Yarmouk University

Hijjawi Faculty for Engineering Technology

Electronics Engineering Department
Dr. Abdallah Ababneh

Micromechanics I (ELE 590)

(Basics of the technology)

Second Semester 2010/2011 µ

Lecture: Monday 11:00-12:30
Wednesday 11:00-12:30

Tuesday, 25 January 2011

 Course Topics

Introduction
– Definition of Microsystems
– Cleanroom
Materials for MEMS (micro electro mechanical systems), crystallography
– Silicon
– Other Semiconductors, Glass, Polymer, Ceramic
Film structure / Film deposition / Film modification
– Oxidation / CVD / PVD / Doping
– Other deposition technologies
– Spin Coating
Structuring thin films
– Lithography
– Wet and Dry Etching

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Dr. Abdallah Ababneh Folie 2 Electronics Engineering Department University
 Course Topics

specific technique for Microsystems

– Deep etching (Wet, Dry)
– Porous Silicon
– Full wafer-Bonding (Anodic, Silicon Direct Bonding, etc.)
complete processes of Microsystems
– Bulk Micromachining
– Surface Micromachining
– LIGA
Mechanical sensors
– Piezoresistive effect
– Piezoresistive pressure sensor
– Capacitive pressure sensor

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 Introduction

Source: Madou

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Dr. Abdallah Ababneh Folie 4 Electronics Engineering Department University
 Literature

M. Madou:
Fundamentals of Microfabrication

Sami Franssila
Introduction to Microfabrication

Gary S. May
Simon M. Sze
Fundamentals of Semiconductor
Fabrication

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 Introduction

ƒWhat are MEMS ?

MEMS are devices that integrate mechanical elements, sensors, actuators, and electronics
on a common silicon substrate. Many typically have dimensions in the 1 micron to 100
micron range. They have proven to be a key enabling technology of developments in areas
such as telecommunications, automotive, and biotechnology, but the range of MEMS
applications covers nearly every field.

„sense" „decision" „act"

Sensor Signal proc. Actor

Microsystem

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 Introduction

Why are MEMS of interest?

COST : Batch processing of MEMS (some costing no more

than a few cents !).

SIZE : Their small size means that they don’t take up much
space and weigh little.

The first Transistor

ENERGY EFFICIENCY: MEMS used to regulate

temperature and lighting in accordance with need.
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 Introduction

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 Introduction
Piezoresistive pressure sensor

Source: microfab

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 Introduction

Safety:
Airbag
Occupant detection
ABS
ESP
Traction control
Tire pressure
Distance radar

Drive shaft
Motor management
Oil parameters
Exhaust diagnosis

Driving comfort
Suspension control
Seat control
Air conditioning
Rain sensor
Vehicle navigation
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 Introduction

Acceleration sensors for safety systems

in
Surface Micromachining

Seismic Mass Spring Capacitance 1

Bosch

Sense direction

Source: Robert Bosch

Wiring Bond pad Capacitance 2 Silicon dioxide
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 Introduction
piezoelectric AlN driven cantilevers

Al-Top electrode

AlN

Si-Bottom electrode

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 Introduction
piezoelectric AlN driven cantilevers
Si (100)
ρ ≤ 0.1 Ωcm
dSi = 450 ± 25 μm

dSiO2 = 120 nm

Si (100)
dSiO2= 120 nm
dSi3N4= 300 nm SiO2
Si3N4

6% HF AlN

Al
38% KOH
d Membran ~ 20 µm

dAlN = 1000 nm

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 Introduction

piezoelectric AlN driven cantilevers

85% H3PO4
80°C
Si (100)
SiO2
Si3N4
dAl = 500 nm
85% H3PO4 AlN
40°C
Al

Cryo-etch process
Etch gas SF6/O2

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 Cleanrooms

The main features of cleanrooms are:

• overpressure (50Pa) for keeping particles

outside
• filtered air
• heating/cooling/humidification/drying of
incoming air
• laminar air flow in the working areas
• yellow light for photolithography
• distilled water (DI-Water)
• Materials compatibility
• Cleanroom clothes, gloves, head covers,
shoe covers,…

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 Cleanrooms

• Cleanroom costs
– very high: ca. 1 Mrd. € für 12” Cleanroom
– Equipment: > 1 Mio. € per machine
– Materials: very high purity
– Staff training
– Personnel costs (typically four shift operation 24h/Tag; 6-7 days/Week)

• Performance
– Wafers per Month: typically 5.000 – 20.000 (TSMC Taiwan: 160.000!)
– Wafer capacity per machine: ca. 60/h
– at each point in time there are ca. 10.000 – 50.000 Wafer in process

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 Cleanrooms

Simplified Fed. Std. 209D airborne particle cleanliness classes (particles/ft3)

Cleanroom class Particle number per cubic foot

Particle size Particle size

≥ 0.5 µm ≥ 5 µm

10 10 0
100 100 0
1.000 1.000 7
10.000 10.000 70
100.000 100.000 700

Class
Class100:
100:Particle
Particlecount
countnot
notto
toexceed
exceedaatotal
totalof
of100
100particles
particles
per
percubic
cubicfoot
footof
ofaasize
size0.5µ
0.5µ(micron).
(micron).

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 Cleanrooms

Typical particles in semiconductor class 100 room air

20% Equipment
Media
Air
40% Processes
5% Man

5%

30%

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 Cleanrooms

Cleanroom (Intel 1968), ca. class 10 000. Cleanroom (Intel 1990), ca. class 1.
using Laminar-Flow box using Full Protective Clothing

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 Cleanrooms

Laminar flow box

Air is drawn through a filter and blown

in a very smooth, laminar flow towards
the user

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 Cleanrooms

Process exhaust Air circulation External air

air system system system

Pressure chamber

Gray
room Filter cover
Cleanroom
Process
bench Raised floor

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 Cleanrooms

Overpressure in Cleanroom: Difference between cleanroom and grayroom ca. 15 hPa

Changing room Personnel sluice

Underpressure

Cleanroom finger
Cleanroom finger

Gray room

Material sluice Equipments

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 Cleanrooms

Changing room and Personnel sluice

Erlangen University

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