SERVICE M a nua l

TFT - LED TV
Chassis: - 15.6” Combo V59
(V59)
 INDEX
SR. NO. CONTENT
1. Safety Precautions

2. Servicing Precautions

3. Design Procedure

4. Chassis Specifications

5. Operating Specifications

6. SW Installation Procedure

7. Block Diag.& Wiring Diag.

8. Connectors & electrical parameters

9. Critical components

10. CKT. Diagram

11. Trouble shooting

12. Common Abbreviations

2
1. SAFETY PRECAUTIONS

3
4
 2. SERVICING PRECAUTIONS
2.1 General Servicing Precautions:
Always unplug the receiver AC power cord from the AC
power source before:
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug
or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity
installation of electrolytic capacitors may result in an
explosion
hazard
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe. Do not test high
voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any
of its assemblies.
4. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the
following mixture to the contacts with a pipe cleaner,
cotton-tipped stick or comparable non-abrasive
applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture. Unless specified
otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket voltage interlocks with
which receivers covered by this service manual might
be equipped.
6. Do not apply AC power to this instrument and/or any
of its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead. Always remove the test
receiver ground lead last.
8. Use with this receiver only the test fixtures specified in
this service manual. CAUTION: Do not connect the
test fixture ground strap to any heat sink in this
receiver.
2.2 Electrostatically Sensitive (ES) Devices:- Some
semiconductor (solid-state) devices can be damaged
easily by static electricity. Such components commonly
are called Electrostatically Sensitive (ES) Devices.
Examples of typical ES devices are integrated circuits and
some field-effect transistors and semiconductor "chip"
components. The following techniques should be used to
help reduce the incidence of component damage caused
by static by static electricity.
1. Immediately before handling any semiconductor
component r semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
Commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive surface
such as aluminium foil, to prevent electrostatic charge
build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use Freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminium foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
2.3 General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned. 4.
Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle. Do not use Freon-propelled spray-on
cleaners.
5
4. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature (500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction- type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
5. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500°F to 600°F).
b. First, hold the soldering iron tip and solder the
strand against the component lead until the solder
melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
2.4 IC Remove/Replacement:- Some chassis circuit
boards have slotted holes (oblong) through which the IC
leads are inserted and then bent flat against the circuit
foil. When holes are the slotted type, the following
technique should be used to remove and replace the IC.
When working with boards using the familiar round hole,
use the standard technique as outlined in paragraphs 5
and 6 above.
2.4.1 IC Removal:-
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering
iron tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
2.4.2 Replacement :-
1. Carefully insert the replacement IC in the circuit
board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush.
(It is not necessary to re apply acrylic coating to the
areas).
2.5 "Small-Signal" Discrete Transistor
Removal/Replacement:-
1. Remove the defective transistor by clipping its leads
as close as possible to the component body.
2. Bend into a "U” shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
2.6 Power Output, Transistor Device
Removal/Replacement :-
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of
the circuit board.
4. Insert new transistor in the circuit board. 5. Solder each
transistor lead, and clip off excess lead. 6. Replace heat
sink.
2.7 Diode Removal/Replacement :-
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints
of the two "original" leads. If they are not shiny, reheat
them and if necessary, apply additional solder.
2.9 Fuse and Conventional Resistor
Removal/Replacement :-
1. Clip each fuse or resistor lead at top of the circuit board
hollows take.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit
board to prevent excessive component temperatures.
6
2.10 Circuit Board Foil Repair Excessive heat applied to the
copper foil of any printed circuit board will weaken the
adhesive that bonds the foil to the circuit board causing the
foil to separate from or "lift-off" the board. The following
guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections To repair a defective copper pattern at IC
connections use the following procedure to install a jumper
wire on the copper pattern side of the circuit board. (Use
this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as absolutely
necessary).
2. Carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.

At Other Connections Use the following technique to repair

the defective copper pattern at connections other than IC
Pins. This technique involves the installation of a jumper
wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side. Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed
so the it does not touch components or sharp edges.

7
3. DESIGN PROCEDURE FOR 15.6” V59 CHASSIS

DESIGN MENU : -
Method for entering design data: -
Using remote, go to MENU, then go to AUDIO MENU. Then press
remote Digit keys 8 5 3 2 , then it enters in Design Menu.

CONNECTIVITY VIEW: -

8
DESIGN DATA FOR 15.6" V59 CHASSIS

VIDEO ADJUSTMENT PARAMETERS: -

Brightness 0 /25 / 50 / 75 / To adjust Picture Brightness level at
100 different levels 0-25-50-75-100
To adjust Picture Contrast level at
Picture Curve

Contrast 0
different levels 0-25-50-75-100
To adjust Picture Colour Saturation level
Saturation 0
at different levels 0-25-50-75-100
To adjust Picture Hue level at different
Hue 0
levels 0-25-50-75-100
To adjust Picture Sharpness level at
Sharpness 0
different levels 0-25-50-75-100
value

Parameter to adjust the AGC for tuner

AGC

60
used.
Source
Color Temp Mode: Normal/Cool/Warm
R-Gain
Parameters to adjust white balance of
G-Gain
LCD. These parameters are different for
B-Gain
different sources and vary panel to
R-Cut
panel. Also these settings are different
G-Cut
for Colour temperature modes.
B-Cut
White Balance

Sub Brightness
Parameters to adjust source offsets.
Sub Contrast
WB Offset
Color Temp Mode: Normal/Cool/Warm
R-Gain Offset
Parameters to adjust white balance of
G-Gain Offset
LCD. These parameters are different for
B-Gain Offset
different sources and vary panel to
R-cut Offset
panel. Also these settings are different
G-cut Offset
for Colour temperature modes.
B-cut Offset
Sub brightness Offset
Parameters to adjust source offsets.
Sub Contrast Offset
9
 Panel selection
parameter. After
selection of proper
Panel Type
panel type, it
automatically selects all
panel parameters.

Scroll for panel

Panel Type Panel type selection
type selection
Scroll for design set
Panel Design Set Design data selection
selection
Control
Selection for LVDS
LVDS Mapping Depend on panel
mapping 0 or 1

Back Light Backlight type selection

Depend on Panel
Way for DC/PWM

Parameter used for

Backlight
positive or negative off
Reverse
backlight variation
Back Light To adjust Backlight
Depend on Panel
Curve curve 0-10

Note:- Video settings for Different source may be different

depending on auto white balance settings and may vary panel
to panel.

10
AUDIO ADJUSTMENT PARAMETERS: -
Audio Data Select audio data as per cabinet and
Selection model.
Source
OSD_0
OSD_25 Parameters used to adjust the audio
Audio Curve
OSD_50 curve of model. This audio curve
OSD_75 may vary from model to model.
OSD_100
Audio Output Parameter used for woofer/Non
2.0CH
Select woofer model
Selection for audio as per model.
Speaker Automatically selects all above audio
selection parameters i.e. all audio parameters
are assigned to this parameter.
Audio On Music
10
Used for adjusting power on music
Vol. volume
Audio Mode Music/Standard/Speech/User
Treble
Bass
Audio Mode 120Hz Parameters used to adjust the audio
500Hz curve of model. This audio curve
1.5KHz may vary from model to model.
5KHz
10KHz
120Hz Parameters used to adjust the audio
500Hz curve of model. This audio curve
Band Max 1.5KHz may vary from model to model.
5KHz Bandmax parameters are different
10KHz for different audio modes.

Note:- Audio settings for Different AV source audio modes may be

different depending on measurements. 11
SETUP DESIGN PARAMETERS
Mode Parameter Data Description
Clear By doing Clear EEPROM, all design
EEPROM parameters get reset to default values
Remote Option selection i.e.
IR Select VIDEOCON
Videocon/SANSUI remote option.
Keyboard This is to select TV keys 05 keys or 07
7 Keys
Select keys – Model dependant.
If make ON, then Red/Green/Blue screen
Burning Off
flash. Used for manufacturing only.
Paraneter for default condition after mains
Power
Off ON i.e. set should go to stand by of
Status
directly ON.
Boot
OFF Not Applicable.
Logo
TV
AV1
AV2
Source Source selection. This is as per model
YPBPR
Switch design data.
SETUP VGA
HDMI
Multiimedia
M-Mode Off To make On/Off Manufacturing Mode.
Clone Out
To create E2P from design data to USB.
Data
Clone Clone Out
To load E2P in Set from USB.
Into
CheckSum Checksum of E2P.
Audio
127 (default value not to change)
Prescaler
OSD
To change OSD language.
Language
Feature
switch Ecovision To make ON/Off Eco vision feature.
Energy Meter To make ON/Off Eco vision feature.
To make ON/OFF backlight parameter in
Back light 12
User menu.
 Sub
Mode Parameter Default Data Description
Parameter
Demo EOPS To make E-OPS ON/OFF
To select different default E-
EOPS MODE
OPS combinations.
Demo EOPS Select no. of functions in E-
Icon Num.
OPS
To define function to display
Pos 1 to 6
on different positions.
CEC To make CEC function
ON
Function ON/OFF
Hotel Mode ON To make Hotel mode ON/OFF
To make Timer menu
Timer Menu OFF
ON/OFF. Default is OFF.
Blue Back OFF To make Blue Back ON/OFF
FEATURE
SETUP USB mode Movie USB To select JPEG/MPEG USB.
SWITCH
Key Indication To select position of key
Position indicator on screen
Key Indication Start To set position of indicator
To set functionf on different
Pos 1 to 7 positions of Key press
indicaator, as per model
Key
Indication Key 1/2 Gap
Setting
Key 2/3 Gap
Key 3/4 Gap To maintain gap between
Key 4/5 Gap different keys.

Key 5/6 Gap

Key 6/7 Gap

Note: -
1.) The design parameters may vary depending on model. So, kindly follow the
design data provided with each model.
2.) Clear EEPROM option is at first position in setting design data, so care should
be taken that OK key should not be pressed here, unless and until required, other
wise, Clear EEPROM will execute and all design data (Audio & Video factory
settings) will be erased.
13
4. CHASSIS SPECIFICATIONS
PARAMETERS SPECS REMARKS
NUMBER OF PROGRAMS 200
TUNING SYSTEM FS
COLOUR SYSTEM PAL
NTSC PLAYBACK YES Only in AV
SOUND SYSTEM BG
CHANNEL NAME YES IN PROGRAM EDIT
MANUAL SEARCH YES
ANALOG
TUNNING FINE TUNE YES
SKIP YES
EXCHANGE CHANNEL (SWAP) YES IN PROGRAM EDIT
INSERT CHANNEL YES IN PROGRAM EDIT
COPY CHANNEL YES IN PROGRAM EDIT
DELETE CHANNEL YES IN PROGRAM EDIT
AUTO DETECTION COLOR AND
YES
SOUND
VIVID/HI-BRIGHT/CINEMA/
SELECTABLE PICTURE MODES 5 MODES
SPORTS/USER
Color Transient Improvement YES
DNR YES 3D
ADAPTIVE LUMA CONTROL YES
ZOOM MODE AUTO/4:3/16:9
COLOR IMPROVEMENT YES
3:2 2:2 PULL DOWN YES Inbuilt
DIGITAL COMB FILTER YES 3D
PICTURE
FREEZE YES
BACKLIGHT ADJUST YES
COLOUR TEMP YES NORMAL/COOL/WARM
AUTO ADJUST (IN PC) YES
H POSITION (IN PC) YES
V POSITION (IN PC) YES For VGA Source
PHASE (In PC) YES
CLOCK (In PC) YES
3D NOISE REDUCTION YES 14
 SELECTABLE SOUND
4 MODES USER/SPEECH/STANDERED/MUSIC
MODES
AUTO VOLUME LEVELLER YES
AUDIO OUTPUT POWER
(RMS)
8W x 2 (+/-2w)
AUDIO
MUSIC MODE YES Eco Vision =Audio Only
BASS / TREBLE / BALANCE YES/YES/YES
EQUALIZER 5 BAND 120Hz/500Hz/1.5KHz/5KHz/10KHz
NO.OF SPEAKERS 2
CLOCK YES
ON CHANNEL YES
OFF TIME YES Timer Features are Optional
TIMER ON TIME YES
SLEEP TIMER YES
CLOCK DISPALY YES
AUTO SWITCH OFF YES
PROGRAM DIRECTORY YES
OFF/ LOW/ MID /HIGH/AUDIO
ECO VISION YES
ONLY
QUICK VIEW YES
HOTEL MODE YES
VOLUME LOCK YES In Hotel Mode
TUNING LOCK YES In Hotel Mode
FEATURES CHANNEL LOCK -CHILD
YES (RF SOURCE)
LOCK
FRONT PANEL KEY LOCK NO
Start on predefined
YES In Hotel Mode
Source
Start on predefined
YES In Hotel Mode
Channel NO.
ENERGY METER YES
BOOT UP SOUND YES
SPECIAL SMART CONNECT HDMI CEC
YES
FEATURES
FAMILY FAVOURITE YES

15
 RF IN YES
AV1 IN YES
AV2 IN NO
CONNECTIVITY

AV OUT YES
YPbPr/YCbCr YES Conectivities
USB INPUT (2.0 present aat rear
YES
SUPPORT) side of TV.
HDMI INPUT YES
Earphone Out Yes
PC AUDIO IN YES
PC(VGAMODEL
PANEL IN) NO YES
AUO - B156XTN02.2
SCREEN SIZE &
PANEL SPECIFICATIONS

TYPE 15.6" PANEL

ASPECT RATIO 16:9
RESOLUTION 1366(H) X 768 (V) SPECIFICATION
ARE SUBJECT TO
DISPLAY AREA(H x V) 344.23 X 193.54 CHANGE WITH
PIXEL PITCH 0.252 X 0.252 PANEL TYPE NO
CONTRAST RATIO 500 (Typical)
BRIGHTNESS 220 cd / m2
45°(H) / 45°(V-TOP) 15°(V-
VIEWING ANGLE
BOT)
OPERATING TV Operating
110V-240V~ at 50/60Hz
VOLTAGE voltage range.
RATING

Average power
POWER consumption by TV
35 W (Avg.)
CONSUMPTION in Standard
operating condition.
ACCESSORIES

REMOTE HANDSET V-MT 22 (V-2BG)

BATTERY CELL 2 "AAA" Batteries Accessories
provided with TV.
RCA CABLE NA Dependants on
USER'S GUIDE model BOM.
YES
BOOK
16
 5. OPERATING SPECIFICATIONS
CHASSIS/PANEL SPECIFICATIONS: -

17
MULTIMEDIA SUPPORT SPECIFICATIONS

18
SOURCE WISE RESOLUTION SUPPORT

19
6. SW & E2P INSTALLATION PROCEDURE
The ATV SW installation in 15.6" V59 chassis can be done with USB in three ways.
1.) SW & E2P Installation through USB in Set stand by condition.
2.) SW & E2P Installation through USB in Set ON condition.
3.) SW Installation through MST Tool.

A.) SW INSTALLATION THROUGH USB IN STAND BY CONDITION: -

Copy the SW (.bin) file in USB to root

1
directory.

Rename the SW file name as

2 “VIDEOCON.bin” for Videocon brand TV and
“SANSUI.bin for SANSUI brand TV.
3 Keep the TV set in Power OFF condition.
4 Plug in the USB drive in USB port of the TV.

5 Turn ON the Mains power of TV set.

Now after a few sec., RED LED indicator of

6 TV will start blinking, indicating the SW/E2P
is loading.

After a few sec. LED blinking will stop and

7 SW loading is finished. Then follow below
steps.

20
 After SW update, go to Design Menu by
7
Pressing MENU => AUDIO MENU => 8 5 3 2

Go to Setup design menu and Select Clear

8
EEPROM option and press OK key of remote.

After Clear EEPROM, the set will go to stand

9 by and will again restart automatically in RF
source.

Then verify the modelwise Audio/ Video

settings as per Design data (in PLM). Verify
10
the SW date and version in Version info in
Design data

Then press Shipping in Setup design menu by

pressing OK key of remote, after shipping set
displays “SHIPPING FINISH” message, then
11
Switch OFF the set from main power and
again Switch ON. The SW loading process Is
complete.

21
B.) SW INSTALLATION THROUGH USB IN ON CONDITION: -

1 Copy the SW (.bin) file in USB to root directory.

Rename the SW file name as “VIDEOCON.bin” for
2 Videocon brand TV and “SANSUI.bin for SANSUI
brand TV.
Turn the TV set ON and insert the USB in USB port
3
of TV set.

Press Menu key of remote, go to setting menu and

4
press OK on Software Update Menu.

It will give pop up window asking upgrade SW or

not? Press left arrow key here. The SW update will
5
start and LED will start blinking, indicating SW
upgrade is in process.

Also, indicator screen will appear o screen

showing SW loading progress.
6
Once SW update is started, do not switch OFF the
TV set.

After SW update is complete, the TV set will

7
automatically go to stand by mode and will restart.
Turn ON the TV set from stand by and follow
8
below steps.

22
STEPS TO FOLLOW AFTER SW INSTALLATION: -

After SW update, go to Design Menu by

9
Pressing MENU => AUDIO MENU => 8 5 3 2

Go to Setup design menu and Select Clear

10
EEPROM option and press OK key of remote.

After Clear EEPROM, the set will go to stand

11 by and will again restart automatically in RF
source.

Then verify the modelwise Audio/ Video

settings as per Design data (in PLM). Verify
12
the SW date and version in Version info in
Design data

Then press Shipping in Setup design menu by

pressing OK key of remote, after shipping set
displays “SHIPPING FINISH” message, then
13
Switch OFF the set from main power and
again Switch ON. The SW loading process Is
complete.

23
Note: -
1. Kindly DO NOT SWITCH OFF THE TV SET, While SW/E2P upgrade
is in process.
2. In M-Mode, if press stand by key of remote, then M-Mode
becomes OFF.
3. Can not update SW through USB if set is permanently in Stand
by. In this case, use MST jig to load SW.
4. If required to load Videocon SW in SANSUI brand chassis with
SANSUI SW, then rename the SW file as “SANSUI.bin”.
5. If required to load SANSUI SW in Videocon brand chassis with
Videocon SW, then rename the SW as “VIDEOCON.bin”.

24
E2P UPLOAD THROUGH USB : -
After SW update, go to Design Menu by
1
Pressing MENU => AUDIO MENU => 8 5 3 2
Go to Setup design menu and Select Clear
2
EEPROM option and press OK key of remote.
After Clear EEPROM, the set will go to stand
3
by and will restart automatically in RF mode.
Then, take E2P in USB. File name for E2P will
4 be for VIDEOCON=> VDC_182VG_EEP
For SANSUI=> SAN_182VG_EEP.

Insert the USB in USB port of TV. Then go to

5
Design data=>setting Menu=> Clone option.

In Clone Option go to second option “Clone

data Into” and press right navigation key to
load the E2P file.
6
Note: - If E2P file is not detected, then it will
show “Fail”. Then verify the file name is
correct and the E2P file is in root directory.
If File name is OK, then the E2P will be
7 loading and LED blinking will be there. After
E2P loading successful, then set will restart.
After E2P loading, do the shipping, as
8
explained in SW loading procedure.

25
E2P DOWNLOAD/CREATE FROM TV SET IN USB: -
If required to make E2P file from any set in the field, then follow below
steps.

Set up required design data and user data in

the TV Set from which E2P is to be prepared
1 and inset USB in the TV set. Before inserting
USB in TV, be sure that there is no SW or E2P
present in USB drive.

Go to design data => Setting Menu=> Clone

2
Option.

Then select first Option “Clone Out Data”, to

3
make E2P.

Then Press Right navigation key on this option.

If USB is detected, then E2P will be copied in
the USB connected and “SUCCESS” message will
4 be displayed on screen and Checksum of the
E2P will be displayed. Checksum will change if
any changes are made in TV and again E2P is
downloaded.
Thus E2P will be ready to use for other
5
model/TV set.

26
SW INSTALLATION THROUGH JIG: -
Step1: - First Connect MST SW loading Jig to USB port of PC and 04 Pin Header
XS352 on chassis (near AV socket). SW loading jig is common with MST719 Jig.
MST Tool is also same as MST719.

Step2: - Kindly confirm pin configuration of Jig conn. should be

+5V/3.3V, RXD, TXD, GND, which is same as MST719 Jig. Connect the
Jig to chassis, then Red LED indicator on Jig will glow if it is connected
properly.

Step3: - Open ” ISP_Tool_4502.exe” on your PC .(Tool version may be

different).

27
Step4: - After opening tool, Press connect. If Jig is properly connected, then it
will select the chip automatically. If chip is not selected automatically, then go to
Device option in Jig and select the Chip from SPI list WIN25X32 or WIN25Q32
(the device may differ than mentioned here).
Then open the MSTV tool and select Baud rate 11500 (as shown below) and
select the COM Port (confirm COM port from your Computer properties, may
be different for different PC).

COM Port and Baud Rate selection from MSTV Tool

28
Step5: - Then go to option of ISP tool and select the SW file (.bin file).

Step6: - Then select option of ISP tool and after setting, press RUN in

Auto window, then SW loading will start as shown below.

Note: - 1.) Before running SW, uncheck options Reconnect, lank, Restore data,
Multi flashes, Verify, as these actions are not required.
2.) Kindly DO NOT SWITCH OFF TV Set or PC while SW loading or do not
disconnect the Jig from PC while SW loading.

29
Step7: - After Successful SW loading it will show PASS, as shown in below
window.

Step8: - After Successful SW loading follow below steps for Shipping.

30
 After SW loading is complete i.e. 100%,
1 the set will go to stand by automatically
and will restart again.

The set is in M-Node now. Then go to

2 Design Menu by Pressing MENU =>
AUDIO MENU => 8 5 3 2

Go to Setup design menu and Select Clear

3 EEPROM option and press OK key of
remote.

After Clear EEPROM, the set will go to

4 stand by and will again restart
automatically in RF source.

Then verify the modelwise Audio/ Video

settings as per Design data. Verify the SW
5 date and version in Version info menu of
Design data

Then press Shipping in Setup design menu

by pressing OK key of remote, then Switch
6 OFF and again Switch ON the SET. The SW
loading process Is complete.

31
7. 15.6" V59 LED BLOCK DIA. AND WIRING
DIAGRAM
MAJOR COMPONENTS IN 15.6" V59 LED CHASSIS
SR. MAJOR IC WITH FUNCTIONS
1 N401 TSUMV59XU-Z1 EPLQFP 100 pins is the main micon.
Power management of LDO output voltage is as follows:
a.N505 output voltage :1.8V +-0.1V
2
b.N411 output voltage :3.3V +-0.1V
c.N503 output voltage :3.3VSB +-0.1V
Tuning circuit of tuner type is NXP silicon tuner,
3 The color system NTSC/PAL/SECAM and sound system
BG/DK/I.
N800 TPA3110LD2 is the digital audio amplifier, Output
4
power option 2x10W stereo.
N403 MX25L1606E12G is the FLASH IC for software
5
storage and operation

BLOCK DIAGRAM 15.6" V59-LED CHASSIS

32
MAIN CHASSIS (ACTUAL PHOTO): -
USB IN RF IN VGA
AUDIO IN

FFC

VGA IN
SOCKET

12V
MOSFET

HDMI IN
MICON
V59
FLASH IC
Panel Vcc
IC

YPbPr
5V Stand by

IN
Regulator

3.3V Stand by
Regulator
AVI

MOSFET
IN

AUDIO IC
EARPHONE VIDEO

3110LD2
OUT

FUSE
IN

IR/KEY SPEAKER
CONN O/P 33
8. Connectors and Electrical Parameters

IR & KEYBOARD CONENCTOR (XS605)

AUDIO CONNECTOR CONFIGURATION

AUDIO OUTPUT CONN (XS901)

NO. Symbol Function
1 L_OUT+ L_OUT+
2 L_OUT- L_OUT-
3 R_OUT- R_OUT-
4 R_OUT+ R_OUT+

34
9. CRITICAL COMPONENTS & MODEL MATRIX
CRITICAL COMPONENT LIST
SAP CODE Description Q'TY Parts Location
1100104510 C,MPOL,275VAC,220KPF,M,25X7X16P15MM,CE 1 CX700
1100043109 CAP,CER,Y5U,400VAC,1KpF,M,10MM 1 CY704
1100104529 THERMISTER,NTC MF72-5D9 1 RT70
1100104517 FUSE,5ET3.15A,250V,BOX 8*4mm 1 F700
L805 L806 L807
1100104512 COIL,SMD,22UH,1.1A-20% PI054 4
L808
1100104513 COIL,SMD,6.8UH,1.4A-20% PI043 1 L501
1100104514 COIL,SMD,6.8UH,2A-20% PI054 1 L511
1100043182 TRANSISTOR,CW431AZTA,TO-92 1 N702
1100043194 IC,OPTO-COUPLER,KP10101B/KPC817B,DIP-4 1 N704
1100104520 IC,CHIP,MP1470 ,DC/DC 2A SOT23-6 1 N501
1100096087 IC,CHIP,EPLQFP,100Pin,NTSUMV59XU,EZ 1 N401
1100049334 IC,CHIP,SOP8,MX25L3206E 1 N403
1100094012 IC,PWM,28V,300 MA,OB2263MP,SOT23-6 1 N700
1100094010 IC,CHIP,SOT23-5-1,SY8008B 1 N551
1100087580 IC,CHIP TDA18273 for Silicon Tuner 1 N410
1100094015 IC,CHIP,TSSOP28,TPA3110L 1 N800
1100047970 IC,CHIP,SOT223,G1117-3.3V 2 N411 N503
1100036840 IC,CHIP,TO223,AZ1117ADJ 1 N505
1100104519 IC,CHIP,SOT-23,ME2345A 1 Q502
IC,CHIP,SOIC8,QM3001S/CEM9435A/AM9435P/WP
1100036848 1 N502
M9435
1100077466 CRYSTAL,HC49,24MHZ,+/-20PPM,20PF,MST182 1 X601
1100090707 CRYSTAL,HC49,16MHZ,+/-20PPM,10PF 1 X401
1100043197 VARISTOR,560V,25AMP,TVR10681KSY 1 RV01
1100104521 PCB,FR4,15.6" V59-LED,15.6 S-LED,200X88MM 1 PCB
1100104509 C,ELCT,500V,47MFD,M,18x25,P7.5MM,105°C 1 C740
1100104516 DIODE,MBRS10100C-TO263 1 D720

1100104511 COIL INDUCTANCE/ LCL-20-088 & UU9.8 10mH 1 L708

1100104530 TRANS,N-MOSFET,650V/7A UTC7N65L,TO263 1 V700

1100104531 TRANSFORMER, SANHE-25-138 ,& EFD25-450uH 1 T700

1100100804 DIODE,CHIP,DO15,FR207 1 D705

D700 D701 D703
1100093177 DIODE,CHIP,DO15,RL207 STAR SEA 4
D704

35
11. 15.6” V59 TROUBLE SHOOTING

A.) Set Dead or Stand By

First confirm the AC power supply

switch is OK. And then check RED
LED is ON

Normal
Abnormal
Check if 12VSTB supply at D720 is
OK or not.

Normal
Abnormal
Check if +5VSTB supply at N501 is
OK or not.

Normal

Abnormal
Check Regulator Voltage N503 –
3.3V STB is OK or not.

Normal
Check al working voltages are Abnormal
coming at micon V59, Flash IC
N403. Check if SW loading is
possible

Normal
If all the working conditions are
normal, but still the chassis can not
power ON, the please try to replace
the main chassis..
36
B.) No Picture Condition

Check FFC Conn and LED driver

Abnormal
Connect properly
Conn. remove and re-connect.

Normal
Abnormal
Check the Panel VCC voltage 3.3v Check the Power
at R515 is coming OK or not supply area

Normal

Check 12 V supply is coming at Abnormal

LVDS conn. pin no. 1,2,3,4 of
XS408 / XS405.

Normal

Check backlight signals at BL

ON/OFF & BL_ADJ pins

Normal
Press ECO key of remote 2-3 times
to change backlight value
(backlight curve in chassis may be
reverse).
If change If display come then go
to design data & adjust
Backlight curve as per
model design data.

No Effect
Upload SW/E2P in the TV set if TV
is in M-Mode.

No Effect

Panel Problem Panel Problem

37
C.) BACKLIGHT ON & NO VIDEO

First check if FFC Conn. is

Abnormal 1.Re-fix the FFC conn.
connected OK. Remove and
2.If not ok, Change the
check if all pins of FFC conn. are
FFC conn.
normal.
Normal

1.Check Supply at pin

Check if FFC supply voltage 12V Abnormal 38-40 is coming or not?
is connected and normal. 2. Check supply at D720
is OK
Normal
If other TV OSD are coming, Check if input cables are
then check weather input source Abnormal connected properly.
Video is connected properly to Change the cable and re-
TV. check again.

Normal
Upload SW/E2P of that model in
the TV set.

No Effect
If all the conditions are normal, but
still problem is present, then try to
change the chassis/Panel

38
D.) No Sound Condition

First check the audio source Abnormal Re-connect the input cables to
Input is proper. Also check all
TV and source properly.
audio inputs given to TV are OK.

Normal
1. Re-connect the speaker
Check Speaker conn. is Abnormal conn. in header XS801.
connected properly to TV or not
2. If damaged change the SPK.
damaged
Conn., SPK. /Spk Box assy.

Normal
If 12V not coming then check if
Check the power supply 12V is Abnormal 12V is coming at R806. Also
coming at R811 i.e. VCC pin of
check if Mute Pin no. 1/2 of IC
audio IC.
N800.
Normal
Normal
Check if O/P coils of Audio IC
L805/806/807/808 are OK or not.

No Effect
If all the conditions are normal, but
still problem is present, then try to
replace the Audio IC TPA3110LD2
or replace the main chassis.

39
12. Common Abbreviations

COMMON ABBREVIATIONS USED IN AUDIO/VIDEO

TFT Thin Film Transistor
LCD Liquid Crystal Display
LED Light Emitting Diode
PSU Power Supply Unit
Conn Connector
SCL Serial Clock
SDA Serial Data
PAL Phase Alteration by Line (Color System)
NTSC National Television System Committee
SECAM Sequential Color And Memory
DNR Dynamic Noise Reduction
AVL Auto Volume Leveller
PWM Pulse Width Modulation
VGA Video Graphics Array
SVGA Super Video Graphics Array
X-VGA Extended Video Graphics Array
W-XGA Wide Extended Graphics Array
DAC Digital to Analog Converter
ADC Analog to Digital Converter
USB Universal Serial Bus
HDMI High Defination Multimedia Interface
CVBS Composite Video Baseband Signal
LVDS Low Voltage Differantial Signal
EEPROM Electrically Erasable Programmable Read Only Memory
DDR Dual Data Rate Memory
LDO Low Drop Output Regulator
Tx Transmission
RX Receiption
UART Universal Asynchronous Receiver & Transmitter
SW Software
CEC Consumer Electronic Control 40