1 2 .1 R E L E A S E
Boundary Conditions
4 Wall/surface boundary conditions for
heat flux, temperature, convective heat
transfer coefficient, radiation, symmetry
and periodic conditions Mesh around pin fin heat
4 Openings and vents
sink follows the geometry
• Inlet/exit velocity, mass flow rate, exit
of the part without any
static pressure, inlet total pressure,
approximation
inlet temperature and turbulence
parameters
4 Grilles and resistances with an automatic
loss coefficient based on free area ratio
4 Fans with options for mass flow rate or
fan performance curve
4 Rotational speed for cylindrical/circular
objects
4 Recirculating boundary conditions for
external heat exchangers
4 Planar heat exchanger
4 Network objects for modeling heat
exchangers
4 Time-dependent and enhanced
temperature-dependent sources
4 Time-varying ambient temperature
4 Profiles of velocity, temperature, heat Robust and Rapid Numerical Solutions
flux/heat transfer coefficients on
openings and walls
ANSYS Icepak software uses state-of-the-art technology available in the ANSYS® FLUENT®
4 Automatic enhanced correlation-based CFD solver for the thermal and fluid-flow calculations. The CFD solver solves fluid flow and
heat transfer coefficient boundary includes all modes of heat transfer — conduction, convection and radiation — for both
conditions steady-state and transient thermal-flow simulations. The solver uses a multigrid scheme to
4 Time-dependent pressure
4 Time-dependent electric current accelerate solution convergence for complex conjugate heat transfer problems. The ANSYS
4 Electric current and voltage boundary Icepak solver provides complete mesh flexibility and allows the user to solve even the most
conditions complex electronic assemblies using unstructured meshes, providing robust and extremely
www.ansys.com fast solution times.
12.1 RELEASE
Results Visualization and Reporting Following an ANSYS Icepak simulation, the temperature data from a thermal-flow analysis
4 Interactive, object-based visualization can be imported into ANSYS Mechanical software to calculate the thermal stresses of the
4 Display of velocity vectors, contours components. The interaction between ANSYS Icepak and ANSYS Mechanical software
and particle traces
4 Cut planes with dynamic movement
allows users to evaluate both the temperatures and resulting thermal stresses of the
4 Isosurface displays device.
4 Display of orthotropic thermal
conductivity
4 Display of electric potential
4 Point probes with XY plotting
4 Contours of velocity, temperature,
pressure, heat flux, heat transfer
coefficient, flow rate, turbulence
parameters, vorticity, etc.
4 Animation of particle and dye traces
4 Animation of vectors and contours
4 Report generation
4 Time history display
4 Point objects
• Convergence monitoring, post-
processing, reports
4 Fan and blower operating points
4 Export data to Autotherm Electric potential contours on a printed circuit board
4 Export data to NASTRAN ®, (PCB) trace
PATRAN ® and I-DEAS®
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