UCU Technology (Edited by MMG)

Patent # 7,371,973 B1
Patent #
Prospectus / Media Kit
UCU Technology™
Universal Contact Unit
Newly Patented Technology

Available for Acquisition
Table of Contents
I Product Opportunity Summary 1
II Competitive Landscape
Competitive Advantages / Breakthrough Opportunity 8

Product Features and Benefits 14
Comparable Established Products 16
Referenced Patented Products 17
Competitive Summary 18
III Industry & Market Analysis
Industry Size and Trends 20

Target Market Analysis 23
Distribution Channels 24
IV Product Analysis
Product Specifications 26
Patent Value Enhancement 26
V Financial Forecast
Pro Forma 27
VI Licensing Opportunities & Patent Information
Patent Information 31
Patent Owner Background 31
Exhibit Summary 33
Disclosure Statement 37
COPYRIGHT 2010 MILLENNIUM MARKETING GROUP, LTD. ALL RIGHTS RESERVED.

I Product Opportunity Summary
This prospectus will introduce the Universal Contact Unit (UCU) Technology, a newly
patented technology available for licensing. The UCU Technology™ is an independent
branch of the interconnection technologies tree, but is more close to the Solder Bump
technology family. Like the Solder Bump Flip Chip, the UCU Technology™ is a group
process and uses soldering for chip-substrate interconnection. But the difference is
fundamental.
The UCU Technology™ uses micro-via in thin polyimide film as a contact on substrate
and capillary forces to fill the via with a solder paste during heating. Although the bumps
nominally present in this technology there are no real bumps, but small meniscus only.
It leads to a short time of a bumping process with no impact on the silicon surface. The
use of poyimide film yields to extremely low overstress during heating. The UCU
Technology™ affects critical development in various satellite microelectronics sectors
such as polyimid film production and chip packaging equipment.
Capillary allows use of the UCU™-based technologies for a wide range of applications,
including assembly of multiplayer fine resolution Printed Circuit Boards, both flex and
rigid. The UCU™-based PCB is the best substrate for multi-chip modules.
2
UCU™-Based Technologies
Core Technologies Based on UCU Technology™:
• Chip-Substrate Interconnection Technology (CSI). CSI involves applying
fundamental UCU Technology™ principles to the key problem of inexpensive
and reliable chip-substrate interconnection.
• Multi-layer Polyimide Printed Circuit Board Assembly Technology (MLP-
PCB). UCU Technology™ can be used effectively for the assembly of fine
resolution multiplayer PCBs at a very attractive cost.
UCU ™-Based Industrial Technologies:

• Single Chip Module (SCM) Assembly Technology. SCM assembly technology
combines UCU™-Based CSI and MLP-PCB technologies with the aim of
providing cost-effective, robust, and reliable packages, including both CSP and
the highest I/O package families.
• Multi Chip Module (MCM) Assembly Technology. The industry’s future lies in
MCM. The UCU Technology™ will provide the market with MCM assembly
technology, bringing cheap and reliable multi-chip packages into the mass
market. This technology is capable of working simultaneously with chips of
different design rules and pitch size, and can produce MCMs with a small
footprint and very effective use of space.
• Flex Fine-Resolution Multi-Layer PCB. UCU Technology™ enables the
assembly of custom and mass production PCBs with excellent electrical features,
fine design rules, and at a low cost.
• Original Assembly Equipment. Suitable both for SCM and MCM assembly, as
well as for PCB assembly.
• KGD Testing Technology and Fixture. The problem of “Known Good Die” is a
key issue for the packaging and assembly industry. UCU Technology™ offers
original technology to solve this problem.
3
A small series of single and multi-chip modules based on the UCU Technology™ has
been manufactured and successfully tested:
Single Chip Module Packaging and Multi-Chip Module Packaging and

Assembly Technology and Services Assembly Technology and Services
UCU™-Based Multi-Chip Modules

The UCU™-based chip-substrate interconnection technologies and fine-resolution PCB
assembly together make MCM assembly straightforward. There is no serious difference
between SCM and MCM assembly from the equipment or design point of view.
• The UCU™-MCM technology can combine IC units with arbitrary pad location
patterns, design rules and I/O numbers with a limited footprint.
• The robustness and simplicity of the technology together with fine-pitch
resolution enables the use of chips from different producers without the need for
redesign.
• The multilevel UCU™-based PCB cuts the size of the MCM footprint and
significantly increases the working clock frequency and other electrical features.
• SCM-designed assembly equipment can be used for MCM assembly without any
need for reconfiguration.
4
Original SCM and MCM assembly Equipment
UCU Technology™ Advantages

• UCU Technology™ uses group soldering operations.
• UCU Technology™ provides high quality and reliability of chip-substrate
interconnection due to better soldering in a capillary.
• UCU Technology™ provides the solution to the problem of immediate visual
testing of the assembly process and its results through the capillary hole in the
thin polyimide layer.
• UCU™-based interconnection has no flux remains.
• Polyimide structure prevents shorts or opens during device work.
• Behavior of a polyimide structure at heating prevents overstress without various
tricks.
• The capillary-based interconnection is very durable. It is practically impossible to
tear the interconnection.
• Absence of collapse during bump formation allows use of UCU Technology™
for the packaging of GaAs-based IC devices.
5
• UCU Technology™ can be universally used both for chip-substrate
interconnection and for assembly of complex PCB layers.
UCU Technology™ BGA-400 Case Study
*Signals and GND layers are separated (better EMI)

*More than 300 signals can be routed in 2 PI layers (in PCB required ~ 4 layers),
because of PI tiny design rules ~ 50ụ (PCB design rules is ~ 300ụ)
6
UCU Technology™ Chip-Substrate Interconnection Process
1) Chip PADs preparation.
2) Covering of contact by tin.
3) Formation of a capillary connection element.
4) Welding alloy.
5) Alignment of a capillary in the substrate with the pad of the chip.
6) Soldering
The target market for the UCU Technology™ is comprised of three major manufacturer
groups: contract packaging services companies, packaging & assembly equipment
manufacturers, and vertically integrated IC production companies.
With a low manufacturing cost, the margins are good for both the manufacturer and
wholesaler. Wholesalers are expected to be eager to place sizable initial and follow up
orders to capitalize on the exclusiveness this value-added product offers.
7
UCU Technology™ At A Glance
Patent Number: United States Utility Patent No. 7,371,973 B1
Industry: Semiconductor
Target Market Size: Semiconductor houses
Packaging foundries
Mobile PC and telecom OEMs
Primary Use: Contact Node
Key Benefits:
Provides high quality and reliability of chip-substrate interconnection due to
better soldering in a capillary
Provides the solution to the problem of immediate visual testing of the
assembly process and its results through the capillary hole in the thin
polyimide layer
Can be universally used both for chip-substrate interconnection and for
assembly of complex PCB layers
Millennium Marketing Group, Ltd. has been retained by the patent owner to secure a
licensing or sales agreement in order to bring the unique features, quality, effectiveness,
and value of this technology to the marketplace. The first firm to bring this exciting
design to the market will capitalize with a favorable return on investment and enjoy the
commercial benefits well into the future. Currently, we are seeking a partner that can
fully and profitably exploit this rare and lucrative licensing opportunity.
8
II Competitive Landscape
Competitive Advantages / Breakthrough Opportunity
The first silicon integrated circuit (IC) was invented in
1958 by Texas Instruments. The chip-substrate
interconnection by wire bonding experienced a
bottleneck when the global IC manufacturing volume
rose from hundreds of thousands in the 1990’s to
approximately 80 billion in 2009.
Wire Bonding Problems

There are some fundamental Wire bonding problems: sequential bonding process and
peripheral contact pads location. In practice, it leads to:
Limited possible I/O number serviced by the bonding process for usual chip sizes
Degradation of an interconnection quality with I/O number increase
Linear growth of a bonding process equipment’s cost with I/O number increase,
or linear growth of an operation time
As a result, Wire bonding is generally used for a connection of chips with an I/O number
below 400. In addition, gold wire is an expensive material from the economical point of
view.
Another matter under discussion is Wire Bonding reliability during device work cycle. A
high degree of heat and mechanical energy in a light vacuum during welding leads to
high levels of hidden dislocations in silicon die. Two adjacent wires may excite a short.
As a result an MTBF (Mean Time Between Failure) value decreases significantly.
How UCU Technology™ Competes With

Universally-Recognized Wire bonding Technology
o UCU Technology™ is a group process with extremely high-quality soldering.
9
o Wire bonding is a sequential process. Thus, very high but limited bonding quality
leads to dramatically high packaging cost increases with pad numbers.
o It is impossible to use Wire bonding for area-array pad location.
o It is very expensive to use Wire Bonding in MCM applications.
o UCU™-based assembly equipment, as opposed to WB equipment, is highly
scalable at a reasonable price.
To solve the connection problem, IBM introduced the “Controlled Collapse Chip
Connection” or C4 in the 1960’s, which considerably increased IC’s I/O number.
Solder Bump Flip Chip Problems

The Flip Chip method, unfortunately, also had some
problems. One huge disadvantage of this method is the
silicon wafer bumping, the placement of spherical or
cylindrical solder bumps onto the surface of the silicon
chip. Though there are a lot of different placement
technologies, all of them may damage the chip because
of high temperature and pressure. Some times this
damage may be uncovered during the final testing
procedures, but often it leads to unstable work and shortening of the IC device life cycle.
10
Additional problems would include:
Impossibility to visually control mutual alignment between the chip and substrate
pads. This requires the use of expensive alignment equipment.
The soldering remains cannot be removed completely. It causes shorts.
So-named underfill is used for better thermo-mechanical features of an
interconnection. Even using underfill, the heating-induced overstress in the layer
between the chip and substrate may lead to chip or connection destruction.
Coarse pitch side
Limited reliability
Expensive manufacturing process
Expensive materials
Because of these problems this Flip Chip technology, even after 35 years, has been
unable to replace the wire bonding connection.
How UCU Technology™ Competes With

High-End Solder Bump Flip Chip Technology
o Robust, high-quality technology. It entails insignificant losses from chip damage
during the assembly process and from poor chip-substrate interconnection.
o Fine pitch.
o Low material and operation costs.
o No flux remains.
o No short during the operation of the IC device.
Important SBFC applications are size-driven package families, such as Chip Scale
Packages (CSP) and Wafer Level CSP (WLCSP). UCU Technology™ has better
performance and very attractive cost features for this class of applications.
11
Charts compare the real bumping cost with the good die cost for SBFC and UCU
Technology™ processes. It shows the difference between SBFC and UCU
Technology™ quality, especially on the high-end market.
12
13
The UCU Technology™ is superior to competitive products because it solves all
serious SBFC problems. Unlike current technology, the UCU Technology™ is based
on small meniscus instead of solder bumps. This prevents a bump’s deformation and
the expensive underfill. The UCU Technology™ affects critical development in various
satellite microelectronics sectors such as polyimid film production and chip packaging
equipment.
14
The proposed design of the UCU Technology™ is a starting point of a new trend and
direction in VLSI and MCM assembly and much more promising than Wire Bond and
Flip Chip technology.
Product Features and Benefits
Solves all serious SBFC problems

Based on small meniscus
Bumps deformation is prevented
No expensive underfill
Cost of chip packaging up to 3 times less than the current flip-chip technology
Affects critical development in various satellite microelectronics sectors such as
polyimid film production and chip packaging equipment
15
A small series of single and multi-chip modules based on the UCU
Technology™ have been manufactured and successfully tested
Inexpensive to manufacture and to market
No contamination
Soft for GaAS
High reliability
Fast local soldering
Better performance results
Fine pitch
Scalable
High-yield
Thin
Multi-Chip Module availability
Reliable ship-substrate interconnection
Can be used effectively for the assembly of fine resolution multiplayer PCBs at a
very attractive cost
Brings high-end area-array chips into the mass market
UCU™-based PCB assembly technology simplifies the PCB production process
and renders it suitable for any fine-pitch application
Reliable bumping processes
Small footprint
Processing time is less than half that for processing C4 solder bumps
Soft chip assembly
No chip damage
Excellent assembly-process scalability with I/O number
No extra time is required if I/O number is doubled
No flux remains post assembly
High number of heating cycles
Excellent thermo-mechanical reliability
High operating frequencies
Low energy dissipation over very short interconnection distances
16
Suitable for ultra-high frequency applications (up to 60GHz)
Low microwave absorption
Uses group soldering operations
Provides high quality and reliability of chip-substrate interconnection due to better
soldering in a capillary
Provides the solution to the problem of immediate visual testing of the assembly
process and its results through the capillary hole in the thin polyimide layer
Polyimide structure prevents shorts or opens during device work
Behavior of a polyimide structure at heating prevents overstress without various
tricks
Very durable. It is practically impossible to tear the interconnection
Can be universally used both for chip-substrate interconnection and for assembly
of complex PCB layers
Comparable Established Products
17
Referenced Patented Products
The United States Patent and Trademark Office referenced the following patents when
issuing the patent for the UCU Technology™:
U.S. Patent No. 6,100,475, issued August 2000 to Degani et al.

U.S. Patent No. 6,054,761, issued April 2000 to McCormack et al.
U.S. Patent No. 6,013,877, issued January 2000 to Degani et al.
U.S. Patent No. 6,010,769, issued January 2000 to Sasaoka et al.
None of the above referenced patented products offer all the features and benefits of
the UCU Technology™.
18
Competitive Summary
UCU Technology™
Market Comparison
UCU Competitive
Feature
Technology™ Products
Solves all serious SBFC problems YES NO
Based on small meniscus YES NO
Bumps deformation is prevented YES NO
No expensive underfill YES NO
Cost of chip packaging up to 3 times less than the
YES NO
current flip-chip technology
Affects critical development in various satellite
microelectronics sectors such as polyimid film YES NO
production and chip packaging equipment
A small series of single and multi-chip modules
based on the UCU Technology™ have been YES NO
manufactured and successfully tested
Inexpensive to manufacture and to market YES NO
No contamination YES NO
Soft for GaAS YES NO
High reliability YES NO
Fast local soldering YES NO
Better performance results YES NO
Fine pitch YES NO
Scalable YES NO
High-yield YES NO
Thin YES NO
Multi-Chip Module availability YES NO
Reliable ship-substrate interconnection YES NO
Can be used effectively for the assembly of fine
resolution multiplayer PCBs at a very attractive YES NO
cost
Brings high-end area-array chips into the mass
YES NO
market
19
UCU Competitive
Feature
Technology™ Products
UCU™-based PCB assembly technology
simplifies the PCB production process and YES NO
renders it suitable for any fine-pitch application
Reliable bumping processes YES NO
Small footprint YES NO
Processing time is less than half that for
YES NO
processing C4 solder bumps
Soft chip assembly YES NO
No chip damage YES NO
Excellent assembly-process scalability with I/O
YES NO
number
No extra time is required if I/O number is doubled YES NO
No flux remains post assembly YES NO
High number of heating cycles YES NO
Excellent thermo-mechanical reliability YES NO
High operating frequencies YES NO
Low energy dissipation over very short
YES NO
interconnection distances
Suitable for ultra-high frequency applications (up
YES NO
to 60GHz)
Low microwave absorption YES NO
Uses group soldering operations YES NO
Provides high quality and reliability of chip-
substrate interconnection due to better soldering YES NO
in a capillary
Provides the solution to the problem of immediate
visual testing of the assembly process and its
YES NO
results through the capillary hole in the thin
polyimide layer
Polyimide structure prevents shorts or opens
YES NO
during device work
Behavior of a polyimide structure at heating
YES NO
prevents overstress without various tricks
Very durable. It is practically impossible to tear
YES NO
the interconnection
Can be universally used both for chip-substrate
interconnection and for assembly of complex PCB YES NO
layers
20
III Industry & Market Analysis
Industry Size and Trends

The Semiconductor Industry Association (SIA) predicts that year-on-year growth for the
semiconductor industry will be approximately 28.4 percent ($290.5 billion) for 2010.
According to the SIA President George Scalise, “Chip sales have been buoyed by
strength in sales of personal computers, cell phones, corporate information technology,
industrial applications, and autos. Unit sales of personal computers are now expected to
grow by 20 percent this year and cell phone unit sales are predicted to be up 10 to 12
percent over 2009 levels.”
“Sales in the first half of 2010 were exceptionally robust, driven by strong demand from
a broad range of end markets,” said SIA President Brian Toohey. “Worldwide
semiconductor sales of US$144.6 billion for the first half of 2010 were more than 50
percent higher than the same period of 2009 when sales were $96.1 billion.”
21
22
SIA reports that global sales of semiconductors in the second quarter of 2010 grew to
US$74.8 billion, an increase of 7.1 percent from the first quarter total of US$69.9 billion.
June 2010 sales of US$24.9 billion were 0.5 percent higher than May when sales were
US$24.8 billion.
Wire Bonding Industry

The Wire Bonding technology has dominated the market for years but is close to
achieving the limit of technology development. This technology has more then 50 years
of industrial experience, with 90 percent of the worldwide market.
23
Solder Bump Flip Chip Industry
The Solder Bump Flip Chip group technology has attempted for about 40 years to
supplant Wire Bonding, with results of approximately only 6 percent of the worldwide
market.
24
UCU Technology™ - Soldering uses coapillar vias in intermediate polyimide films. May
be used by both perteferal and area-arrays pads with any I/O number of pads. The
technology is ready for chip-scale packaging and multi-chips modules.
Target Market Analysis

The target market for the UCU Technology™ is comprised of three major manufacturer
groups: contract packaging services companies, packaging & assembly equipment
manufacturers, and vertically integrated IC production companies.
Contract Packaging Service Companies

This rapidly growing group consists of companies located mainly in Southeast Asia
(except for a few high-end small packaging companies in the U.S. and Europe).
Packaging & Assembly Equipment Manufacturers

Equipment manufacturers are expected to be among those interested in the UCU
Technology™. Such companies as Kulicke & Soffa Industries, Inc. or ASM
International, and many small privately held companies that are focused on specialized
assembly, testing and auxiliary equipment, are expected to be extremely interested in
this advanced technology. This possibly will stimulate additional equipment spending,
satisfy the industry’s requirements, and meet the end market challenge for IC
performance, user functions and reliability.
25
Vertically Integrated IC Production Companies
Vertically integrated companies control the full manufacturing cycle from silicon chip
production to final assembly of a microelectronic device. Typical examples are Intel,
AMD, and the microelectronic subsidiaries of giants such as Siemens. Their main
advantage is R&D and engineering experience, as well as advanced customer support.
Integrated companies are now tending to become “fables”, with a focus on R&D,
marketing and technical support. The UCU Technology™ is capable of bringing new
R&D and engineering value to customers in this group, and of becoming a high-end
packaging subcontractor.
Distribution Channels
The primary distribution channels for the UCU Technology™ are the manufacturers in
the semiconductor industry. With a low manufacturing cost, the margins are good for
both the manufacturer and wholesaler. Wholesalers are expected to be eager to place
sizable initial and follow up orders to capitalize on the exclusiveness this value-added
product offers.
All these manufacturers are prime places for distributing the UCU Technology™, not to
mention their global Internet presence. The introduction of the UCU Technology™ into
their line of products is well timed.
26
UCU Technology™ At A Glance
Patent Number: United States Utility Patent No. 7,371,973 B1
Industry: Semiconductor
Target Market Size: Semiconductor houses
Packaging foundries
Mobile PC and telecom OEMs
Primary Use: Contact Node
Key Benefits:
Provides high quality and reliability of chip-substrate interconnection due to
better soldering in a capillary
Provides the solution to the problem of immediate visual testing of the
assembly process and its results through the capillary hole in the thin
polyimide layer
Can be universally used both for chip-substrate interconnection and for
assembly of complex PCB layers
27
IV Product Analysis
Patent Value Enhancement

A working prototype of the UCU Technology™ can be made available to demonstrate
the design and functionality of the product.
28
V Financial Forecast
o The absence of rigid PCB and underfill costs constitutes a major cost advantage
for UCU Technology™ over the Solder Bump Flip Chip on this market. The UCU
Technology™ is expected to win at least $10 per high-end IC device. The cost
savings per high-end packaging foundry (5 million units per year) will be
approximately $50 million per year.
o The development of UCU™-KGD technology will provide foundries with extra
cost-savings and open the road to the widespread use of inexpensive MCM
technology.
o The UCU™-MCM technology will provide additional savings of $5 per device (or
$25 million per year per high-end packaging foundry) thanks to the absence of
the package itself.
29
o The UCU Technology™ offers advantages over both Wire Bonding and Solder
Bump within the pads number range 400-600. Unlike SB, UCU Technology™
can compete with WB on fine-pitch peripheral array applications.
o We expect to win at least $5 per each 400-I/O chip ($0.0125 per pad) over SB.
Based on annual output per packaging foundry of approximately 12 million units,
this means $60 million of savings per year in a rapidly growing market.
o The UCU™-MCM technology will offer an additional $5 in savings per IC device.
30
o The UCU Technology™ offers cost advantages over Wire Bonding within the
pads number range 150-400 due to the cost of the interconnection.
o We expect to win approximately $0.1 per 200-I/O 10x10 mm 2 chip ($0.0005 per
pad). Based on annual output per packaging foundry of approximately 100 million
units, this means $10 million of savings per year.
o The next and key step is the introduction of the high-end UCU™-MCM
technology to this market.
MCM technology enables significant reductions in the size, weight, power consumption
and cost of the system. The embedded systems market (e.g., car electronics) is one of
the major consumers of such systems. A cost evaluation shows that MCM technology
can decrease the total system cost by 40 percent, from $36 to $21 for a typical AMD
Am186-based system.
Cost Evaluation of the SCM and MCM Assembly Types
31
The embedded-systems output exceeds 100 million units per year and the market will
grow rapidly on the heels of a fall in prices. It is clear that MCM has a very important
role to play in the industry.
It is important to note that financial data presented is based on an estimated production

cost and does not account for manufacturer efficiencies or product modifications; nor do
they account for bulk quantities and content variations, which could dramatically affect
costs and pricing. Therefore, these projections should be considered as illustrative only
of the tremendous marketing potential for this product.
32
VI Licensing Opportunities & Patent Information
Millennium Marketing Group, Ltd. is the exclusive agent to represent the licensing or
transfer of the patent and trademark rights. Millennium is a well-respected international
firm dedicated to the marketing of patented technologies. Our team has over a hundred
years of combined experience in the fields of technology transfer, licensing, and
marketing consultation. Millennium represents dozens of product lines and has
successfully represented numerous award-winning products. With a shared risk
philosophy, Millennium strives to develop mutually beneficial financial arrangements
with manufacturers and/or distributors.
Currently, we are seeking a licensing arrangement involving the patent to make, use,
manufacture, market, and distribute the UCU Technology™. Please contact Scott A.
Norman, President, Millennium Marketing Group, Ltd. at (913) 317–9114 ext. 102 or e-
mail him at scott.norman@millenniumip.com to discuss this rare and lucrative new
product opportunity.
Patent Information
Dr. Alexandr Ivanovich Taran holds United States Utility Patent No. 7,371,973 B1 filed
on August 2, 2001, and issued on May 13, 2008. This patent for the UCU
Technology™ expires in 2021, commensurate with the filing date. This patent has nine
claims that protect the exclusive design and function of the UCU Technology™.
33
Patent Owner Background
The UCU Technology™ was invented in 1998 as a result of several years of research.
The intellectual property rights for UCU Technology™ belong to Alexander Taran and
Andrey Belov. Dr. Taran is the author of the UCU Technology™ the “Contact Node”.
Mr. Belov is the co-author of the UCU Technology™.
Alexander I. Taran: Alexander Taran graduated St.

Petersburg's State University at 1968 as a physicist. Dr.
Taran has worked in the microelectronic industry for over 27
years. Dr. Taran had served for many years (1974 to 1998)
in Microelectronics Scientific Center (Zelenograd) as Chief
Scientist in the subsidiary Company of Advanced Research
(1990-1998), Head of Laboratory, Project Manager, and
Engineer (1974-1990). At the same time, Dr. Taran held a
project manager position in Computer informational Center
(1986-1990). Dr. Taran’s basic scientific interests include the development of
microelectronic device assembly technologies and the development of embedded
systems. Dr. Taran holds numerous Russian patents.
Andrey A. Belov: Andrey Belov graduated Moscow

Institute of Electronic Technology (Technical University)
http://www.miet.ru/ in 1994 as an engineer (design and
technology of electronic computing devices) and Russian
Economics Academy in Moscow in 1999 as an economist
(Finances and Credits). Andrey Belov is a small investor
in the fields of development, construction, Real Estate
management, microelectronics, art. Andrey Belov is
also a philanthropist. His charity projects are restoration
of the church of "Sign of the God Mother" in Moscow district Khovrino
http://www.znamenie-hovrino.ru/, support of artists, and restoration and construction of
monuments of World War II.
34
Exhibit Summary
Exhibit A - Trade Show Information
Exhibit B - Trade Publication Information
35
Exhibit A -Trade Shows
International Manufacturing Consumer Electronics Association (CEA)

Technology Show Industry Forum 2010
Dates and Location: Dates and Location:

September 13 – 18, 2010 October 17-20, 2010
McCormick Place Fairmont Hotel
Chicago, IL San Francisco, CA
Immersive Technology Summit 2010 Licensing International Expo 2011
Dates and Location: Dates and Location:

October 21, 2010 June 14 – 16, 2011
Los Angeles Center Studios Mandalay Bay Convention Center
Los Angeles, CA Las Vegas, NV
The tradeshows and trade publications listed are possible marketing tools that we include in the
prospectus because of our belief in the complete marketing program. Although Millennium represents
products at numerous tradeshows and in certain publications, we do not guarantee representation at all of
the listed shows or publications.
36
Exhibit B - Trade Publications
Semiconductor Today
Semiconductor Manufacturing Industry News
EDN: Electronics Design, Strategy, News
Electronic Component News (ECN)
Electronic Products
Electronic Products and Technology (EPT)
Electronics Weekly
Semiconductor International
Wireless Design Online
37
38
Disclosure Statement
Millennium Marketing Group, Ltd. (the “Company”) has prepared the attached business Prospectus (the
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other pertinent indicators. The plan contains information to provide prospective investors with a
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39
Opportunity at a Glance
New Technology: UCU Technology™

Patent: Patent Number 7,371,973 B1
We are seeking a long-term arrangement with a company to manufacture, market,

and/or distribute this new technology based on the acquisition of the intellectual
property rights.
For additional information and potential terms to acquire this innovative technology
contact Scott A. Norman, President, Millennium Marketing Group, Ltd.
Scott A. Norman
President
Millennium Marketing Group, Ltd.
10550 Marty Street
Overland Park, KS 66212
Phone: 913-317-9114
Fax: 913-338-1251
Email: scott.norman@millenniumip.com
PROFESSIONALLY PREPARED AND REPRESENTED BY
______________________________________________________
___________________________________________________________________________
10550 Marty Overland Park, KS 66212-9946 USA Phone: 913-317-9114 Fax: 913-338-1251

UCU Technology (Edited by MMG)

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UCU Technology (Edited by MMG)

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Patent # 7,371,973 B1

Prospectus / Media Kit

Newly Patented Technology

I Product Opportunity Summary 1

Competitive Advantages / Breakthrough Opportunity 8

III Industry & Market Analysis

Industry Size and Trends 20

VI Licensing Opportunities & Patent Information

COPYRIGHT 2010 MILLENNIUM MARKETING GROUP, LTD. ALL RIGHTS RESERVED.

UCU ™-Based Industrial Technologies:

Single Chip Module Packaging and Multi-Chip Module Packaging and

UCU™-Based Multi-Chip Modules

UCU Technology™ Advantages

UCU Technology™ BGA-400 Case Study

*Signals and GND layers are separated (better EMI)

Wire Bonding Problems

How UCU Technology™ Competes With

o UCU Technology™ is a group process with extremely high-quality soldering.

Solder Bump Flip Chip Problems

How UCU Technology™ Competes With

Product Features and Benefits

 Solves all serious SBFC problems

Comparable Established Products

U.S. Patent No. 6,100,475, issued August 2000 to Degani et al.

Industry Size and Trends

Wire Bonding Industry

Target Market Analysis

Contract Packaging Service Companies

Packaging & Assembly Equipment Manufacturers

Patent Value Enhancement

Cost Evaluation of the SCM and MCM Assembly Types

It is important to note that financial data presented is based on an estimated production

Alexander I. Taran: Alexander Taran graduated St.

Andrey A. Belov: Andrey Belov graduated Moscow

Exhibit A - Trade Show Information

Exhibit B - Trade Publication Information

International Manufacturing Consumer Electronics Association (CEA)

Dates and Location: Dates and Location:

Immersive Technology Summit 2010 Licensing International Expo 2011

Dates and Location: Dates and Location:

Semiconductor Manufacturing Industry News

EDN: Electronics Design, Strategy, News

Electronic Component News (ECN)

Electronic Products and Technology (EPT)

Wireless Design Online

THE COMPANY MAKES NO EXPRESS OR IMPLIED REPRESENTATION OR WARRANTY

THE COMPANY MAKES NO EXPRESS OR IMPLIED REPRESENTATION OR

New Technology: UCU Technology™

We are seeking a long-term arrangement with a company to manufacture, market,

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Solves all serious SBFC problems