Anda di halaman 1dari 11

Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


General Description Features

The AP3015/A are Pulse Frequency Modulation · Low Quiescent Current


(PFM) DC/DC converters. These two devices are func- In Active Mode (Not Switching): 17µA Typical
tionally equivalent except the switching current limit. In Shutdown Mode: <1µA
The AP3015 is designed for higher power systems · Low Operating VIN
with 350mA current limit, and the AP3015A is for 1.2V Typical for AP3015
lower power systems with 100mA current limit. 1.0V Typical for AP3015A
· Low VCESAT Switch
The AP3015/A feature a wide input voltage. The oper-
ation voltage is ranged from 1.2Vto 12V (1V to 12V 200mV Typical at 300mA for AP3015
for AP3015A). A current limited, fixed off-time con- 70mV Typical at 70mA for AP3015A
trol scheme conserves operating current, resulting in · High Output Voltage: up to 34V
high efficiency over a broad range of load current. · Fixed Off-Time Control
They also feature low quiescent current, switching cur- · Switching Current Limiting
rent limiting, low temperature coefficient, etc. 350mA Typical for AP3015
100mA Typical for AP3015A
Fewer tiny external components are required in the · Operating Temperature Range: -40oC to 85oC
applications to save space and lower cost.
Furthermore, to ease its use in differnet systems, a dis- Applications
able terminal is designed to turn on or turn off the chip.
· MP3, MP4
The AP3015/A are available in SOT-23-5 package.
· Battery Power Supply System
· LCD/OLED Bias Supply
· Handheld Device
· Portable Communication Device

SOT-23-5

Figure 1. Package Type of AP3015/A

May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

1
Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


Pin Configuration

K Package
(SOT-23-5)

SW 1 5 VIN

GND 2

FB 3 4 SHDN

Figure 2. Pin Configuration of AP3015/A (Top View)

Pin Description

Pin Number Pin Name Function

1 SW Switch Pin. This is the collector of the internal NPN power switch. Minimize the trace area
connected to this Pin to minimize EMI

2 GND Ground Pin. GND should be tied directly to ground plane for best performance

3 FB Feedback Pin. Set the output voltage through this pin. The formula is VOUT=1.23V*(1+R1/
R2). Keep the loop between Vout and FB as short as possible to minimize the ripple and noise,
which is beneficial to the stability and output ripple

4 SHDN Shutdown Control Pin. Tie this pin above 0.9V to enable the device. Tie below 0.25V to turn
off the device

5 VIN Supply Input Pin. Bypass this pin with a capacitor as close to the device as possible

May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

2
Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


Functional Block Diagram

FEEDBACK
COMPARATOR
3
FB ENABLE 1
SW

400nS
5 VREF ONE SHOT DRIVER Q1
VIN

Bandgap
RESET

4 CURRENT-LIMIT
SHDN REFERENCE GND
CURRENT-LIMIT 2
COMPARATOR

Figure 3. Functional Block Diagram of AP3015/A

Ordering Information

AP3015 -

E1: Lead Free


Circuit Type G1: Green
TR: Tape and Reel
Blank: AP3015 Package
A: AP3015A K: SOT-23-5

Temperature Part Number Marking ID


Package Packing Type
Range Lead Free Green Lead Free Green
AP3015KTR-E1 AP3015KTR-G1 E6E G6E Tape & Reel
SOT-23-5 -40 to 85oC
AP3015AKTR-E1 AP3015AKTR-G1 E6F G6F Tape & Reel

BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with
"G1" suffix are available in green package.

May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

3
Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


Absolute Maximum Ratings (Note 1)

Parameter Symbol Value Unit

Input Voltage VIN 15 V

SW Voltage VSW 38 V

FB Voltage VFB VIN V

SHDN Pin Voltage VSHDN 15 V

Thermal Resistance (Junction to Ambient, no Heat sink) RθJA 265 oC/W

Operating Junction Temperature TJ 150 o


C

Storage Temperature Range TSTG -65 to 150 o


C

Lead Temperature (Soldering, 10sec) TLEAD 260 o


C

ESD (Human Body Model) 3000 V

Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Max-
imum Ratings" for extended periods may affect device reliability.

Recommended Operating Conditions


Parameter Symbol Min Max Unit
AP3105 1.2 12
Input Voltage VIN V
AP3105A 1.0 12
Operating Temperature TA -40 85 oC

May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

4
Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


Electrical Characteristics
(VIN=VSHDN=1.2V, TA=25oC, unless otherwise specified.)

Parameter Symbol Conditions Min Typ Max Unit


AP3015 1.2 12
Input Voltage VIN V
AP3015A 1.0 12
Not Switching 17 30
Quiescent Current IQ µA
VSHDN =0V 1
Feedback Voltage VFB 1.205 1.23 1.255 V
FB Comparator Hysteresis VFBH 8 mV
FB Pin Bias Current IFB VFB=1.23V 30 80 nA
Output Voltage Line Regulation LNR 1.2V<VIN<12V 0.05 0.1 %/V
AP3015 300 350 400
Switching Current Limit IL mA
AP3015A 75 100 125
AP3015, ISW=300mA 200 300
Switch Saturation Voltage VCESAT mV
AP3015A, ISW=70mA 70 120
VFB>1V 400 nS
Switch Off Time TOFF
VFB<0.6V 1.5 µS
SHDN Input Threshold High VTH 0.9
V
SHDN Input Threshold Low VTL 0.25
VSHDN =1.2V 2 3
SHDN Pin Current ISHDN µA
VSHDN =5V 8 12
Switch Leakage Current ISWL Switch Off, VSW=5V 0.01 5 µA

Thermal Resistance θJC 52 o


C/W
(Junction to Case)

May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

5
Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


Typical Performance Characteristics
Unless otherwise noted, VIN=1.2V

20.0 1.255

19.5
1.250
19.0
1.245
18.5
Quiescent Current (µA)

Feedback Voltage (V)


1.240
18.0

17.5 1.235

17.0 1.230

16.5
1.225
16.0
1.220
15.5

15.0
Quiescent Current, No Switching 1.215
VIN=1.2V
14.5 1.210
VIN=12V
14.0 1.205
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
O O
Junction Temperature ( C) Junction Temperature ( C)

Figure 4. Quiescent Current vs. Junction Temperature Figure 5. Feedback Voltage vs. Junction Temperature

450 40

440
35
430
Shutdown Pin Current (µA)

30
420
Switch Off Time (ns)

25
410

400 20

390
15
380
10 O
370
TJ=-50 C
O
TJ=25 C
5
360 VFB>1V, VIN=1.2V O
TJ=100 C
350 0
-50 -25 0 25 50 75 100 0.0 2.5 5.0 7.5 10.0 12.5 15.0
O
Junction Temperature ( C) Shutdown Pin Voltage (V)

Figure 6. Switch Off Time vs. Junction Temperature Figure 7. Shutdown Pin Current vs. Shutdown Pin Voltage

May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

6
Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


Typical Performance Characteristics (Continued)
Unless otherwise noted, VIN=1.2V

500 120
118
116
450 114
112
110

Switch Current Limit (mA)


Switch Current Limit (mA)

108
400 106
104
102
350 100
98
96
300 94
92
90
AP3015 88 AP3015A
250
VIN=1.2V 86 VIN=1.2V
84
VIN=12V VIN=12V
82
200 80
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
O O
Junction Temperature ( C) Junction Temperature ( C)

Figure 8. Switch Current Limit vs. Junction Temperature Figure 9. Switch Current Limit vs. Junction Temperature

250 80

240 76

230 72
Saturation Voltage (mV)

Saturation Voltage (mV)

220 68

210 64

200 60

190 56

180 52

170 AP3015, ISWITCH=300mA 48 AP3015A, ISWITCH=70mA


VIN=1.2V VIN=1.2V
160 VIN=12V 44 VIN=12V
150 40
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
O O
Junction Temperature ( C) Junction Temperature ( C)

Figure 10. Saturation Voltage vs. Junction Temperature Figure 11. Saturation Voltage vs. Junction Temperature

May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

7
Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


Typical Performance Characteristics (Continued)
Unless otherwise noted, VIN=1.2V

85 85

80 80

75 75

Efficiency (%)
Efficiency (%)

70 70

65 65
AP3015
VOUT=20V, L=10µH, COUT=1µF AP3015A
60 VOUT=3.3V, L=10µH, COUT=20µF
60 Refer to Figure 14
VIN=4.2V Refer to Figure 15
VIN=2.5V
55 VIN=3.3V 55
VIN=1.2V
VIN=2.5V

50 50
0.1 1 10 0.1 1 10
Load Current (mA) Load Current (mA)

Figure 12. Efficiency Figure 13. Efficiency

Application Information chip and turns off the NPN switch. The load current is
then supplied solely by output capacitor and the output
Operating Principles voltage will decrease. When the FB pin voltage drops
AP3015/A feature a constant off-time control scheme. below the lower hysteresis point of Feedback
Refer to Figure 3, the bandgap voltage VREF (1.23V Comparator, the Feedback Comparator enables the
device and repeats the cycle described previously.
typical) is used to control the output voltage.
Under not switching condition, the IQ of the device is
When the voltage at the FB pin drops below the lower about 17µA.
hysteresis point of Feedback Comparator (typical
hysteresis is 8mV), the Feedback Comparator enables The AP3015/A contain additional circuitry to provide
the chip and the NPN power switch is turned on, the protection during start-up or under short-circuit
current in the inductor begins to ramp up and store conditions. When the FB pin voltage is lower than
energy in the coil while the load current is supplied by approximately 0.6V, the switch off-time is increased
the output capacitor. Once the current in the inductor to 1.5µs and the current limit is reduced to about
reaches the current limit, the Current-Limit 250mA (70mA for AP3015A). This reduces the
Comparator resets the 400ns One-Shot which turns off average inductor current and helps to minimize the
the NPN switch for 400ns. The SW voltage rises to the power dissipation in the AP3015/A power switch, in
output voltage plus a diode drop and the inductor the external inductor and in the diode.
current begins to ramp down. During this time the
energy stored in the inductor is transferred to COUT The SHDN pin can be used to turn off the AP3015/A
and reduce the IQ to less than 1µA. In shutdown mode
and the load. After the 400ns off-time, the NPN switch
is turned on and energy will be stored in the inductor the output voltage will be a diode drop below the input
again. voltage.

This cycle will continue until the voltage at FB pin


reaches 1.23V, the Feedback Comparator disables the
May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

8
Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


Typical Application

VIN L1 D1 VOUT
2.5V to 4.2V 10µΗ SS14
20V

R1
2M
C1 VIN SW C2
4.7µF 1µF
SHDN AP3015 FB RLOAD

GND R2
130K

C1, C2: X5R or X7R Ceramic Capacitor


L1: SUMIDA CDRH4D16FB/NP-100MC or Equivalent

Figure 14. AP3015 Typical Application in LCD/OLED Bias Supply

VIN L1 D1 VOUT
1.2V to 2.5V 10µΗ SS14
3.3V

C3
R1 10pF
1M
C1 VIN SW C2
4.7µF 20µF
SHDN AP3015A FB RLOAD

GND R2
600K

C1, C2, C3: X5R or X7R Ceramic Capacitor


L1: SUMIDA CDRH4D16FB/NP-100MC or Equivalent

Figure 15. AP3015A Typical Application in 1 or 2 Cells to 3.3V Boost Converter

May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

9
Data Sheet

MICRO POWER STEP-UP DC-DC CONVERTER AP3015/A


Mechanical Dimensions

SOT-23-5 Unit: mm(inch)

2.820(0.111)
3.020(0.119) 0.100(0.004)
0.200(0.008)

0.600(0.024)
0.300(0.012)
1.500(0.059)
1.700(0.067)
2.650(0.104)
2.950(0.116)

0.200(0.008)

0.700(0.028)
REF

0.300(0.012) 0°
0.950(0.037) 0.400(0.016) 8°
TYP
1.800(0.071)
2.000(0.079)
1.450(0.057)

0.000(0.000)
MAX

0.150(0.006)

0.900(0.035)
1.300(0.051)

May 2010 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

10
BCD Semiconductor Manufacturing Limited

http://www.bcdsemi.com

IMPORTANT NOTICE
IMPORTANT NOTICE

BCD Semiconductor
BCD Semiconductor Manufacturing
Manufacturing Limited
Limited reserves
reserves the
the right
right to
to make
make changes
changes without
without further
further notice
notice to
to any
any products
products oror specifi-
specifi-
cations herein.
cations herein. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not assume
assume any
any responsibility
responsibility for
for use
use of
of any
any its
its products
products for
for any
any
particular purpose,
particular purpose, nor
nor does
does BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited assume
assume any
any liability
liability arising
arising out
out of
of the
the application
application or
or use
use
of any
of any its
its products
products or
or circuits.
circuits. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not convey
convey anyany license
license under
under its
its patent
patent rights
rights or
or
other rights
other rights nor
nor the
the rights
rights of
of others.
others.

MAIN SITE
MAIN SITE
- Headquarters
BCD Semiconductor Manufacturing Limited - Wafer
BCD FabSemiconductor Manufacturing Limited
BCD Semiconductor
- Wafer Fab Manufacturing Limited Shanghai SIM-BCD
- IC Design GroupSemiconductor Manufacturing Co., Ltd.
No. 1600, Zi
Shanghai Xing Road,
SIM-BCD Shanghai ZiZhu
Semiconductor Science-basedLimited
Manufacturing Industrial Park, 200241, China 800 Yi Shan Road,
Advanced Shanghai
Analog 200233,
Circuits China Corporation
(Shanghai)
Tel:
800,+86-21-24162266, Fax: +86-21-24162277
Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491,YiFax:
8F, Zone B, 900, Shan+86-21-5450 0008200233, China
Road, Shanghai
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 Tel: +86-21-6495 9539, Fax: +86-21-6485 9673
REGIONAL SALES OFFICE
Shenzhen OfficeSALES OFFICE
REGIONAL Taiwan Office USA Office
Shanghai
Shenzhen SIM-BCD
Office Semiconductor Manufacturing Co., Ltd., Shenzhen Office BCD Taiwan
Semiconductor
Office (Taiwan) Company Limited BCD Office
USA Semiconductor Corp.
Unit A Room
Shanghai 1203, Skyworth
SIM-BCD Bldg., Gaoxin
Semiconductor Ave.1.S., Nanshan
Manufacturing Co., Ltd.District,
Shenzhen Shenzhen,
Office 4F, 298-1,
BCDRui Guang Road,(Taiwan)
Semiconductor Nei-Hu District,
Company Taipei,
Limited 30920Semiconductor
BCD Huntwood Ave.Corporation
Hayward,
China
Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Taiwan4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, CA 94544,
30920 USA Ave. Hayward,
Huntwood
Tel:
Room +86-755-8826
E, 5F, Noble 7951 Tel: +886-2-2656
Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Taiwan 2808 Tel :94544,
CA +1-510-324-2988
U.S.A
Fax: +86-755-88267951
Tel: +86-755-8826 7865 Fax: +886-2-2656 28062808
Tel: +886-2-2656 Fax:: +1-510-324-2988
Tel +1-510-324-2788
Fax: +86-755-8826 7865 Fax: +886-2-2656 2806 Fax: +1-510-324-2788

Anda mungkin juga menyukai