matrix weakening and a grain boundary strength- . The pH of the slurries was adjusted to >11 in
ening. Following these authors, the thermal order to obtain suspensions where both the
expansion mismatch between Al2O3 and SiC leads Al2O3 and the SiC reached their lowest nega-
to the development of residual tensile micro-stres- tive zeta potential values, therefore allowing
ses into alumina grains and radial compressive mutual repulsion between particles in the
separate as well as in the mixed suspensions.
micro-stresses at grain boundaries (clamping stres-
. The two slurries were mixed, ultrasonically
ses). As a consequence, crack preferentially de¯ects agitated and vibration milled for 16 h using
through the grain which is con®rmed by fracture Al2O3 cylinders as the grinding media.
face analysis. Unfortunately, this mechanism, even . The mixed slurry was dried by freeze drying.
if supported by the works of some authors,8 is Finally the Al2O3/SiC mixed powder was hot
again unable to account for the higher modulus of pressed at 1550 C, under 40 MPa, for 30 min,
rupture measured at elevated temperature. in Ar. As a consequence of the processing
Another hypothesis, also based on grain boundary route, the impurity content detected by ICP
strengthening, but which better ®ts with the reported signi®cantly increased (Si: 65!861 ppm; Mg:
thermo-mechanical properties as it is less tempera- 12!46 ppm), due to erosion of the grinding
ture dependent, is based on the formation of very media and to the thin silica layer covering SiC
strong Al2O3±intergranular SiC bonds. Such strong nanoparticles.
interfacial bonds can be attributed, ®rst, to the lack of In order to assess any creep improvement resulting
residual glassy phase (which is squeezed out during from SiC nanophase addition, a reference sample
the cooling step of the ®ring process) and, secondly, was fabricated from unprocessed Al2O3 powder.
to lattice matches in many Al2O3/SiC interfaces.9 Taking into account that particles of the second-
The increase of the grain boundary strength is ary phase hinder grain growth, the hot pressing
con®rmed by the following experimental features: temperature was reduced to 1400 C to obtain a
. a change from an intergranular to a transgra- monolithic Al2O3 material having almost the same
nular fracture mode proving that the crack Al2O3 grain size as that of the nano composite.
propagates through Al2O3 grains;5 It must be emphasised that the Al2O3 raw mate-
. when grinding, cutting eects with grooves rial was hot pressed as-received with the goal of
formation becomes predominant over micro- obtaining a highly pure sintered material (almost
cracking and pull out (as it is the case for the free of residual glassy phase), which would have a
alumina matrix) and the surface can undergo creep resistance as high as possible for that system
higher compressive stress10 (as a consequence, (in spite of its small grain size).
samples ground using a 800 mesh diamond
wheel display higher strength values than 2.2 Characterisation of the sintered samples
polished ones: an increase of 34% has been Hot pressed monolithic Al2O3 and Al2O3±SiC
recorded on materials discussed in this paper);
nanocomposite samples have been characterised in
. the nanocomposite displays a better resistance
to erosion and, in addition, the wear rate terms of microstructure and of creep behaviour.
appears to be less grain size dependent.11 The microstructures of both materials have been
revealed by TEM observation of carbon-coated
Taking the above features into account, it is believed foils previously thinned by ion milling. In order to
that intergranular SiC particles very likely play a detect microstructural changes associated with the
major role in the improvement of the mechanical creep deformation process in both the monolithic
properties of nano composites. Therefore, the scope Al2O3 and the nanocomposite, specimens were pre-
of the present paper is to assess the eect of those pared from as-®red materials and from materials
bridging SiC grains on the creep behaviour. which had undergone creep.
The creep behaviour of both the Al2O3 monolith
and the nanocomposite was assessed in three-point
2 Experimental Procedure bending (Zwick 1474 universal testing machine) on
bars (dimension: 3435 mm3) using an Al2O3
2.1 Processing ¯exural jig having a 30 mm span.
Al2O3 (AKP 53, Sumitomo, Japan) matrix, contain- The displacement of the centre of the sample was
ing 5 vol% of SiC (UF45, HC Starck, Germany) measured throughout the test using a linear vari-
nano phase (0.26 m) was processed as follows: able displacement transducer with a precision of
less than 1 m. Creep tests were carried out on a
. Aqueous slurries of both the matrix and the universal testing machine ®tted with a close loop
secondary phase powders were ®rst separately regulation unit coupled to a function generator
dispersed by mechanical stirring (Al2O3) or by which allows very close control of the applied load
ultrasonic agitation (SiC). to be maintained.
Creep behaviour of Al2O3±SiC nanocomposites 2477
The bending stresses max and the strain rate "_max microstructure, resulted from intergranular SiC
were calculated according to relationships derived nanoparticles pinning the grain boundaries (Zener
from Hollenberg's analysis:12 pinning) and reducing their mobility (as con®rmed
by grain boundary bowing at SiC grains). As a
3PS 2n 1 consequence, grain growth was necessarily low-
max
1
2bh2 3n ered. When located in intragranular positions, SiC
nanoparticles were sometime associated with dis-
2h locations (Fig. 3) whose density seemed higher
"_max
n 2Y_ max
2
S2 than for the monolithic Al2O3.
A very small number of glassy pockets were
where P is the applied stress, S is the span between observed at triple points in the nanocomposite
the support rollers, h is the specimen thickness, b is microstructure.
the specimen width, n is the stress exponent and
Y_ max is the rate of displacement at the centre part of 3.2 Creep assessment
the specimen.
The creep parameters (stress exponent n and 3.2.1 Comparison between the creep resistance of
activation energy Q) were measured using stress the monolithic and the nanocomposite
and temperature jumps techniques. These techni- The creep resistances, of both the monolithic Al2O3
ques require a sudden change of either the applied and of the nanocomposite were determined under a
stress or the temperature during a single test and 100 MPa load at temperatures ranging from 1200
the measurement of the strain rate just before and to 1350 C (Fig. 4). At 1300 C, the monolith
immediately after the jump. deformation occured so rapidly that the transducer
limit (1 mm) was exceeded after 30 min and only
Fig. 1. TEM micrograph of monolithic alumina micro- Fig. 3. TEM micrograph of nanocomposite showing disloca-
structure prior to creep. tions associated with intragranular SiC particles.
2478 P. Descamps et al.
primary creep was recorded. On the other hand, at displayed a slow asymptotic recovery characteristic
the same temperature, deformation of the nano- of a viscoelastic eect and which very likely accounts
composite was considerably lower and no clear for the extended primary creep and for the delay of
steady state seemed to be reached. However, at a the steady state creep stage (Fig. 5). Such an anelastic
same stress but at a slightly higher temperature recovery has already been observed for SiC whisker-
(1350 C) the steady-state creep was attained. Fig- reinforced Al2O3 material.13,14 In that case, the
ure 4 clearly demonstrated that it was necessary to recovery was attributed to an interconnecting net-
increase the testing temperature of the nano- work of whiskers which develops during processing14
composite by at least 150 C in order to obtain over a percolation threshold which corresponds to 15
similar creep behaviour to that of the monolith. vol% of SiC whiskers.
3.2.2 Stress relaxation tests performed at elevated 3.2.3 Study of the viscoelastic phenomenon
temperature A threshold stress was identi®ed in the creep test
In contrast to the monolith for which only instanta- on the nanocomposite (between 20 and 25 MPa for
neous elastic recovery (sum of the elastic deformation tests carried out at 1300 C), below which no per-
of the specimen and of the testing machine) took place manent deformation occurred. The displacement
once the stress was removed, the nanocomposite also versus time curve at stresses below the threshold
Fig. 4. Flexural creep behaviour of monolithic alumina and nanocomposite under a stress of 100 MPa and a temperature ranging
from 1200 to 1350 C.
Fig. 5. Typical recorded creep and recovery curve and the nomenclature used to describe the various strains involved.
Creep behaviour of Al2O3±SiC nanocomposites 2479
stress was very similar to that of Kelvin±Voigt (K±V) where G is the spring constant, the shear compo-
viscoelastic model.15 nent of the stress, tu the time under load and l the
In fact, it is believed that this simple model for necessary time for recovery to be completed
creep and recovery which basically consists of a (retardation time) de®ned as l =G where is
spring and a dashpot in parallel can reasonably the dashpot viscosity.
explains the creep events at a grain boundary Thus, a plot of ln ("Vu
t) against t should yield a
bridged by a SiC particle. straight line, which is in contradiction with the
Taking into account the presence of a residual experimental results. Therefore, the nanocomposite
glassy phase at the grain boundaries, the K±V ele- behaviour could not be represented by such a sim-
ment can be related to grain boundary sliding impe- ple model.
ded by a pinning SiC particle. Indeed, during the In fact, the discrepancy very likely arose because
creep test, the shear stress component allowed grain the K±V element, only models a single grain
boundary sliding to occur at a velocity which depen- boundary pinned by a SiC particle.16 Since the
ded on the glass viscosity, i.e. the dashpot viscosity in bulk of the material contains many of these K±V
the K±V model. If the grain boundary is considered elements, each having its own characteristic
to be pinned by an SiC particle, the sliding process relaxation time, the summation of these elements
can only take place if the particle deforms elastically. requires the introduction of a spectrum of retarda-
This elastic deformation corresponds to the spring in tion times17 and eqn. (3) becomes:
the K±V model and is in parallel with the dashpot to
take into account that intergranular SiC particles 1 t
"V
t i "Vi
t 1 ÿ exp
ÿ
5
tend to counteract grain boundary sliding. Gi li
According to this viscoelastic model, the strain
variation as a function of time is given by the fol- On this basis, the Inokuchi analysis18 has been
lowing relationships: adopted. Using this iterative procedure, it is possi-
ble to assess values of Gi and li in the general vis-
t
"V
t 1 ÿ exp
ÿ
3 coelastic relationship and to de®ne the number of
G l K±V elements necessary to obtain a good ®t
during loading, and between the mathematically rebuilt curve and the
ÿt ÿ t experimentally measured recovery curve.
u
"VU
t exp
4 As con®rmed by Fig. 6, two K±V elements in
G l series enables the accurate modelling of the viscoe-
once the load removed; lastic contribution to the creep strain. However, if
Fig. 6. Experimental recovery curve and curve rebuilt from Inokuchi mathematical analysis.
2480 P. Descamps et al.
viscoelasticity ("v ) is the only additional contribu- increasing the number of cycles, the sample sti-
tion to elastic ("e ) and permanent steady-state ("st ) ness increases as the elastic strain component, "e ,
strains, the recovery curve must be the same as the slightly decreases. Both of these ®ndings undoubt-
primary curve after subtraction of "e and "st (Fig. edly highlight the fact that, in addition, to "e , "st
5). Thus and "V another transient unrecoverable phenom-
enon takes part in the deformation process. This
"
t ÿ "e ÿ "_st t
6 fourth creep contribution will be discussed here-
after on the basis of microstructural analysis of
on loading is necessarily equal to samples which had undergone creep testing.
"re "nre ÿ "
t ÿ tu
7 3.2.4 Study of the secondary creep mechanism
The stress exponent (n) and the apparent activation
during recovery (where "re is the fully recovered energy (Q) of the monolithic Al2O3 and the nano-
deformation and "nre is the unrecovered plastic composite were measured from log "_ versus log
strain expressed as "_st tu ). and ln "_ versus 1/T plots shown in Figs 8 and 9. As
However, successive loading±unloading cycles previously stated, the data for these plots were
during a single experiment showed that the above obtained using stress and temperature jump
equality was satis®ed starting from the third cycle experiments. Compared with the monolith, much
(Fig. 7). It can also be observed that, when higher testing temperatures have been adopted for
Fig. 7. Fitting between the third cycle recovery curve and the third cycle primary curve after subtraction of elastic and permanent strains.
Fig. 9. Strain rate ("_) versus inverse temperature for the matrix and the nanocomposite (=75 MPa).
Fig. 11. TEM micrograph of the nanocomposite after creep. Fig. 13. TEM micrograph of nanocomposite after creep
showing the presence of deformed grains due to plastic
accommodation of grain boundary sliding.
spring which represents SiC pinning the grain aligned grains, of grains pinned by SiC particles or
boundaries and counteracting sliding; even by grain boundaries progressively depleted in
. a permanent contribution that can be sche- residual glassy phase (depending on grain bound-
matically drawn by a dashpot in parallel with ary orientation, glassy phase can be squeezed out
a slider. when deformation proceeds). All those micro-
The dashpot represents the plastic deformation of structural features inhibit creep by progressively
grains through a lattice mechanism based on dis- impeding grain sliding and rearrangement and give
location motion whereas the slider corresponds to rise to the formation of a sti network. Once this
the threshold stress value above which dislocation process is completed, the discrepancy between vis-
motion is activated. coelastic creep during loading and recovery dis-
However, the dierence between the viscoelastic appears as illustrated by Fig. 7. At this stage, as
curves during loading and unloading observed for shown by TEM micrograph (Fig. 13), grain
the 1st and the 2nd cycles cannot be explained by boundary sliding can only continue under the con-
only considering these two creep contributions and dition that stresses associated with sliding are
an additional non-linear transient phenomenon relaxed by plastic deformation of the grains.
must be added. If such a deformation mechanism is adopted,
Taking into account the hardening phenomenon addition of nano-sized SiC particles is no longer a
highlighted by the elastic strain decrease with necessary condition in order to obtain a signi®cant
increasing number of cycles, it is proposed to relate improvement of the creep behaviour compared with
this transient phenomenon to the presence of badly monolithic alumina. Indeed, high creep resistance
Fig. 14. Diagram of the model adopted to explain nanocomposite creep behaviour.
Fig. 15. Flexural creep curves relative to monolithic alumina as well as nano- and microcomposites: (1300 C, =100 MPa).
2484 P. Descamps et al.
could also be expected when adding micron-sized that by carefully tailoring the microcomposite
particles provided that the matrix grains were microstructure (to promote location of SiC at grain
coarse enough to ensure grain boundary bridging boundaries), it is possible to obtain similar or even
by a large number of SiC grains. On that basis, lower strain levels.
Al2O3 composites containing various contents
either of nanometer or micron (0.98 m UF10-HC
Starck) sized SiC have been fabricated by the pro- 4 Conclusions
cessing route described in Section 2.1, in order to
assess their creep behaviour. A deformation mechanism is proposed for Al2O3±
The composite composition as well as some of SiC nanocomposite.
their microstructural characteristics such as grain The main factor controlling strain appears to be
size (measured both by an intercept method and by SiC nanoparticles pinning the grain boundaries
image analysis) and the number of bridging parti- with, as a consequence:
cle per grain are included in Table 1. . a decrease in grain boundary sliding
Curves relative to each composite (tested in the . a viscoelastic contribution to creep
following conditions: T=1300 C, =100 MPa) are . an enhancement of the grain boundary
presented in the same curve for ease of comparison strength allowing plastic deformation of
(Fig. 15). grains through dislocations motion.
Examination of these curves, clearly shows:
In addition, due to the presence of non-bridged
. That incorporation of a very low amount of grain boundaries, the applied stress causes initial
SiC nano particles (0.3 vol%) is apparently deformation by grain sliding and rearrangement of
sucient to markedly lower the creep strain
the microstructure. Such rearrangement can pro-
compared with the monolithic material. This
observation is not surprising if it is considered ceed until badly aligned grains or grain boundaries
that this composite, as well as all those inclu- either pinned by SiC particles or depleted in glassy
ded in Table 1, displayed transgranular frac- phase are encountered. When this occurs rearran-
ture at room temperature compared with gement is stopped and only lattice mechanisms
intergranular fracture in monolithic alumina. based on dislocation motion, and to a lesser extent,
. That the 10 vol% SiC microcomposite, which a viscoelastic mechanism still contribute to the
contained the largest number of SiC particles creep process.
pinning grain boundaries had the highest The sliding rearrangement phenomenon is tran-
creep resistance in spite of its relatively small sient in nature and in addition to the viscoelastic
grain size. behaviour explains therefore why under a given
. That, by comparison of 5 vol% nano and micro- temperature the steady state stage is delayed for
composites, the creep resistance is governed by
nanocomposite materials. The proposed deforma-
two counteracting eects: a large number of
bridging SiC particles induces the formation of tion mechanism which is mainly based on increased
sti clusters therefore increasing the `apparent' bonding between grains, is also in agreement with
grain size (favourable for creep resistance) but, in the room temperature mechanical properties as
turn, SiC particles tend to inhibit grain growth well as with the wear and the machining beha-
which facilitates deformation. viours. Indeed, such a mechanism necessarily pro-
motes strengthening at the expense of toughening
All these observations con®rm that addition of mechanisms, such as crack de¯ection or micro-
particles of nanometer size is not a necessary con- cracking, both involving propagation of the main
dition to obtain high creep resistant materials, and crack along the grain boundaries. As a con-
sequence, an especially large increase of the mod-
Table 1. Grain size and number of bridging particles per grain ulus of rupture and a change in the fracture mode
of alumina-based composites reinforced with various amounts which becomes transgranular are observed.
of either nano- or micro particles In the same way, grain pull out during machining
Matrix grain size (m) or during erosive wear is considerably reduced and
the wear rate is no longer grain-size dependent.
Material Intercept Image Number of
method analysis particles bridging Finally, it is pointed out that the suggested
the GBa deformation process predicts that incorporation of
5 vol% nano 0.5 0.5 1.5 micron-sized SiC particles in place of nano-sized
5 vol% micro 3.5 3.8 0.9 SiC should also result in an increase in creep resis-
0.3 vol% nano 4.1 4.4 0.2 tance of the same order of magnitude, which has
10 vol% micro 1.5 1.7 2.0
been con®rmed experimentally. The lower cost of
a
In the plane of the TEM micrographs. micron-sized particles and their easier dispersion
Creep behaviour of Al2O3±SiC nanocomposites 2485
would suggest that such materials would be more polycrystalline alumina. J. Eur. Ceram. Soc., 1996, 16,
799±802.
suitable as creep resistant materials. 12. Hollenberg, G. W., Terwillger, G. R. and Gordon, R. S.,
Calculation of stresses and strains in four-point bending
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