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CHAPTER 5

RANDOM VIBRATION TESTS ON DIP-PCB ASSEMBLY

5.1 INTRODUCTION

Random vibration tests are usually specified as acceptance,

screening and qualification tests by commercial, industrial, and military
manufacturers of electronic equipment. It has been shown that random
vibrations more closely represent the true vibration environment in which the
electronic equipment has to operate. Random vibration is also popular for
performing accelerated life tests, to estimate approximate fatigue life of
critical elements in electronic assemblies. Hence, random vibration continues
to gain wide acceptance for use in many different testing programs associated
with electronic equipment. The random vibration environments may be
observed in airplanes, missiles, automobiles, trucks, trains, petroleum drilling
machines, steel rolling mills, and numerically controlled machine tools.

Random vibration test has been proved to be a very powerful tool

for improving the manufacturing integrity of electronic equipment by
screening out defective components and defective assembly methods, which
result in a sharp improvement in the overall reliability of the system
(Steinberg 2001). Therefore, electronic packaging designers and engineers
must know the fundamental nature of random vibration and fatigue, in order
to design, develop, and manufacture cost-effective and lightweight electronic
structures that are capable of withstanding harsh random vibration
environments.
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Random vibrations are non-periodic and characterized in terms of

the bandwidth of the frequencies as it consists of many different sinusoidal
frequencies superimposed upon one another. All of the frequencies within the
bandwidth are present simultaneously at any instant of time for every
frequency. When the frequency bandwidth is from 20 to 1000 Hz, every
natural frequency of every structural member between 20 and 1000 Hz will be
excited at the same time. This includes every fundamental natural frequency,
and every higher harmonic of every structural member within that bandwidth.
Knowledge of the past history of random vibration is adequate to predict the
probability of occurrence of various acceleration and displacement
magnitudes, but it is not sufficient to predict the precise magnitude at a
specific instant.

Random vibration environments in the electronics industry

normally deal in terms of PSD (indicated as ‘P’) or mean squared acceleration
density. However, random vibration can also be expressed in terms of
velocity spectral density, and in terms of displacement spectral density.
Accelerations, velocities, and displacements for random vibration are
typically expressed in terms of root mean square (RMS) values.

Many standards such as MIL-810-F, JEDEC JESD22-B103B

(JEDEC, 2006) are used as qualification tests for electronic equipment. Many
electronic package manufacturers such as Motorola, Intel, and AMD follow
their own standards or adopt international standards to test their newly
designed packages.

This chapter deals with the random vibration experiments

conducted on DIP and PCB assembly, and investigations made on the
effectiveness of rubber spacers and pads as vibration isolating devices in a
random vibration environment.
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5.2 RANDOM VIBRATION TESTS WITH PCB ASSEMBLY

MOUNTED ON PLASTIC SPACERS

5.2.1 Experimental Procedure

The test vehicle used for random vibration tests consists of a PCB
and a DIP, having 16 lead wires (8 x 2 rows) as shown in Figure 4.2
(Chapter 4). The random vibration tests are conducted by exciting the PCB
assembly in Z direction (perpendicular to PCB plane) using an
electrodynamic shaker and random vibration software. The input acceleration
PSD used for tests is the condition “D” as specified by the JEDEC standard
and shown in Figure 5.1 and the frequency split up for this level is shown in
Table 5.1. The test was conducted for the duration of 30 minutes.

Figure 5.1 JEDEC test conditions

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Table 5.1 Frequency breakpoints of PSD of level ‘D’ of JEDEC

Frequency (Hz) PSD level, (G2/Hz)

3 0.0001
7 0.003
40 0.003
50 0.013
70 0.013
200 0.001
500 0.001
Input Grms = 1.11

As the random vibrations are non-periodic and follows the

Gaussian (normal) distribution, hence this was checked by collecting the
random vibration signals (acceleration) in time domain using LabVIEW
software and NI-4472 data acquisition (DAQ) card. From Figure 5.2 it is
evident that, the distribution follows normal or the Gaussian nature.

Figure 5.2 Time domain signals and corresponding normal distribution

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The complete test setup for conducting random vibration tests on

the DIP-PCB assembly is as shown in Figure 4.1 (Chapter 4). The PCB
assembly was mounted on an aluminum fixture using four plastic spacers and
steel fasteners. The natural frequencies of the PCB assembly and fixture were
first determined using logarithmic sine sweep test and they are tabulated in
Table 5.2. From the table it is observed that, the natural frequencies of PCB
and fixture are not close to one another.

Table 5.2 Natural frequencies of PCB assembly and Fixture

Frequency (Hz)
PCB Assembly Fixture
46.12 198.69
60.00 238.79
109.10 315.25
141.26 340.50
209.37 416.20
241.45
398.00
462.42

The reference PSD profile as per JEDEC standard, was

programmed using the random vibration test software and is as shown in
Figure 5.3. The input acceleration PSD profile was monitored and controlled
in a closed loop by using an accelerometer (B & K 4513, 8.6 g mass, 100
mV/G sensitivity) placed on the fixture. Another accelerometer (B & K 4517,
0.6 g mass, 10 mV/G sensitivity) placed near the component was used to
measure the response of the PCB assembly.
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Figure 5.3 Input acceleration PSD spectrum (control spectrum)

The response of the PCB assembly measured near the component

and in the Z direction is as shown in Figure 5.4. The area under the curve
(Figure 5.4) represents the root mean square acceleration (Grms) of the PCB
assembly, and from the figure, Grms value is found to be 7.99, and the
acceleration PSD at first resonant frequency is about 6 G2/Hz, whereas the
input PSD at the same frequency is 0.013 G2/Hz. Amplification of PSD level
at resonant frequency will lead to increased Grms and induce more stresses in
component lead wires. Figure 5.5 shows the transmissibility plot which is the
ratio of input acceleration power spectral density and output acceleration
power spectral density (PSDout/PSDin). From this figure it is seen that, the
acceleration PSD is amplified at resonant frequencies of 50 Hz, 210 Hz and
about 500 Hz.
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Figure 5.4 Response of the PCB mounted on plastic spacers

Figure 5.5 Transmissibility plot of the PCB mounted on plastic spacers

During 30 minutes of random vibration test, the failure of the lead

wires was monitored using a failure detecting circuit as shown in Figure 4.3
(Chapter 4). If at any instant of time, any of the lead wire fails; the LED
provided on the circuit will go off or glow intermittently due to opening of the
lead wire.
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The repeatability of the test was checked by performing five trials

and the results obtained are tabulated in Table 5.3.

Table 5.3 Random vibration test results

Trial No. Grms

1 7.64
2 7.99
3 8.01
4 7.86
5 7.98

The single amplitude displacement Zrms, near the component at

resonant frequency fn is calculated using the Equation (5.1).

9.8Grms
Z rms (5.1)
f n2

9.8 x 7.99
= 0.79 mm
502

The RMS displacement (Zrms) experienced by the PCB assembly is

found to be 0.79 mm and the same is validated using spectrum analysis in
ANSYS.

5.2.2 ANSYS Simulation Results

To validate the experimental results, ANSYS, commercially

available finite element analysis software was used to simulate the random
vibration tests. Three-dimensional geometries of the PCB and the DIP along
with lead wires were modeled for the purpose of analysis. PCB, DIP body,
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and lead wires were meshed using 10 node solid 92 elements. The material
properties of the PCB assembly components used in the analysis are tabulated
in Table 4.9 (Chapter 4).

The spectrum analysis was performed by exciting the PCB

assembly using an input random vibration test profile as shown in Figure 5.6
(level D of JEDEC standard). The excitation PSD profile was applied at the
fixed nodes of the PCB holes in Z direction (perpendicular the PCB plane). A
uniform damping ratio of 0.026 was used during the spectrum analysis
(corresponding to the PCB assembly mounted on plastic spacers).

Figure 5.6 Input PSD test profile (level D of JEDEC)

Figure 5.7 shows 1 RMS acceleration (Grms) response of the PCB

assembly, and the Grms acceleration at the centre of the PCB is 8.73
(85.77 m/s2) which is close to the test data (7.99). Similarly, Figure 5.8 shows
the 1 displacement of the PCB assembly due to particular random vibration
input profile. The maximum 1 RMS displacement at the PCB centre is found
to be 0.79 mm which is equal to the displacement value obtained from the
experiment.
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Figure 5.7 1 RMS acceleration plot

Figure 5.8 1 RMS displacement plot

The response acceleration PSD measured at the centre of the PCB

is shown in Figure 5.9, and from this figure it is found that the PSD at first
resonant frequency is about 7 G2/Hz which is again close to the experimental
value.
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Figure 5.9 Response PSD captured at the PCB centre

The comparison of experimental and simulation results are

tabulated in Table 5.4. From the tabulated data it is observed that, the
simulation results are in close agreement with the experimental results.
Therefore, the finite element analysis results such as stress induced in lead
wires of the DIP due to random vibrations will be used to estimate the fatigue
life of lead wires.

Table 5.4 Comparison of Experimental and ANSYS results

Parameters Experimental ANSYS

1 RMS acceleration, Grms 7.89 8.73
1 RMS displacement, Zrms (mm) 0.79 0.79
PSD at first resonant frequency (G2/Hz) 6 7
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5.3 RANDOM VIBRATION TESTS WITH THE PCB

ASSEMBLY MOUNTED ON RUBBER SPACERS
5.3.1 Experimental Procedure

In an attempt to reduce the excessive PCB deflection and

corresponding damage due to random vibration loads, the PCB assembly was
mounted on four rubber spacers (Figure 4.6, Chapter 4) and subjected to,
D level random vibration test. Figure 5.10 shows the acceleration PSD
response when the PCB assembly is mounted on rubber spacers. From this
figure, the Grms acceleration and response PSD levels are found to be 2.72 and
0.7 G2/Hz.

From the test results it is seen that, the Grms acceleration is reduced
by 66%, the acceleration PSD is reduced by 87% compared to the
corresponding responses obtained when the PCB assembly was mounted on
plastic spacers.

(Hz)

Figure 5.10 Response of the PCB mounted on rubber spacers

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Figure 5.11 shows the transmissibility graph when PCB is mounted

on rubber spacers. Using the rubber spacers, the transmissibility ratio is
reduced by 16 % (at first frequency).

(Hz)

Figure 5.11 Transmissibility plot of the PCB mounted on rubber spacers

The RMS (Zrms) displacement at the centre of the PCB when it is

supported on rubber spacers is found to be 0.29 mm (Equation 5.1), on the
contrary, when PCB was mounted on plastic spacers the RMS displacement
was 0.79 mm. Therefore, from these results it can be concluded that, rubber
spacers can be effectively used to reduce the damage to the PCB and the
electronic packages mounted on it by reducing Grms and Zrms levels in a
random vibration environment. Also, the fatigue life of PCB assemblies can
be improved by mounting the PCB assembly on rubber spacers

5.3.2 ANSYS Simulation Results

Spectrum analysis, simulating the PCB assembly mounted on

rubber spacers was carried out in ANSYS following the procedure as
explained in section 5.2.2. A damping ratio of 0.038 (which is obtained from
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sine sweep test) was used in this spectrum analysis. The 1 RMS acceleration
(Grms) value obtained from the simulation is as shown in Figure 5.12, from
this figure the RMS acceleration at the PCB centre is found to be 3.1
(30.41 m/s2).

Figure 5.12 1 RMS acceleration plot

Similarly, 1 RMS displacement (Zrms) plot obtained from the

simulation is shown in Figure 5.13, from which the Zrms at the PCB centre is
found to be 0.29 mm which is close to the experimental value. Figure 5.14
shows the PSD response captured at the centre of the PCB. From this figure
the PSD value at fundamental frequency is found to be about 1 G2/Hz.
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Figure 5.13 1 RMS displacement plot

Figure 5.14 Response PSD captured at the PCB centre

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5.4 RANDOM VIBRATION TESTS WITH PCB ASSEMBLY

MOUNTED ON RUBBER PADS

In an another effort to reduce the PCB responses due to random

vibrations, the longer edges of the PCB were made to rest on the longer faces
of the two rubber pads and fastened to the fixture plate using fastening screws
(refer Figure 4.14 in chapter 4). Now the PCB assembly is subjected to
random vibrations as per JEDEC’s ‘D’ level (Figure 5.1) in a direction
perpendicular to plane of the PCB.

The response of the PCB assembly due to random vibration input is

as shown in Figure 5.15, from which it is observed that, the RMS acceleration
experienced by the PCB assembly is 1.95 and PSD level at first resonant
frequency is 0.4 G2/Hz. Therefore, by using the rubber pads the RMS
acceleration is reduced by 28% and PSD amplitude at first resonant frequency
43% when compared to the corresponding responses when the PCB assembly
was mounted on rubber spacers.

(Hz)

Figure 5.15 Response of PCB mounted on rubber pads

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The transmissibility plot as shown in Figure 5.16 is obtained when

the PCB assembly was mounted on rubber pads. From this figure it is
observed that, the transmissibility ratio at fundamental frequency is further
reduced by about 20 % when compared to the transmissibility of PCB
mounted on rubber spacers.

(Hz)

Figure 5.16 Transmissibility plot of PCB mounted on rubber pads

PCB responses obtained from random vibration tests for the three
mounting methods are tabulated in Table 5.5 for comparison. From the table it
is observed that, the rubber spacers and pads have effectively minimized the
RMS acceleration, RMS displacement and PSD amplitudes of the PCB
assembly in a random vibration environment.

Table 5.5 Comparison of random vibration tests with different mountings

PCB Mounting RMS acceleration PSD RMS

method (Grms) 2
(G /Hz) displacement (mm)
Four plastic spacers 7.99 6 0.79
Four rubber spacers 2.72 0.7 0.29
Rubber pads 1.95 0.4 0.05
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5.5 RESULTS AND DISCUSSIONS

Random vibration tests using level ‘D’ of JEDEC standard as input

profile in Z direction of the PCB assembly was conducted for 30 minutes. The
test results showed that, the 1 Grms acceleration, response PSD, and 1 RMS
displacement are 7.99, 6 G2/Hz and 0.79 mm respectively when the PCB
assembly was mounted on plastic spacers.

By mounting the DIP-PCB assembly on rubber spacers, the Grms

acceleration was reduced by 66%, PSD level by 88% and RMS displacement
by 63%. As the displacement values are reduced, the corresponding stress
amplitudes in lead wires will also be reduced and enhance the fatigue life of
electronic packages. Thus, the rubber spacers act as good vibration isolators
in random vibration environment also and are effective over entire frequency
band.

Other method of reducing the PCB response was that of clamping

the longer edges of the PCB assembly on rubber pads. By mounting PCB on
rubber pads, Grms level was reduced by 66%, PSD level by 93%, and
displacement by 99% (compared to response of PCB mounted on plastic
spacers). Thus, from Table 5.5 it is evident that, by using rubber spacers or
rubber pads, the PCB displacement is greatly reduced and the corresponding
life of electronic packages is improved.