-pages for the BT, CT, and MT are included.
Step 5 Select the CT page.
Step 6 Click Property, enter the password huawei, and click OK.
Step 7 Set the parameters.

 Enter CMU200's and the programmable power supply's addresses.
 Specify the DUT COM port and DUT USB port. The former is the computer's port to
which the three-pin data cable used for CBT is connected. The latter is used to connect to
the phone.
 Select items in the Test Parameter Setting area.
 Specify the current of the programmable power supply.
 Click 确定 then 应用.

Step 8 Connect a CBT watchdog to the computer. Click Init then Start Test.
After the test is successfully complete, the tool displays PASS.
Step 9 Refer to the preceding parameter settings when you conduct the BT and MT.
----End
5.5 Making a Bin File

Bin files are necessary for you to modify the MEID, PLMN, country, and vendor information
on the phone. To make a bin file:
Step 1 Log in to ComPartner, and click Rework bin files. On the displayed Apply page, click Open
template file to save the template to your computer. Fill out the template as follows.
 To make an MEID bin file: Open the SmartPhone_PhyNum tab, enter the phone's
MEID (14 digits), Bluetooth MAC address (12 characters), Wi-Fi MAC address (12
characters), and SN (16 digits).
 Make a PLMN information bin file: Open the SmartPhone_PLMN tab, enter the
phone's PLMN NW (6 digits), PLMN NS (8 digits), and PLMN SP (8 digits).
 Make a county and vendor information bin file: Open the
SmartPhone_Country_Vendor tab, specify the country (32 characters at most) and
vendor (32 characters at most).
Step 2 Save the template. On the Apply page, click to select the path where the template is
saved.
Step 3 Specify the reason why you need to modify the bin file and select your region. Click Apply.
If the bin file is successfully produced, the system prompts a dialog box.

Step 4 Click 确定.

Step 5 Click the Query tab then Query. Specify the path where to save the bin file and download the
bin file package.
Step 6 Decompress the package. You will get two files: a bin file and a TXT file that contains the
password for you to perform follow-up steps.

----End
5.6 Rewriting Physical Numbers

Step 1 Log in to ComPartner, choose G630 > Congfig Tool, and double-click Config Tool Rework
Tool SHSEC01.
The tool's user interface is displayed as follows.
Step 2 Write IMEI, BT, WIFI, and SN. Select IMEI, BT, WIFI, and SN and select the directory
where the .bin file is saved.
Step 3 Enter the password in the Password. txt file in the boxes below the file path. Click Next.

Step 4 Enter a 14-bit IMEI number in Please input IMEI and click Scan&Write.
The IMEI actually consists of 15 digits with its last digit being a randomly generated
verification code. The IMEI in Please input IMEI excludes the last verification code.
Step 5 When Modify success is displayed, the rework is done. Restart the phone to make the
rewritten data take effect.
----End
5.7 Writing Customization Information

5.7.1 Writing PLMN Information
Before you proceed, ensure that the phone has its physical numbers written in.
Application Scenario
 Vendors have requirements for writing PLMN information (MCCs and MNCs) into
phones.
 Phones are locked because incorrect unlock codes were used to lock them.
Procedure
To write the PLMN information:
Step 1 Log in to ComPartner, choose G630 > Config Tool, and double-click Config Tool Rework
Tool SHSEC01. On the displayed dialog box, select PLMN, enter 1 in DCK Feature Inds
and 10 in DCK Count Max, and select the PLMN information bin file's path for Data File
Select. Enter the password and click Next.

Step 2 Click Scan&Write. Restart the phone after the operation is successfully implemented.
The unlock codes to the SIM card and Qualcomm background lock are changed.
----End
5.7.2 Writing Country and Vendor Information

To write the country and vendor information:
Step 1 Run the rework tool. On the displayed dialog box, select Country-Vendor. Select the country
and vendor information bin file's path for Data file select and enter the password. Click Next.

Step 2 Click Scan&Write. After the operation is successfully implemented, restart the phone.
----End
5.8 Uploading the Data File

After you modify the PLMN or MEID information, the rework tool automatically generates a
data file in the computer's drive C. See the following attachments for reference.
PLMN-20120815.xls PhyNum-20120815.x
ls
To check such a file, access C:\SmartPhoneModifyInfoLog\Report on your computer.

To upload the data file to ComPartner:
Step 1 Log in to ComPartner, click Upload unlock code.
Step 2 On the displayed dialog box, specify the path of the data file to upload.

Step 3 Click Upload.

The system will show you whether the file is successfully uploaded.
----End
5.9 Querying the Unlock Code

To query the unlock code:
Step 1 Log in to ComPartner and click Query unlock code.
Step 2 On the displayed dialog box, enter the physical number to query. Select your region and click
Query. In the Result area, select a lock code type.
---End
Querying the unlock code requires you to have the permission. Contact the local Huawei technical
support to apply for the permission.

G630-U20 Advanced Maintenance Manual 6 Phone Working Principles and Fault Analysis
6 Phone Working Principles and Fault

Analysis
Before performing maintenance and repair, ensure that the failure is not caused by
environmental factors and incorrect phone settings. It is advisable to back up customer
information before restoring the factory settings for troubleshooting.
6.1 Baseband Subsystem

6.1.1 Power-on/Power-off Sequence Diagram
Figure 6-1 shows the G630-U10 power-on/power-off sequence diagram.
Figure 6-1 Power-on and power-off sequences

The power-on process starts when the KYPD_PWR_N signal is pulled down, which triggers
the power-on sequence of the PM. PS_HOLD is first signal to be pulled down during the
power-off process.
6.1.2 MSM8212 Memory Interface

Overview
 The EBI supports LPDDR2 SDRAM. The data bit width is 32 bits and the highest
frequency is 333 MHz.
 The SDC1 interface supports the eMMC flash.
 Supports the NOR flash through the SPI interface (not used in G630).
EBIO bus interface features:
 Only supports low voltage storage devices with 1.2 V I/O voltage.
 Supports DDR2 SDRAM with the highest speed of 333 MHz.
 Supports 512-byte read buffer and 512-byte write buffer.
SDC bus interface features:
 Meets the eMMC v4.5 and SD v3.0 standards.
 The maximum clock rate is 200 MHz (SDR) or 50 MHz (DDR).
Connections
The MSM8x12 is connected to the LPDDR2 SDRAM through the EBI1 bus. The MSM8212
is connected to the EMMC through the SDC1 bus, as shown in Figure 6-3.

Figure 6-2 Connection to the LPDDR2 SDRAM

Figure 6-3 Connection to the EMMC
Interface Between the MSM8x12 and NAND Flash
Table 6-1 NAND interface level
MSM8x12 SDC1 Theoretical EMMC NAND Flash Electrical Actual

Electrical Interface Characteristics Situatio
Characteristics Level n
Mapping
VDD_P2=1.8 V VCC=1.8 V
VIH(min)=0.65xVDD_P2 < Samsung:VOH(min)=VCC-0.45 V=1.35 V OK
=1.17 V Toshiba:VOH(min)=VCC-0.45 V=1.35 V
Sandisk:
VIL(max)=0.35xVDD_P2 > Samsung:VOL(max)=0.125xVDD=0.225V OK
=0.63 V Toshiba:VOL(max)=0.45V
Sandisk:
VOH(min)=VDD_P2-0.45 > Samsung:VIH(min)=0.65xVCC=1.17 V OK
=1.35 V Toshiba:VIH(min)=0.65xVCC=1.17 V
Sandisk:
VOL(max)=0.45 V < Samsung:VIL(max)=0.35xVCC=0.63 V OK
Toshiba:VIL(max)=0.35xVCC=0.63 V

MSM8x12 SDC1 Theoretical EMMC NAND Flash Electrical Actual

Electrical Interface Characteristics Situatio
Characteristics Level n
Mapping
Sandisk:
VIH(max)=VDD_P2+0.3 > Undefined
V=2.1 V
VIL(min)=–0.3 < Undefined
VOH(max)=1.8 V < Samsung:VIH(max)=VCCQ+0.3 V=2.1 V OK
Toshiba:VIH(max)=VCCQ+0.3 V=2.1 V
Sandisk:
VOL(min)=0 V > Samsung:VIL(min)=–0.3 V OK
Toshiba:VIL(min)=–0.3 V
Sandisk:
As shown in Table 6-1, their levels are compatible.
Table 6-2 MSM8x12 NAND write time sequence
Interface Between the MSM8x12 and DDR RAM
Table 6-3 DDR RAM interface level analysis (TBD)
MSM8x12 EBI0 Electrical Theoretical POP DDR Electrical Characteristics Actual

Characteristics Interface Situation
Level
Mapping
VDD_P1=1.2V VDDQ=1.2 V
VIH(min)=0.65sVDD_P1=0.78V < VOH(min)= 0.9xVDDQ=1.62 V
VIL(max)=0.35xVDD_P1=0.42V > VOL(max)= 0.1xVDDQ=0.18 V

VOH(min)=0.9*VDD_P1=1.08V > VIH(min)=VDDQx0.8=1.44 V for add

VIH(min)=VDDQx0.7=1.26 V for data

VOL(max)=0.1*VDD_P1=0.12 V < VIL(max)=0.2xVDDQ=0.36 V for add
VIL(max)=0.3xVDDQ=0.48 V for data

VIH(max): undefined > Undefined
VIL(min): undefined < Undefined
VOH(max): undefined < VIH(max)=VDDQ+0.3V=2.1 V

VOL(min): undefined > VIL(min)=-0.3 V
Table 6-4 DDR RAM interface time sequence analysis

MSM8x12 Parameter Value DDR Parameter Value Result
tCK TBD tCK 2.5 ns-100 ns
tIH TBD tIH >290 ps
tAC TBD tAC TBD
tDIPW TBD tDIPW 0.35 Tck
tIPW TBD tIPW 0.4 Tck
tIS TBD tIS >290 ps
DDR RAM Interface Write Time Sequence Analysis
tDS TBD tDS >270 ps
tDH TBD TDH >270 ps
tDQSH TBD tDQSH >0.4 tCK
tDQSL TBD tDQSL >0.4 tCK
tDQSS TBD tDQSS 0.75-1.25 tCK
tDSS TBD tDSS >0.2 tCK
tDSH TBD tDSH >0.2 tCK
DDR RAM Interface Read Time Sequence Analysis
tDQSCK TBD tDQSCK 2-10 ns
tDQSQ TBD tDQSQ <1.2 ns
tRPRE TBD tRPRE >0.9 tCK
tQHS TBD tQHS <230 ps
tDV TBD
tRHZ TBD

6.1.3 LCD+Touchscreen Module

LCD Display Module-Uni-screen-TFT-5.0 HD-720x1280-BTB
 Display mode: MIPI
 Data input: serial
 White backlight
Figure 6-4 shows the schematic diagram of the LCD interfaces.
Figure 6-4 LCD circuit diagram
The LCD uses the MIPI-DSI interface, requiring only three pairs of low-voltage differential
signaling (LVDS) cables and one pair of power cables. The LCD interface supports 60 Hz
refresh rate. Table 6-5 provides the definitions of key LCD interface pins.
Table 6-5 Signal definitions

Name in the
Type Description MSM8212/PM8110
Circuit Network
Digital power supply
Power VREG_L6_1P8 VREG_L6_1P8
input
supply
Analog power input VREG_L19_2P85 VREG_L19_2P85
CON_DSI0_DAT MIPI_DSI0_LANE1_N
Signal MIPI LANE 1 A1_N
MIPI_DSI0_LANE1_P
CON_DSI0_DAT

Name in the
Type Description MSM8212/PM8110
Circuit Network
A1_P
CON_DSI0_DAT
A2_N MIPI_DSI0_LANE2_N
MIPI LANE 2
CON_DSI0_DAT MIPI_DSI0_LANE2_P
A2_P
Synchroniz
Synchronization
ation LCD_TEO MDP_VSYNC_P(GPIO12)
signal
signal
CON_DSI0_CLK_
Clock N MIPI_DSI_CLK_N
MIPI clock
signal CON_DSI0_CLK_ MIPI_DSI_CLK_P
P
Reset signal LCD_RST_N GPIO41
Control
signal LCD model
LCD_ID0 GPIO76
identification
Identificati
on signal LCD model
LCD_ID1 GPIO93
identification
Anode of the Anode of the backlight driver
LED_A
Backlight backlight LED chip LED
signal Cathode of the Cathode of the backlight
LED_K1/2
backlight LED driver chip LED
Touch Interface
G630's Touch lens interface uses a 10-pin BTB connector, as shown in Figure 6-5.
Figure 6-5 Touch interface circuit diagram

G630 uses a 5.0-inch GFF touchscreen and the COF scheme. That is, the TP driver IC is on
the TP FPC and belongs to the touchscreen module. G630 TP driver IC uses the CYPRESS
CP7699ATT (TMA463), is connected to the PCBA through a 10-pin BTB connector
14240460/461. The PCBA provides VREG_L14_1P8 and VREG_L19_2P85 to respectively
supply power to the driver IC digital interface/core power supply and the analog power supply.
The PCBA and the touchscreen communicate with each other through a dedicated I2C
channel with the touchscreen as a slave device. After the phone is powered on, the PCBA
starts the touchscreen driver IC through TP_RST_N. After the I2C configuration is complete,
the touchscreen works properly. Upon a touch on the touchscreen, the touchscreen driver IC
generates a TP_INT_N interrupt signal and sends the operation location data through the I2C
bus to the PCBA, thereby implementing the touch identification function.
Component Pin Network MSM8x12 Pin Description
SCL I2C_SCL_TP GPIO_3

Hardware I2C bus
SDA I2C_SDA_TP GPIO_2
INT TP_INT_N GPIO_1 Interrupt signal
RST TP_RST_N GPIO_0 Reset signal
VDD/VCCD VREG_L14_1P8 PM LDO14 Digital/Core power supply
VDDA VREG_L19_2P85 PM LDO19 Analog power supply
6.1.4 Camera
Camera Interface (MIPI)
The MIPI has the following features:
 The rear camera supports a maximum of 8MP resolution and the front camera supports a
maximum of 1MP resolution.
 The rear camera has two pairs of MIPI data lines and the front camera has one pair of
MIPI data line.
 Both the rear camera and the front camera have only one pair of MIPI clock line.
Signal Connection
 8MP rear camera:

Figure 6-6 Rear camera circuit diagram
Table 6-6 Rear camera signal description

Name in the Circuit MSM8x12 Connector
Type Voltage Remarks
Network GPIO Number
LDO power Digital power
CAM_DVDD 1.2 30
supply (PM chip) supply
Camera VREG_L7 (PM
CAM_DOVDD 1.8 32 IO power
power chip)
supply
LDO power
CAM_AVDD supply 2.8 1,34 AVDD, AFVDD
(VPH_PWR)
Camera reference
CAMIF_MCLK0 GPIO13 1.8 6
clock
MIPI_CSI0_LN1
Clock CON_CSI0_CLK_P 1.8 17
_P
MIPI_CSI0_
CON_CSI0_CLK_N 1.8 15
LN1_N
MIPI_CSI0_LN0
CON_CSI0_DATA0_P 1.8 23
_P
MIPI_CSI0_
CON_CSI0_DATA0_N 1.8 21
LN0_N
Data cable Data cable
MIPI_CSI0_LN2
CON_CSI0_DATA1_P 1.8 11
_P
MIPI_CSI0_ 1.8
CON_CSI0_DATA1_N 9
LN2_N
I2C0_SCL GPIO30 1.8 17
I2C I2C control signal
control I2C0_SDA GPIO29 1.8 16

Name in the Circuit MSM8x12 Connector

Type Voltage Remarks
Network GPIO Number
signal Module supplier
MCAMIF_ID GPIO98 1.8 18
identification
MCAMIF_RESET GPIO37 1.8 21 Reset signal
Camera motor
CAM_VCM_PWDN GPIO79 1.8 3
control
Ground GND 0 Others Ground signal
 0.3MP front camera:
Figure 6-7 Front camera circuit diagram
Table 6-7 Front camera signal description

Name in the Circuit Volta Connector
Type MSM8x12 GPIO Remarks
Network ge Number
Negative CAM_DOVDD VREG_L7 (PM chip) 1.8 6 IO power
terminal of
the power CAM_AVDD LDO (VPH_PWR) 2.85 22 AVDD
supply
Camera reference
CAMIF_MCLK0 GPIO13 1.8 16
clock
Clock
CON_CSI1_CLK_P MIPI_CSI1_LN1_P 1.8 13
CON_CSI1_CLK_N MIPI_CSI1_ LN1_N 1.8 11
CON_CSI1_DATA0_P MIPI_CSI1_LN0_P 1.8 23
Data cable Data cable
CON_CSI1_DATA0_N MIPI_CSI1_ LN0_N 1.8 21

I2C0_SCL GPIO30 1.8 7

I2C control signal
I2C I2C0_SDA GPIO29 1.8 5
control
signal MCAMIF_RESET GPIO37 1.8 15 Reset signal
CAM_PWDN GPIO85 1.8 3 Camera control
Ground GND 0 Others Ground signal
6.1.5 FM Interface
The FM is integrated in the WCN3620 and has the following main characteristics:
 FM band: 76 MHz to 108 MHz
 Programmable power output
6.1.6 USIM and TFLASH interface
MSM8x12 USIM Interface

The USIM interface has the following characteristics:
 Selectable clock sources
 Compatible with 2.85 V and 1.8 V USIM card interfaces
 When directly connected to the SIM card, MSM8x12 supports 2.85 V and 1.8 V SIM
card interfaces and provides necessary level conversion.
1. The SIM card interface complies with the following standards:
− GSM 1111 (SIM)
− 3G TS 31101 (UICC) -> moved to ETSI 102221
− 3G TS 31102 (USIM)
− 3G TS 31111 (USAT)
2. The USIM card is compatible with products of the following companies:
− SCHLUMBERGER
− GEMPLUS
− ORGA
− OBERTHUR

− EXCEL DATA/MICROELECTRONICA
3. MSM8x12 is completely compatible with SIM cards with various power levels.
Transient-voltage-suppression (TVS) diodes are added to the circuit to provide ESD and surge
protection, because SIM card operations are frequent.
4. Level interface
The MSM USIM card is powered by the L12 and L15, with incompatibility possibilities. The
range of USIM VDD should be 2.7 V–3.3 V. The voltage of L22/L23 is 2.85 V, with a ±3%
difference, namely, 1.5 V–3.05 V, which is compliant with USIM requirements.
Table 6-8 RUIM interface level

Interface
MSM-side Level Requirements USIM Level Actual
Signal
UIM1_RS Vol(max)=0.45 V < Vil(max)=0.12V OK
T DD
Voh(min)=VDD-0.45 V > Vih(min)=0.8VD OK
D
UIM1_CL Vol(max)=0.45 V < Vil(max)=0.5V OK
K
D
UIM1_DA Vol(max)=0.45 V < Vil(max)=0.15V OK
TA DD
D
Vil(max)=0.35VDD > Vol(max)=0.15V OK
DD
Vih(min)=0.65VDD < Voh(min)=0.7VD OK
D
SD Interface of MSM8x12
MSM8x12 has three SD card interfaces supporting the 1.8 V and 2.85 V levels. SDIO is
compatible with 802.11. The SD/MMC storage card with a maximum of 32G capacity is
supported. The SD interface includes four-bit or eight-bit bidirectional data cable, one
bidirectional command signal, clock, 10K-100K pull-up resistance of SDC_CMD and
SDC_DATA[3:0] signal. Only SDC3 is applicable to an 8-bit interface, and SDC4 is
inapplicable. The software detects SD card insertion and removal. If required by applications,
the AMSS periodically sends commands to check whether the SD card is inserted. If
applications do not need the SD card, the SD card will not work even if it is inserted. The
AMSS also periodically sends commands to check whether the SD card is removed. If no
response is received, it indicates that the SD is removed or is faulty. In addition, the SD card
uses a dedicated EMI filter for effective protection against static discharge.

6.1.7 Headset Jack

G630 headset jack (J1901) is a 3.5 mm 6-hole jack. Headset insertion is detected by pin
CDC_HS_DET of the PM8110.
Before the headset is inserted, CDC_HS_DET is converted to high level by VREG_L6_1P8.
After the headset is inserted, CDC_HS_DET and the left channel are conductive to the ground
and to a low level.
The microphone is supplied with power by PM8110_MIC_BIAS2 and is used for headset
answer detection.
Figure 6-8 Headset jack schematic diagram
Jack Description
The headset jack consists of the right channel, left channel, microphone, and reference
ground.
ESD Protection
Because the headset jack connects to the board, TVS pipe is added to provide ESD and surge
protection.

6.1.8 Battery Connector

Figure 6-9 Battery connector circuit diagram
6.1.9 Proximity Sensor/Tri-color Indicator Interface

G630 has an independent FPC support on the headset support for the proximity sensor and
tri-color indicator so that they are close to the touchscreen glass, therefore reducing the
distance between the proximity component and the phone surface and ensuring the proximity
sensor functionalities.
The proximity sensor/tri-color indicator FPC uses a 10-pin BTB connector 14240692/91 to
connect to the PCBA.
Figure 6-10 Ambient light interface circuit diagram
The PCBA provides the VPH_PWR and VREG_L19_2P85 to respectively supply power to
the analog power supply and the digital power of the proximity sensor IC. The PCBA and the

proximity sensor IC communicate through the I2C channel. All the sensors on the board
function as slave devices and share the hardware I2C channel. After the proximity sensor IC
starts to work, PROXIMITY_INT interrupt signals will be generated upon a proximity light
reflection to instruct the CPU to handle the related process.
Figure 6-11 Tri-color indicator circuit diagram
The tri-color (red, green, and blue) indicator is directly soldered on the board. The tri-color
indicator is a common-anode indicator. The PCBA provides the driver voltage VPH_PWR.
The three indicators are controlled by three GPIOs. Due to limited capability of a GPIO, three
triodes are used. You can adjust the LED brightness by adjusting the resistance connected in
series. To ensure even LED brightness under different battery voltages, serially connect
resistors in the tri-color indicator channel for voltage division.
Table 6-9 Interface signal description

Component Network MSM8x12 Pin Description
Pin
SCL I2C_SCL_SENS GPIO11
Hardware I2C bus
SDA I2C_SDA_SENS GPIO_10
INT PROXIMITY_INT GPIO_80 Interrupt signal
VDD VREG_L19_2P85 PM LDO19 Proximity sensor power
supply
LEDA VPH_PWR VPH_PWR Infrared power supply
LED_A VPH_PWR VPH_PWR Tri-color indicator
power supply
LED_R LED_RED_DRV_ GPIO96 R power supply
N
LED_G LED_GREEN_DR GPIO95 G power supply
V_N
LED_B LED_BLUE_DRV GPIO94 B power supply
_N

6.1.10 Accelerometer Interface

The accelerometer uses ST's LIS3DH and Freescale's MMA8452QR1 and is a highly
integrated three-axis accelerometer. It integrates the gravity sensor and notifies the
acceleration processor of the acceleration through the I2C/SPI interface.
Figure 6-12 shows the accelerometer interface circuit diagram.
Figure 6-12 Accelerometer interface circuit diagram
Table 6-10 Interface signal description

Component Pin Network MSM8212 Pin Description
SCL/SPC/SCLK I2C1_SCL GPIO_11
I2C Bus
SDA/SDI/SDO I2C1_SDA GPIO_10
INT1 ACCL_INT1_N GPIO_81 Interrupt signal
INT2 ACCL_INT2_N GPIO_82 Interrupt signal
VDD_IO Digital interface power
VREG_L6 PM L6
supply
VDD/VS VREG_L19_2P85 PM L19 Power supply

6.1.11 Motor/Key Interface

Figure 6-13 Motor circuit diagram
Parallel 39nF capacitors are used for filtering. The diode is used to prevent reverse current.
The bead prevents interference.
The motor signal, power key, and volume key are connected together through a 6-pin
connector to the PCBA. To prevent key-pressing ESD, three TVSs are added for ESD
protection.

6.1.12 Audio Interfaces and Audio Scheme Codec

Types of Electric Acoustic Interfaces
Speaker: Plays polyphonic ringtones for incoming calls. The maximum power of the speaker
is 500 mW. With good frequency response, the speaker is able to replay 20-20 kHz music as
well as play MP3 in single audio channel.
Receiver: Earpiece used for calls.
Microphone: Built in the phone, including primary and secondary microphones
Headset: Outputs call voice or replays MP3 voice to the earpiece. Meanwhile, a microphone
is built in the headset cable to pick voice and transmit the voice to the phone.
PM8110 Codec Audio Interfaces

The PM8110 integrates the codec function module. Figure 6-14 shows the PM8110 schematic
diagram.
Figure 6-14 PM8110 schematic diagram
The PM8110 has power amplifying circuits for the microphone, headset, and speaker. Three
channels analog inputs and analog outputs are supported.

Details About the Audio Interfaces

Figure 6-15 shows the speaker, microphone, headset, and receiver circuit diagram.
Figure 6-15 Speaker, microphone, headset, and receiver circuit diagram
1. Speaker
Figure 6-16 shows the speaker circuit diagram.
Figure 6-16 Speaker circuit diagram
Voice signals are processed and converted to analog signals by the PM8110, amplified by the
internal Class-D amplifier, and output as differential signals.
Note: An ESD protection circuit needs to be added for each speaker interface line. The
platform has ESD protection; therefore, soldering ESD protection on the platform is preferred.
2. Receiver
Figure 6-17 shows the receiver circuit diagram when the receiver receives differential signal
output from the PM8110.

Figure 6-17 Receive circuit diagram
Note: An ESD protection circuit needs to be added for each receiver interface line. The
platform has ESD protection; therefore, soldering ESD protection on the platform is preferred.
3. Two microphones
Figure 6-18 Primary microphone circuit diagram

Figure 6-19 Secondary microphone circuit diagram
6.1.13 G630 System Power Supply

PM Chip
1. General description on PM power allocation
The PM chip (power management chip) provides two types of programmable voltage
regulators: buck switching power supply and LDO. These voltage regulators are controlled by
a register.
2. LDO
LDO low drop-out voltage regulator is consisted of the following four functional modules: the
reference voltage, control components, feedback path, and error amplifier. The four functional
modules form a closed-loop control system to reduce the gap between the output voltage and
the reference voltage. The system will not adjust the current output. The inputs of the error
amplifier include reference voltage and the scale output of the output voltage generated from
the feedback path. Any difference of the inputs will cause error voltage generated by the
amplifier. The closed loop system changes the control components and therefore changes the
output voltage to decrease the difference to zero. The accuracy of the output voltage does not
vary with the current. Figure 6-20 is the LDC functional block diagram.

Figure 6-20 LDO principles
Reference voltage: The PM chip generates a reference voltage using the trimmed bandgap. Its
accuracy and stability directly affect the output voltage. The closed-loop system offers
percentage feedback; therefore the reference voltage is optional.

G630-U20 Advanced Maintenance Manual 7 Troubleshooting Common Faults
7 Troubleshooting Common Faults
7.1 Startup Failure

Most power-on failures are caused by power supply exceptions. Therefore, you can rectify
power-on failures by troubleshooting power supply circuit faults. Power-on failures are
divided into the following types:
 No current: After you connect the phone to the DC power supply and power on the
phone, the reading on the power supply ranges from 0 mA to 5 mA.
 Weak current: After you connect the phone to the DC power supply and power on the
phone, the reading on the power supply ranges from 5 mA to 100 mA.
 Excessive current: After you connect the phone to the DC power supply and power on
the phone, the reading on the power supply exceeds 300 mA.
If the G630-U10 fails to be powered on, observe the power-on current reading on the DC
power supply to identify the fault.
Figure 7-1 shows the PM8110 power-on time sequence diagram.

Figure 7-1 PM8110 power-on time sequence
Figure 7-2 shows each power supply (including the actual voltages of S power and L power).
Maintenance personnel can test the voltage of corresponding power supplies to locate and
troubleshoot a power fault.
Power test points displayed in the principal diagram can be mapped to parallel power
components on the live network.
S: supplies power to the CPU core, graphics processing module, and USB core: Upon an S1
failure, the CPU and USB will fail and the phone will fail to start up.
S2: supplies power to the 4-core processor. An S2 failure may cause phone startup failure and
no current.
S3: functions as an input for L1, L2, L3, L4, and L5 whereas L1-L5 perform other functions.
S4: supplies power to L6-L10, L14, RF clock, and system clock. An S4 failure will cause the
RF failure and system startup failure.
L1, L9 and L10 are system analog power supplies. An L1/L9/L10 failure will cause the ADC
to read an incorrect value and cause the WTR2605 function to be unavailable.
L2 and L17: supplies power to the RAM and ROM. An L2/L7 failure will cause the phone to
fail to start up and suspend at the Huawei LOGO.
L3: supplies power to the PLL. An L3 failure will cause phone startup failure.
L4: supplies power to the CODEC. An L4 failure will cause audio faults.
L5 andL16: supply power to the Wi-Fi, Bluetooth, and FM. An L5/L16 failure will cause
Wi-Fi, Bluetooth, and FM faults. Power values can be read only if the function is enabled.

L6: is the system IO power supply. An L6 failure will cause a phone startup failure.
L7: supplies power to the cameras. An L7 failure will cause cameras failure. The power value
can be read only if the function is enabled.
L8: provides reference voltage for the ADC to read the power value. An L8 failure will cause
temperature detection failure and board ID detection failure.
L11and L13: internal system power supplies and cannot be measured.
L14: TP power supply. An L14 failure will cause the TP failure.
L12: supplies power to the SIM card. An L12 failure will cause SIM detection failure.
L18/L21: supplies power to the SD card. An L18/L21 failure will cause SD card detection
failure.
L19: supplies power to the microphone. An L19 failure will cause microphone failure.
L22: not used.

Figure 7-2 Power supplies

Figure 7-3 S power circuit
Figure 7-4 L power circuit
 No current

Figure 7-5 Troubleshooting startup failures with no current
Startup failure
Connect the phone to a

fake battery and
maintenance power supply,
press the power key, and
observe the current
No current
Y
Is the key copper foil Clean the key
oxidized?
N
Is the VPH_PWR voltage between
the range from 3.4 V to 4.2 V, and Check the U201
equal to the maintenance power
voltage?
Check the clock

X201
This situation occurs when the main power circuit is short-circuited. Check whether VBUS and
VPH_PWR circuits are short-circuited.
 Weak current

Figure 7-6 Troubleshooting startup failures with weak current
Startup failure
Connect the phoneto a

fake battery and
observe the current
Weak current
N
Check whetherU201 Check the U201
haspartialDC-DC
voltage output
N
Check whether U201
has partial L6/L17 Resolder theU201
voltage output
N
Check whether EMMC Replace the
(U1500) is properly U1500
soldered
Y
Check whether other U201 outputs

are short-circuited
Replace the U201
Replace theU701
If the VPH_PWR voltage is normal, but the U201 output is not, the other output of U201 is probably
short-circuited, which results in the power output exception of the PMU. Check every output of the
U201 to see whether they are short-circuited.
 Excessive current

Excessive current is usually caused by short-circuited power supply circuits (DC power
supply) which may result in 500 mA or greater current leakage. Mostly this fault occurs when
VBAT is short-circuited to ground.
Figure 7-7 Troubleshooting startup failures with excessive current
Startup failure
Connect the phone to a

fake battery and
observe the current
Excessive current
(>500 mA)
Y
Check whether pin 1 Replace the J1601
of J1601 is short-
circuited to the
ground
Check whether the U201 voltage is

normal
Y
Check whether the
capacitor connected Repair the capacitor
to the Vbat is short-
circuited
Resolder or replace
the U201
Startup failure summary:

1. Current leakage in case of excessive current:
When the phone is connected to a regulated power supply, excessive power such as hundreds
of mA current is generated upon a power-on. This problem usually occurs because the VBAT
is generally short-circuited to the ground. It also may be because the VPH_PWR is
short-circuited to the ground. It is earlier to troubleshoot VBAT short-circuit to the ground,

since fewer components (PA, antenna switch, and capacitor) are connected to the VBAT. You
can locate the fault by removing the components separately.
If the voltage on the VPH_PWR circuit is short-circuited, the component removal method is
not applicable. Instead, adjust the DC power output voltage to about 3 V, connect the negative
end of the power supply to the PCB negative end, connect the positive end of the power
supply to the detected short-circuit point, touch the PCB with your hand to locate the hot
position after about 20s, and then remove the hot component.
2. Current leakage in case of weak current:
If the power-on current is weak (generally less than 30 mA), usually the power management
chip, PA, or an ESD protection tube is damaged. It may also be because the EMMC fails to
start up and the program fails to run.
3. No or weak current when you press the power key:
If no current is generated, first check whether the power key fails to work. Then, check the
power supply line to the VBAT. If weak current is gated, measure each output voltage of the
power supply IC. If all IC output voltage is 0, this fault is most possibly related to the PM.
4. After you press the power key, the current sharply changes within a range or remains
unchanged at a fixed value:
This problem is usually due to a CPU or PM communication fault.

7.2 Charging Failure

Figure 7-8 Troubleshooting charging failures
Chargingfailure
N
Is the charger Replace the
functional? charger
Y
Y
Is J1602poorly Resolder the
soldered? J1602
N
Are the battery connector Repair theJ1601
and the battery are in good
contact
Is the battery damaged? Change the

Y battery
Check the U201

7.3 Camera Failure

Figure 7-9 Troubleshooting camera failures
Camera f ailure
Y
Is the problem
solved af ter you re-
End
load the phone
sof tware?
N
Y
Is the J2101 poorly Re-solder or
soldered? replace the J2101
Is the problem Y
solved af ter you
End
replace the
camera?
N
Replace the Y
End
U201
Replace the
U701

7.4 Connection Failure Between the Phone and Computer

Figure 7-10 Troubleshooting connection failures between the phone and computer
Connection failure between

the phone and computer
Y
Is the problem solved after End
you replace the USB cable?
Is the 5-pin mini USB connector Y

poorly soldered?
Resolder the
USB connector
Y
Is the problem solved
End
after you reload the
phone software?
Y
Is there voltage at
VCHG? Replace the U201
Replace the USB

7.5 Call Receiving Failure

Figure 7-11 Troubleshooting call receiving failures
No voice can be heard

af ter a call is set up
N
Is the receiver
End
volume properly set?
Y
Is the insertion of the Replace the
headset misjudged? headset connector
Is the problem Y
solved after you
End
replace the
receiver?
N
Replace the
U701

7.6 Call Sending Failure

Figure 7-12 Troubleshooting call sending failures
No voice can be sent

af ter a call is set up
Y
Is the problem
End
load the phone
sof tware?
N
N
Is the MICBIAS voltage Check the
1.8 V? U201
Y
Is the problem
solved af ter you End
replace the
microphone?
N
Replace the
U701

7.7 Vibration Failure

Figure 7-13 Troubleshooting vibration failures
No vibration
Y
Is the problem
load the phone End
sof tware?
N
Y
af ter you replace the End
motor?
N
Y
Is the VIB_DRV_N
voltage equal to Check the U201
the battery voltage?
Check whether the voltage

dif f erence meets the
requirement f or the motor
operating voltage

7.8 Ringtone Failure

Figure 7-14 Troubleshooting ringtone failures
No ringtone f or
incoming calls
N
Is the ringtone
volume properly set? End
Y
Y
Is the problem
solved af ter you re- End
load the phone
sof tware?
N
Y
speaker?
N Re-crimp or
Is the FPC in good contact?
replace the
FPC
Is the problem solved af ter Y

you replace the volume key End
sub-board?
Replace the
U701

7.9 LCD Display Failure

Figure 7-15 Troubleshooting LCD display failures
No display on the LCD
Y
af ter you re-load the End
phone sof tware?
Is the problem solved Y

af ter you disassemble the
End
phone can re-f asten the
LCD BTB connector?
Is the problem solved Y

LCD?
Is the to-ground-resistance Y Replace the

of T2001/T2002/T2003 is not 0 ohm? U201
Replace the
U301

7.10 Key Failure

Figure 7-16 Troubleshooting key failures
Key failure
N
Are the key dome Clean or
sheets in good replace the
contact? key dome
sheets
Y
Y
Is the problem
solved after you
replace the key End
FPC?
Re-load the
phone
software

7.11 No Sound Coming from the Headset During a Call

Figure 7-17 Troubleshooting procedure for no sound coming from the headset during a call
No voice can be heard f rom the

headset af ter a call is set up
N
Is the receiver
End
volume properly set?
Y
after you replace the End
headset?
N
Is the headset Replace the
icon displayed headset
on the status bar? connector
Replace the
U701

7.12 T-Flash Card Detection Failure

Figure 7-18 Troubleshooting T-Flash card detection failures
T-Flash card detection failure
Y
Is the problem solved End
after you replace the
T-Flash card?
Y
Check whether any T-Flash Replace the slot
card slot pins are tilted
Y
Replace the Z2302 End
Replace the U701

7.13 GPS Signal Reception Failure

Figure 7-19 Troubleshooting GPS signal reception failures
GPS signal reception

failure
Is the GPS
N Replace the GPS
antenna in good
contact with the antenna or spring
spring?
Y
Re-solder or
Is the GPS channel
replace the faulty
poorly soldered?
component
Re-load the
phone software


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G630-U10 Advanced

HUAWEI TECHNOLOGIES CO., LTD.

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Huawei Technologies Co., Ltd.

Issue 01 (2014-04-01) Huawei Proprietary and Confidential i

About This Document

Reviewed by Maintenance support team Date 2014-03-20

Approved by Service representative Date 2014-03-20

2014-03-20 V1.0 Released the first issue. Device R&D sector

Issue 01 (2014-04-01) Huawei Proprietary and Confidential ii

About This Document .................................................................................................................... ii

2 PCBA Working Principles ........................................................................................................... 2

3 Components on the PCBA and BOM ........................................................................................ 7

4 Maintenance Tools ...................................................................................................................... 10

6 Phone Working Principles and Fault Analysis ..................................................................... 23

Issue 01 (2014-04-01) Huawei Proprietary and Confidential iii

7 Troubleshooting Common Faults ............................................................................................ 46

Issue 01 (2014-04-01) Huawei Proprietary and Confidential iv

1.1 Applicable Scope

1.2 Brief Introduction

1.3 How to Obtain Product and Repair Information

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 1

2 PCBA Working Principles

2.1 G630-U10 's Conceptual Block Diagram

Figure 2-1 Conceptual block diagram

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 2

2.2 PCBA Functions

Table 2-1 Modules and sub-modules of each subsystem

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 3

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 4

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 5

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 6

3 Components on the PCBA and BOM

3.1 Components on the PCBA

J1901 headset jack

U2202 gravity sensor

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 7

Figure 3-2 Layout of components and relevant failures (bottom)

J1601 battery MIC1802 secondary

J5005 J5006 main

3.2 BOM List

Table 3-1 BOM code list

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 8

Position BOM Description

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 9

Figure 4-1 Tools for advanced maintenance

Name: GPIB cable

Name: programmable power supply (model:

Name: G630-U10 touchscreen removing fixture

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 10

Name: G630-U10 touchscreen press-fitting tool

Name: physical number modification watchdog

Name: JTAG watchdog

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 11

5.1 Integrated Device Maintenance Workflow

Table 5-1 Maintenance workflow

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 12

5.2 Upgrading the Upgrade&Load Software

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 13

5.3 Writing the Board Bar Code and Work Station

5.4 Conducting the CBT

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 14

Step 7 Set the parameters.

Issue 01 (2014-04-01) Huawei Proprietary and Confidential 15