Subject
Date Revision
11/99 Proposal
In this technique, the test coupon is resistance heated 4.3 Sn60Pb40 or Sn63Pb37 Solder
by passing DC current through the internal layer
connection to the barrel for 3 minutes to bring the 4.4 Solder Flux
temperature of the copper to a designated temperature
(slightly above the Tg of the laminate in the sample.) 4.5 Soldering Iron
Switching the current on and off, creates thermal
cycles between room temperature and the designated 4.6 Multimeter - optional
temperature within the sample. This thermal cycling
induces cyclic fatigue strain in the plated-through hole 4.7 Thermal Imaging equipment - optional
barrels and internal layer interconnects and
accelerates any infant mortality or latent defects. 5.0 Procedure
Revision
Proposal
Page 2 of 4
IPC-TM-650
Number Subject Date
Revision
Proposal
6.3.1.4 Current The system selects an initial current 6.3.2.2 Individual coupons are continually recycled
based on the ambient resistance of the coupon and the using their customized heating and cooling conditions
current table. The current tables are derived from until one of the rejection criteria is achieved or the
software libraries on the IST equipment. During the maximum number of cycles is completed.
precycling sequence, the initial current is adjusted for
each coupon to assure the test temperature resistance 6.3.2.3 The coupon’s resistance “delta” (variance from
is achieved in 3 minutes + 3 seconds (see paragraph initial calculated resistance) increases (positively) as
6.3.1.5) failure inception occurs. The rate of change in the
delta is indicative of the mechanical change (failure)
NOTE: Additional equations/algorithms used by IST within the interconnects.
that establish the initial current selection for pre-
cycling, relative to the relationship of coupon 6.3.2.4 When each coupon delta reaches the
interconnect resistance αT , coupon construction and maximum resistance rejection criteria, IST stress
stress test temperature to be achieved are considered testing is stopped. The rejection criteria prevents
proprietary at this time. thermal runaway (burnout) plus allows for early
intervention for failure analysis to be completed
6.3.1.5 Pre-cycling is initiated by the application of the effectively.
selected current to the coupon, the computer monitors
and records the coupon’s performance throughout this 6.3.3 Graphing and Data Analysis
first cycle. If at the end of the 1st pre-cycle, the 6.3.3.1 The IST system continuously monitors the two
coupon achieves the specified resistance level in 3 independent circuits of each coupon, recording multiple
minutes + 3 seconds, it will be accepted for points of each cycle until the coupon exceeds one of
subsequent stress testing. If the resistance level was the rejection criteria. The data is compiled to create
not achieved in this time frame, the coupon will graphs of each or all coupon’s performance throughout
automatically be pre-cycled again with a revised or IST stress testing. Figure 2, 3 and 4 are typical
compensated current. The system will re-test using graphs.
revised conditions until all coupons are accepted or
rejected for stress testing.
RESISTANCE DEGRADATION OF THE PTH INTERCONNECT
ACCELERATION
at this time.
6.3.1.8 The system automatically records and saves -10 STRAIN RELIEF
IST CYCLES
PTH
coupon during the pre-cycle operation. Three minutes INTERCONNECT
-10
IST CYCLES
Figure 3
Page 3 of 4
IPC-TM-650
Number Subject Date
Revision
Proposal
RESISTANCE DEGRADATION IN MILLIOHMS
POST INTERCONNECT
PTH INTERCONNECT
0
1
IST CYCLES
Figure 4.
Page 4 of 4