1. Product prole
1.1 General description
PNP general-purpose transistors.
Table 1: Product overview Package Philips BC807 BC807W BC327 [1]
[1]
Type number
Also available in SOT54A and SOT54 variant packages (see Section 2).
1.2 Features
s High current s Low voltage
1.3 Applications
s General-purpose switching and amplication
Min -
Typ -
Max 45
Unit V
500 mA 1 A
[1]
Philips Semiconductors
2. Pinning information
Table 3: Pin SOT23 1 2 3 base emitter collector
1 2 2
sym013
3 1
2
sot323_so
3 2 1
006aaa149
3 2 1
006aaa149
3 2 1
006aaa149
2 of 19
Philips Semiconductors
3. Ordering information
Table 4: Ordering information Name BC807 BC807W BC327 [2]
[1] [2]
Type number [1] Package Description plastic surface mounted package; 3 leads plastic surface mounted package; 3 leads Version SOT23 SOT323 SC-70 SC-43A
Valid for all available selection groups. Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9).
4. Marking
Table 5: BC807 BC807-16 BC807-25 BC807-40 BC807W BC807-16W BC807-25W BC807-40W BC327 BC327-16 BC327-25 BC327-40
[1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
Marking codes Marking code [1] 5D* 5A* 5B* 5C* 5D* 5A* 5B* 5C* C327 C32716 C32725 C32740
Type number
3 of 19
Philips Semiconductors
5. Limiting values
Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IBM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) peak collector current peak base current total power dissipation BC807 BC807W BC327 Tstg Tj Tamb
[1] [2]
Min -
Unit V V V mA A mA mW mW mW C C C
65 65
Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. Valid for all available selection groups.
6. Thermal characteristics
Table 7: Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient BC807 BC807W BC327
[1] [2]
Conditions
Min
Typ
Max
Unit
Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. Valid for all available selection groups.
4 of 19
Philips Semiconductors
7. Characteristics
Table 8: Characteristics Tamb = 25 C unless otherwise specied. Symbol ICBO Parameter collector-base cut-off current Conditions IE = 0 A; VCB = 20 V IE = 0 A; VCB = 20 V; Tj = 150 C IEBO hFE emitter-base cut-off current DC current gain BC807; BC807W; BC327 BC807-16; BC807-16W; BC327-16 BC807-25; BC807-25W; BC327-25 BC807-40; BC807-40W; BC327-40 hFE VCEsat VBE Cc fT DC current gain collector-emitter saturation voltage base-emitter voltage collector capacitance transition frequency
Pulse test: tp 300 s; 0.02. VBE decreases by approximately 2 mV/K with increasing temperature.
Min [1]
Typ 5 -
Unit nA A nA
100 100 160 250 IC = 500 mA; VCE = 1 V IC = 500 mA; IB = 50 mA IC = 500 mA; VCE = 1 V IE = ie = 0 A; VCB = 10 V; f = 1 MHz IC = 10 mA; VCE = 5 V; f = 100 MHz
[1] [1]
40 80
mV V pF MHz
[2]
[1] [2]
5 of 19
Philips Semiconductors
300
(1)
006aaa119
600
006aaa120
hFE
hFE
(1)
200
(2)
400
(2)
100
(3)
200
(3)
0 101
10
102 I C (mA)
103
0 101
10
102 I C (mA)
103
Fig 1. Selection -16: DC current gain as a function of collector current; typical values.
800 hFE 600
(1)
Fig 2. Selection -25: DC current gain as a function of collector current; typical values.
006aaa121
400
(2)
200
(3)
0 101
10
102 I C (mA)
103
Fig 3. Selection -40: DC current gain as a function of collector current; typical values.
6 of 19
Philips Semiconductors
10
006aaa122
10
006aaa123
VBEsat (V)
VBEsat (V)
101 101
10
102 I C (mA)
103
101 101
10
102 I C (mA)
103
Fig 4. Selection -16: Base-emitter saturation voltage as a function of collector current; typical values.
10
Fig 5. Selection -25: Base-emitter saturation voltage as a function of collector current; typical values.
006aaa124
VBEsat (V)
101 101
10
102 I C (mA)
103
Fig 6. Selection -40: Base-emitter saturation voltage as a function of collector current; typical values.
7 of 19
Philips Semiconductors
006aaa125
006aaa126
VCEsat (V)
101 102
(1)
(3)
(2)
102 101
10
102 I C (mA)
103
103 101
10
102 I C (mA)
103
Fig 7. Selection -16: Collector-emitter saturation voltage as a function of collector current; typical values.
1 VCEsat (V) 101
Fig 8. Selection- 25: Collector-emitter saturation voltage as a function of collector current; typical values.
006aaa127
(1) (2)
102
(3)
103 101
10
102 I C (mA)
103
Fig 9. Selection -40: Collector-emitter saturation voltage as a function of collector current; typical values.
8 of 19
Philips Semiconductors
006aaa128
1.2
(3)
006aaa129
(2) (1)
(2)
(1)
IC (A) 0.8
0.4
(9) (10)
0.4
(10)
0 0
5 VCE (V)
0 0
5 VCE (V)
Tamb = 25 C. (1) IB = 16.0 mA. (2) IB = 14.4 mA. (3) IB = 12.8 mA. (4) IB = 11.2 mA. (5) IB = 9.6 mA. (6) IB = 8.0 mA. (7) IB = 6.4 mA. (8) IB = 4.8 mA. (9) IB = 3.2 mA. (10) IB = 1.6 mA.
Tamb = 25 C. (1) IB = 13.0 mA. (2) IB = 11.7 mA. (3) IB = 10.4 mA. (4) IB = 9.1 mA. (5) IB = 7.8 mA. (6) IB = 6.5 mA. (7) IB = 5.2 mA. (8) IB = 3.9 mA. (9) IB = 2.6 mA. (10) IB = 1.3 mA.
Fig 10. Selection -16: Collector current as a function of collector-emitter voltage; typical values.
Fig 11. Selection -25: Collector current as a function of collector-emitter voltage; typical values.
9 of 19
Philips Semiconductors
006aaa130
(2)
(1)
0.4
(10)
0 0
5 VCE (V)
Tamb = 25 C. (1) IB = 12.0 mA. (2) IB = 10.8 mA. (3) IB = 9.6 mA. (4) IB = 8.4 mA. (5) IB = 7.2 mA. (6) IB = 6.0 mA. (7) IB = 4.8 mA. (8) IB = 3.6 mA. (9) IB = 2.4 mA. (10) IB = 1.2 mA.
Fig 12. Selection -40: Collector current as a function of collector-emitter voltage; typical values.
10 of 19
Philips Semiconductors
8. Package outline
Plastic surface mounted package; 3 leads SOT23
HE
v M A
Q A A1
1
e1 e bp
2
w M B detail X Lp
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max. 0.1 bp 0.48 0.38 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 0.95 HE 2.5 2.1 Lp 0.45 0.15 Q 0.55 0.45 v 0.2 w 0.1
EUROPEAN PROJECTION
11 of 19
Philips Semiconductors
SOT323
HE
v M A
3
Q
A1 c
1
e1 e bp
2
w M B Lp detail X
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.4 0.3 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.23 0.13 v 0.2 w 0.2
EUROPEAN PROJECTION
12 of 19
Philips Semiconductors
SOT54
E d A L b
1
D
e1 e
3
b1
L1
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 5.2 5.0 b 0.48 0.40 b1 0.66 0.55 c 0.45 0.38 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 e 2.54 e1 1.27 L 14.5 12.7 L1(1)
max.
2.5
Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 REFERENCES IEC JEDEC TO-92 JEITA SC-43A EUROPEAN PROJECTION ISSUE DATE 04-06-28 04-11-16
13 of 19
Philips Semiconductors
SOT54A
E d
A L2
L b
1
D
e1 e
2 3
b1
L1
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 5.2 5.0 b 0.48 0.40 b1 0.66 0.55 c 0.45 0.38 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 e 5.08 e1 2.54 L 14.5 12.7 L1(1)
max.
L2 3 2
Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54A REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 97-05-13 04-06-28
14 of 19
Philips Semiconductors
SOT54 variant
e1
L2
E d A L b
1 2
D e1 e
3
b1
L1
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 5.2 5.0 b 0.48 0.40 b1 0.66 0.55 c 0.45 0.38 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 e 2.54 e1 1.27 L 14.5 12.7 L1(1) max 2.5 L2 max 2.5
Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 variant REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-06-28 05-01-10
15 of 19
Philips Semiconductors
9. Packing information
Table 9: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number BC807 BC807W BC327 BC327 BC327 BC327
[1]
Description 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel bulk, straight leads tape and reel, wide pitch tape ammopack, wide pitch bulk, delta pinning (on-circle)
Packing quantity 3000 -215 -115 5000 -412 -112 10000 -235 -135 -116 -126 -
For further information and the availability of packing methods, see Section 14.
16 of 19
Philips Semiconductors
The format of the data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. This data sheet is a combination of the previous data sheets BC807_4, BC807W_3 and BC327_3. Table 1 and 2 added Table 3 Discrete pinning for SOT54A and SOT54 variant added Table 5 Marking codes for BC327, BC327-16, BC327-25 and BC327-40 added Table 8 Typical value for Cc changed to 5 pF according to CPCN200302007F1 Figure 1, 2 and 3 amended Figure 4, 5, 6, 7, 8, 9, 10, 11 and 12 added Figure 15 changed according to CPCN200405006F Figure 16 and 17 added Section 9 added Product specication Product specication Product specication 9397 750 12393 9397 750 05954 9397 750 05675 BC807_3 BC807W_808W_ CNV_2 BC327_2
17 of 19
Philips Semiconductors
III
Product data
Production
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Denitions
Short-form specication The data in a short-form specication is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values denition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specied use without further testing or modication.
13. Disclaimers
Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specied.
18 of 19
Philips Semiconductors
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 Product prole . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Packing information. . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 18 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information . . . . . . . . . . . . . . . . . . . . 18