Hmec 25: Component Maintenance Manual

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415
75532
component maintenance manual

(with illustrated parts list)
HMEC 25
This manual includes coverage of the following equipment: Model No Boomset HMEC 25-KAX Sennheiser Part No 025-230-415
Sennheiser electronic GmbH & Co. KG D - 30900 Wedemark Tel.: 05130 / 600 - 0 Fax: 05130 / 600 - 300 Vendor Code: D 8114
Printed in Germany
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June 29/98
RECORD OF REVISIONS REV NO ISSUE DATE DATE INSERTED BY REV NO ISSUE DATE DATE INSERTED BY REV NO ISSUE DATE DATE INSERTED BY
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Record of Revisions Pages 1/2 June 29/98
RECORD OF TEMPORARY REVISIONS TEMPORARY REV NO PAGE NUMBER ISSUE DATE BY DATE REMOVED BY
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Record of Temporary Revisions Pages 1/2 June 29/98
SERVICE BULLETIN LIST SERVICE BULLETIN NO MANUAL REVISION NUMBER MANUAL REVISION DATE
SUBJECT
NOTE: Refer to modification history figure preceding schematic diagrams for additional service bulletin information
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Service Bulletin List Pages 1/2 June 29/98
LIST OF EFFECTIVE PAGES SUBJECT Title Record of Revisions Record of Temporary Revisions Service Bulletin List List of Effective Pages Table of Contents Introduction 1 2 1 2 PAGE DATE June 29/98 June 29/98 Blank June 29/98 Blank Cleaning SUBJECT Disassembly PAGE 301 302 303 304 401 402 501 502 601 602 701 702 703 704 801 802 901 902 903 904 1001 1002 1003 1004 1005 1006 DATE June 29/98 June 29/98 June 29/98 Blank June 29/98 Blank June 29/98 Blank June 29/98 Blank June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 Blank June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 Blank
Check 1 2 1 2 1 2 1 2 3 4 1 2 3 4 5 6 101 102 103 104 105 106 107 108 109 110 111 112 June 29/98 Blank Repair June 29/98 Blank June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 Blank June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 June 29/98 Assembly (Including Storage)
Fits and Clearances Special Tools, Fixtures, and Equipment
Description and Operation
Illustrated Parts List
Testing and Troubleshooting
* The asterisk indicates pages changed, added, or deleted by the current change.
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List of Effective Pages Pages 1/2 June 29/98
TABLE OF CONTENTS SUBJECT PAGE
INTRODUCTION .......................................................................................................................... 1 1. General ....................................................................................................................... 1 2. List of Illustrations ........................................................................................................ 2 3. Advisories ................................................................................................................... 3 4. Frontispiece ................................................................................................................. 4 DESCRIPTION AND OPERATION ................................................................................................... 1 1. General ....................................................................................................................... 1 2. Purpose of Equipment .................................................................................................. 1 3. Equipment Specifications .............................................................................................. 2 4. Equipment Description .................................................................................................. 3 A. Mechanical Description ....................................................................................... 3 B. Electrical Description .......................................................................................... 5 TESTING ............................................................................................................................... 101 1. Testing .................................................................................................................... 101 A. Introduction ................................................................................................... 101 B. Test Equipment and Power Requirements ........................................................ 101 C. Test Procedures ............................................................................................ 101 2. Troubleshooting ....................................................................................................... 103 A. Philosophy ..................................................................................................... 103 B. Troubleshooting Approach .............................................................................. 103 C. Troubleshooting Aids ...................................................................................... 104 D. NoiseGard active noise compensation ............................................................ 104 E. Introduction to HMEC 25 Troubleshooting ........................................................ 105 DISASSEMBLY ....................................................................................................................... 301 1. Introduction ............................................................................................................. 301 2. Precautions and General Techniques ......................................................................... 301 3. Procedure ............................................................................................................... 301 A. Ear pad Disassembly ...................................................................................... 302 B. Headphone Capsule Disassembly .................................................................... 302 C. Microphone Arm Holder Disassembly ............................................................... 303 CLEANING ............................................................................................................................. 401 1. Introduction ............................................................................................................. 401 2. Cleaning Materials .................................................................................................... 401 3. Procedures .............................................................................................................. 401
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Table of Contents Page 1 June 29/98
TABLE OF CONTENTS SUBJECT PAGE
CHECK .................................................................................................................................. 501 1. Introduction ............................................................................................................. 501 2. Procedures .............................................................................................................. 501 REPAIR .................................................................................................................................. 601 1. Introduction ............................................................................................................. 601 2. Repair Supplies ........................................................................................................ 601 3. Procedures .............................................................................................................. 601 ASSEMBLY ............................................................................................................................ 701 1. General ................................................................................................................... 701 2. Precautions and General Techniques ......................................................................... 701 A. Wiring ............................................................................................................ 701 3. Detailed Assembly Procedures .................................................................................. 701 A. Microphone Arm Holder Assembly ................................................................... 702 B. Headphone Capsule Assembly ........................................................................ 703 C. Ear Pad Assembly .......................................................................................... 703 4. Final Testing ............................................................................................................ 704 5. Storage Instructions ................................................................................................. 704 FITS AND CLEARANCES ......................................................................................................... 801 SPECIAL TOOLS, FIXTURES, AND EQUIPMENT ......................................................................... 901 1. Test Equipment/Resource Requirements ................................................................... 901 ILLUSTRATED PARTS LIST .................................................................................................... 1001 1. Introduction ........................................................................................................... 1001 A. Detailed Parts List ........................................................................................ 1001
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Table of Contents Page 2 June 29/98
INTRODUCTION 1. General This component maintenance manual (with illustrated parts list) includes maintenance instructions prepared in accordance with ATA Specification No 100 for Manufacturers Technical Data for the Sennheiser HMEC 25 Boomset. REMARK: TESTING AND SERVICING HEADPHONE AND MICROPHONE SECTION IS HANDLED IN TWO SEPARATE MANUALS. WITH THE NEW VERSION OF THE HMEC 25 BOOMSET THE MICROPHONE AMPLIFIER IS LOCATED IN THE HOUSING OF THE NEW MKE 45 ELECTRET MICROPHONE. THIS MODULAR DESIGN OF ELECTRET MICROPHONE CAPSULE AND MICROPHONE AMPLIFIER FITTED TOGETHER IN A STAND-ALONE HOUSING SEPARATE FROM THE HEADPHONE SECTION PROVIDES A HIGHER FLEXIBILITY TOWARDS NEW PRODUCTS, SO THAT ALL NEW HEADSETS FOR AVIATION (E.G. HMEC 25, HME 45 AND HMEC 45) ARE EQUIPPED LIKEWISE.
The maintenance instructions are presented in the following sections: Description and Operation; Testing; Disassembly; Cleaning; Check; Repair; Assembly (Including Storage); Fits and Clearances; Special Tools, Fixtures, and Equipment; and Illustrated Parts List. This component maintenance manual provides shop-verified procedures that will enable a mechanic unfamiliar with the equipment to restore it to a serviceable condition. The procedures are prepared for the mechanic that performs shop work and not for the aircraft mechanic. CAUTION: THE MATERIAL IN THIS MANUAL IS SUBJECT TO CHANGE. BEFORE ATTEMPTING ANY MAINTENANCE OPERATION ON THE EQUIPMENT COVERED IN THIS MANUAL, VERIFY THAT YOU HAVE COMPLETE AND UP-TO-DATE PUBLICATIONS BY REFERRING TO THE APPLICABLE PUBLICATIONS AND SERVICE BULLETIN INDEXES.
We welcome your comments concerning this manual. Although every effort has been made to keep it free from errors, some may occur. When reporting a specific problem, please describe it briefly and include the manual part number, the paragraph or figure number, and the page number. Send your comments to: Sennheiser electronic GmbH & Co. KG Publications Department D - 30900 Wedemark
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Introduction Page 1 June 29/98
2. List of Illustrations FIGURE 1 2 3 4 101 102 103 104 105 106 107 108 109 110 111 301 302 303 401 701 702 703 901 1 2 PAGE Equipment Covered ....................................................................................................... 1 Equipment Specifications ............................................................................................... 2 HMEC 25-KAX Outline Dimensions .................................................................................. 3 HMEC 25-KAX Connector Pin Assignments ...................................................................... 4 Test Setup Diagram 1 ............................................................................................... 102 Test Procedures ....................................................................................................... 102 Test Procedure Outline .............................................................................................. 105 Test Setup Diagram 2 ............................................................................................... 106 Fault Isolation Procedure ........................................................................................... 106 Test Setup Diagram 3 ............................................................................................... 107 HMEC 25 NoiseGard Circuit Card Assembly, Maintenance Aid Diagram ....................... 108 HMEC 25 NoiseGard Circuit Card Assembly, Schematic Diagram ................................ 109 HMEC 25-KAX Schematic Diagram ............................................................................. 110 HMEC 25 Wiring Diagram .......................................................................................... 111 HMEC 25-KAX Connecting Cable ................................................................................ 112 HMEC 25 Ear Pad Disassembly .................................................................................. 302 HMEC 25 Headphone Capsule Disassembly ................................................................ 302 HMEC 25 Microphone Arm Holder Disassembly ........................................................... 303 Cleaning Materials ..................................................................................................... 401 HMEC 25 Microphone Arm Holder Assembly ............................................................... 702 HMEC 25 Headphone Capsule Assembly ..................................................................... 703 HMEC 25 Ear Pad Assembly ...................................................................................... 703 Tools, Fixtures, and Equipment .................................................................................. 901 HMEC 25-KAX Boomset Assembly ............................................................................ 1002 HMEC 25 Microphone Arm Holder Assembly ............................................................. 1004
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3. Advisories WARNING: THIS UNIT EXHIBITS A VERY HIGH DEGREE OF FUNCTIONAL INTEGRITY. NEVERTHELESS, USERS MUST RECOGNIZE THAT IT IS NOT PRACTICAL TO PROVIDE MONITORING FOR ALL CONCEIVABLE SYSTEM FAILURES AND THAT, HOWEVER UNLIKELY, IT IS POSSIBLE THAT ERRONEOUS OPERATION COULD OCCUR WITHOUT A FAULT INDICATION. THE PILOT HAS THE RESPONSIBILITY TO DETECT SUCH AN OCCURRENCE BY MEANS OF CROSS-CHECKS WITH REDUNDANT OR CORRELATED INFORMATION AVAILABLE IN THE COCKPIT. WARNING: WHILE PERFORMING MAINTENANCE WITH THE COVERS REMOVED FROM THIS UNIT, SERVICE PERSONNEL ARE ADVISED TO OBSERVE STANDARD SAFETY PRECAUTIONS TO PREVENT PERSONAL INJURY.
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CAUTION:
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ELECTROSTATIC SENSITIVE DEVICES

OBSERVE PRECAUTIONS FOR HANDLING
ESDS DEVICES ARE SUBJECT TO DAMAGE BY EXCESSIVE LEVELS OF VOLTAGE AND/OR CURRENT, JUST AS ARE MORE CONVENTIONAL SEMICONDUCTOR DEVICES. HOWEVER, THE PRECAUTIONS NORMALLY USED TO PROTECT SEMICONDUCTORS ARE NOT SUFFICIENT FOR THE PROTECTION OF ESDS COMPONENTS, BECAUSE OF THEIR VERY HIGH ELECTRICAL RESISTANCE. THE LOW-ENERGY SOURCE THAT MOST COMMONLY DESTROYS ESDS DEVICES IS THE HUMAN BODY, WHICH IN CONJUNCTION WITH NONCONDUCTIVE GARMENTS AND FLOOR COVERINGS GENERATES AND RETAINS STATIC ELECTRICITY. IN ORDER TO ADEQUATELY PROTECT ESDS DEVICES, THE DEVICE AND EVERYTHING THAT CONTACTS IT MUST BE BROUGHT TO GROUND POTENTIAL BY PROVIDING A CONDUCTIVE SURFACE AND DISCHARGE PATHS. THE FOLLOWING PRECAUTIONS MUST BE FOLLOWED: A. DEENERGIZE OR DISCONNECT ALL POWER AND SIGNAL SOURCES AND LOADS. B. PLACE THE UNIT ON GROUNDED CONDUCTIVE WORK SURFACE. C. GROUND THE REPAIR OPERATOR THROUGH A CONDUCTIVE WRIST STRAP OR OTHER DEVICE USING A 470-k OR 1-M SERIES RESISTOR TO PROTECT THE OPERATOR. D. GROUND ANY TOOLS, SUCH AS SOLDERING EQUIPMENT, THAT WILL CONTACT THE UNIT. CONTACT WITH THE OPERATORS HAND PROVIDES A SUFFICIENT GROUND FOR TOOLS THAT ARE OTHERWISE ELECTRICALLY ISOLATED. E. WHEN ESDS DEVICES AND ASSEMBLIES ARE NOT IN THE UNIT, THEY SHOULD BE ON THE CONDUCTIVE WORK SURFACE OR IN CONDUCTIVE CONTAINERS. WHEN A DEVICE OR ASSEMBLY IS INSERTED IN OR REMOVED FROM A CONTAINER, THE OPERATOR SHOULD MAINTAIN CONTACT WITH THE CONDUCTIVE PORTION OF THE CONTAINER. DO NOT USE PLASTIC BAGS UNLESS THEY HAVE BEEN IMPREGNATED WITH A CONDUCTIVE MATERIAL. F. DO NOT HANDLE ESDS DEVICES UNNECESSARILY OR REMOVE THEM FROM THEIR PACKAGES UNTIL ACTUALLY USED OR TESTED. G. TO PREVENT DAMAGE BY TRANSIENT VOLTAGES, ONLY SOLDERING IRONS HAVING ZERO VOLTAGE AT THE TIP SHOULD BE USED.
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4. Frontispiece
Typical HMEC 25 Boomset
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DESCRIPTION AND OPERATION 1. General Refer to frontispiece for an overall view of the HMEC 25 Boomset. Figure 1 is a list of the equipment covered in this manual.
MODEL NO
DESCRIPTION
SENNHEISER PART NUMBER 025-230-415
HMEC 25-KAX
Boomset with microphone amplifier and jack connector. Microphone amplifier is fitted in the microphone housing. The Boomset facilitates +12 to 35 V Jack Panel powering using a specially designed XLR connector with a DC/DC Converter. Equipment Covered Figure 1
2. Purpose of Equipment The HMEC 25 Boomset was designed to provide excellent wearing comfort by making it lightweight, provide unequaled transmission quality by using Sennheisers own noise-compensated microphones and acoustically matched earphone transducers. The HMEC 25 Boomset is designed to permit permanent use in aircraft cockpits. It incorporates electronic circuits and components that serve to process signals for a Standard Jack Panel. The HMEC 25 Boomset is powered from +16 V dc supplied by a Standard Jack Panel. The NoiseGard circuit is powered from +12 to 35 V dc supplied by a Jack Panel.
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3. Equipment Specifications Figure 2 lists the specifications for the HMEC 25-KAX Boomset.
CHARACTERISTICS Physical Weight, without cable Length of cable Panel connector Headphones Transducer principle Frequency response Impedance Sensitivity (1 kHz, 1 mW) Active noise compensation Total harmonic distortion Headband pressure Microphone and amplifier* Transducer principle Frequency response Max. sound pressure level (distortion < 5 %) Output voltage Terminating impedance Supply voltage Power supply for NoiseGard system
SPECIFICATION
approx. 170 gr 1.8 m PJ-055 (Headphone), PJ-068 (Microphone) XLR 3-pin plug (Panel powering) dynamic, supraaural, closed 16 to 22,000 Hz 200 (connected in parallel) 92 dB/SPL 3 dB 15 dB 1.5 dB between 100 Hz and 2 kHz <1% approx. 2.5 N back-electret condenser capsule, noise-compensated 300 to 5,000 Hz 120 dB 400 mV 3 dB at 114 dB/SPL (corresponding to RTCA/DO 214) 150 typ. 16 V dc (8 V to 16 V), approx. 20 mA +12 to 35 V dc Jack Panel supply fed into XLR 3-pin plug. Typical current consumption between 10 mA and 30 mA with a maximum of 50 mA
*NOTE: For servicing the MKE 45 microphone refer to the CMM MKE 45, Part No. 70566, ATARF 23-41-24.
Equipment Specifications Figure 2
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4. Equipment Description A. Mechanical Description The HMEC 25-KAX Boomset is connected to a Standard Jack Panel with two jack plugs. The boomset consists of a split headband and two headphone systems. The boom microphone can be rotated through approx. 135.
HMEC 25-KAX Outline Dimensions Figure 3
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B. Electrical Description The MKE 45 microphone of the HMEC 25-KAX Boomset is powered from + 16 V dc. The boomset consists of a boom microphone with amplifier for air traffic communication and two headphone systems.
Front view
Input +12 to 35 V
Ground
PIN / CONDUCTOR
1 2,4 3 5 6 7,8 / / / / / / red blue,screen blue red black yellow,blue
FUNCTION
Boom microphone Hi Boom microphone Lo Ground (Supply voltage) +12 V Supply voltage Audio sidetone Lo Audio sidetone Hi
HMEC 25-KAX Connector Pin Assignments Figure 4
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TESTING AND TROUBLESHOOTING 1. Testing A. Introduction Avionics equipment requiring testing usually falls into the following categories: (1) Units received from the line maintenance personnel with a general complaint of bad or no function that require testing to verify that a fault exists. (2) Units that have been repaired and must be verified by the repairing agency as a part of the repair cycle. WARNING: WHILE PERFORMING MAINTENANCE WITH THE COVERS REMOVED FROM THIS UNIT, ALL SERVICE PERSONNEL IS ADVISED TO OBSERVE STANDARD SAFETY PRECAUTIONS TO PREVENT PERSONAL INJURY.
The testing information included covers the headphone and NoiseGard section and is provided to assist the technician in accomplishing the above two categories. For testing the microphone section (Electret capsule and amplifier) refer to the Component Maintenance Manual for the MKE 45 microphone, Part No. 70566, ATARF 23-41-24. The performance test provides a functional operational check of the equipment and is recommended to be used as a customer acceptance test if the customer decides to do so. In addition, this test must be performed on units removed from an aircraft for test or repair prior to reinstallation of that unit. In the event of a unit from an aircraft is received with a specific complaint, the performance test does not have to be performed. Saving time rather refer to the test procedure, figure 102, to begin immediate troubleshooting. B. Test Equipment and Power Requirements (1) Test Equipment Refer to figure 108 and to Tools, Fixtures, and Equipment, figure 901, for test equipment required. (2) Power Source The HMEC 25 Boomset requires +16 V dc power for test purposes. The NoiseGard circuit must be powered by switching on an external +12 to 35 V supply. C. Test Procedures Refer to figure 101 for initial setup.
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Page 101 June 29/98
SINE - WAVE GENERATOR
Audio frequency signal from Jack plug Pin 7,8 to Pin 6
IMPEDANCE METER
from Jack plug Pin 7,8 to Pin 6
Test Setup Diagram 1 Figure 101
STEP 1.0 1.1
PROCEDURE HEADPHONE / NoiseGard CHECK Connect Boomset to supply voltage (+12 to 35 V dc). Set sine wave generator to 1 kHz/775 mV ac and connect as shown in figure 101. Switch off NoiseGard circuit. Vary audio frequency of the sine-wave generator from 20 Hz to 20 kHz. Disconnect sine-wave generator and check impedance with impedance meter (1 kHz) Disconnect impedance meter and switch on NoiseGard circuit. Check current consumption. Put Boomset onto your head. Using your hands gently knock against the capsule housing (both left and right). Connect Boomset with sine wave generator and set to 2.2 V rms. Vary audio frequency of the sine-wave generator from 20 Hz to 20 kHz. Test Procedures Figure 102
RESULTS
1.2
1.3
Aural test of headphone capsules. Check distortion. 200
1.4
1.5
I (14 - 18) mA No ambient noise like rustle, humming or hissing must be audible. Imax 50 mA. Audio signal must be present at both left and right channel. No ambient noise must occur.
1.6
1.7
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2. Troubleshooting A. Philosophy This section is the focal point that repair personnel should use to isolate faults in the unit. All sections of this manual contain important information to aid in the accomplishment of total repair and understanding of the unit. These sections are referenced, as necessary, to facilitate completion of the repair task. Troubleshooting avionics equipment usually falls into two categories: failures with a specific complaint and failures with an unspecified complaint. The function of this section is to guide fault isolation, first to a specific malfunction, and then to the applicable circuit area. Voltages and waveforms, in addition to the theory of operation, help lead the technician to isolation of faulty parts.
B. Troubleshooting Approach (1) Unspecified Complaint Troubleshooting a unit with an unspecified complaint requires the technician to test the unit according to the performance test to determine if a fault actually exists. In cases where the unit passes all portions of the test and no fault is discovered, the unit can be returned to the aircraft as good and reinstalled. When a unit does fail the performance test, the next objective is to isolate the actual fault or faults, and begin in-depth troubleshooting procedures. Begin by performing the specific associated test in the fault isolation test procedure in this section. (2) Specified Complaint The test technician may, at his discretion, choose to omit the performance test and proceed directly to the fault isolation test. (3) Fault Isolation Test The next logical step is to perform the specific fault isolation test that is associated with the complaint or failed step in the performance test. These tests examine more completely the functions and circuits associated with the trouble area. Further testing using the troubleshooting aids provided throughout this manual is necessary to isolate individual failed parts. These troubleshooting aids are identified and explained in paragraph C.
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C. Troubleshooting Aids (1) Maintenance Aid Diagrams Maintenance aid diagrams illustrate the physical location of all components on the major assemblies and can be found adjacent to each applicable schematic diagram. (2) Test Points Test points are physical points located on an assembly to allow a technican to make necessary voltage and waveform measurements during fault isolation procedures. These points may or may not be actual jacks. The test points are identified in a rectangle on the schematic and maintenance aid diagrams. Each test point identifies a major voltage or waveform important for circuit operation. These points may also be referenced in test and troubleshooting procedures. (3) Waveforms Waveforms are an important tool in troubleshooting and can be used to fault isolate to a defective stage when used properly. Waveforms are located on the maintenance aid diagrams when applicable, and are keyed to proper test points to aid in their physical location. Near each waveform are listed the oscilloscope settings the technician can use to reconstruct the conditions required to obtain the proper measurement. (4) Voltages Circuit voltages are illustrated on the schematic diagram to help the technician in circuit fault isolation.
D. NoiseGard active noise compensation The basic principle of NoiseGard active noise compensation is built upon the idea of cancelling a defined signal spectrum of ambient noise disturbing speech related signals. In technical terms this is achieved by adding the ambient noise with the same, but phase-inverted (180) signal in an electronic circuit. Both electret mic capsule, feedback circuitry and headphone capsule represent one complete (and pre-aligned) unit, i.e. due to component tolerances in each unit repairing or exchanging just one unit could lead to an excessive deviation of bias points towards the compensating parameters. Each such service case means an elaborated alignment is of high importance involving very specific test procedures and equipment. For that reason we do not recommend repairing any of these units in separate but preferably exchanging them as a complete unit! Your stock should be prepared to keep a certain number of complete units as spare in case any malfunction in the compensating circuit is detected. The defective devices then after exchanging should be sent to the Sennheiser headquarter plant where repair is performed according to all specifications. Thereafter the devices will be returned to keep your stock complete. Spare Part No. for ordering a complete unit: 75550
Also refer to page 1002/1003, Detailed Parts List, for an overall - view.
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E. Introduction to HMEC 25 Troubleshooting (1) Test Procedure Contents To aid in determining the most direct approach to troubleshooting, especially on units with specific complaints, an outline of the test procedure contents (figure 103) is provided. The outline lists each test, the purpose of the test, and refers to a particular section in the fault isolation procedure should a test fail.
TEST
TEST NAME
PURPOSE OF TEST
FAULT ISOLATION PROCEDURE STEP (SEE FIGURE 105) 1.0 2.0
2 3
NoiseGard dc voltage NoiseGard signal processing
Checks internal dc voltages (NoiseGard) Checks NoiseGard active/passive function
Test Procedure Outline Figure 103
(2) Fault Isolation Procedure The fault isolation procedure (figure 105) is provided as an aid in isolating the cause of failure in a particular test. NOTE: The symptoms listed in the fault isolation procedure are those thought to be the most common and are to help the technican test the circuit in logical sequence. They may not cover all possible problems. If a problem is encountered that is not covered in the fault isolation procedure, the waveforms on the maintenance aid diagrams should be used to isolate a particular problem.
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DC/DC CONVERTER (XLR 3-pin) +12 to 35 V +12 V
DVM
HMEC 25 NoiseGard Circuit Card Assembly
TP3/4
TP5/6 TP1 TP2
Test Setup Diagram 2 Figure 104
TEST STEP 1.0 1.1
CIRCUIT NoiseGard DC VOLTAGE Supply voltage (internal). Check from TP3/4 to TP2 (gnd). Check from TP5/6 to TP2 (gnd). Supply voltage electret mic capsule. Check from TP1 to TP2 (gnd). Bias voltage output amplifier. Check from Q5/7 (collector) to TP2 (gnd). Check from Q6/8 (collector) to TP2 (gnd).
RESULTS
COMMENTS
+ 6 V dc. 6 V dc. + 5 V dc.
Check C19/21.
1.2
Check C18, R1.
1.3
+ 6 V dc. 6 V dc.
Check Q5/7. Check Q6/8.
REMARK:
Further measurements are not recommendable. Refer to page 105/paragraph 2.D for amendments given towards handling NoiseGard active noise compensation. Fault Isolation Procedure Figure 105 (Sheet 1 of 3)
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SINE - WAVE GENERATOR
AFmeter
NoiseGard Compensation Circuit No servicing/repairing of any electronic components within NoiseGard Compensation Circuit. Refer to page 105/paragraph 2.D. Active Audio Circuit
Audio frequency 1 kHz / 775 mV ac
HMEC 25 NoiseGard Circuit Card Assembly
Passive Audio Circuit
Test Setup Diagram 3 Figure 106 TEST STEP 2.0 CIRCUIT NoiseGard SIGNAL PROCESSING Passive* Audio signal 2.1 OK Active* Audio signal NOP Compensation Circuit NOP *pass. = NoiseGard off act. = NoiseGard on Check NoiseGard 6 V supply voltage. Check from TP3 and TP6 to TP2 (gnd). Check C7/14, Q5/6, R13/19, U1-2/3-1/4-2. Check Q3/4/7/8, R20. Check C8/9. Check cable (TP7/8 and TP9/10 to Jack Plug) for loose or intermittent connection. RESULTS
2.2 2.3 2.4
OK NOP NOP
NOP OK NOP
OK OK OK
REMARK:
Further measurements are not recommendable. Refer to page 105/paragraph 2.D for amendments given towards handling NoiseGard active noise compensation. For exact component location refer to pages 108/109. Fault Isolation Procedure Figure 105 (Sheet 2 of 3)
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Component side
Solder side
HMEC 25 NoiseGard Circuit Card Assembly, Maintenance Aid Diagram Figure 107
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HMEC 25 NoiseGard Circuit Card Assembly, Schematic Diagram Figure 108
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Ground
+(12 - 35) V
(Solder side)
HMEC 25-KAX Schematic Diagram Figure 109
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Headband cable
green screen brown white red blue/screen orange brown white green yellow
green > screen > red > blue >
compensating capsule KE4 transducer capsule brown
green screen white brown
green > screen > red > blue >
compensating capsule KE4 transducer capsule
HMEC 25 Wiring Diagram Figure 110
white/screen
Microphone side
brown white/screen
Headphone side
MKE 45 Microphone
TP 9 TP 4
Microphone arm
Connecting cable
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Front view
HMEC 25-KAX Connecting Cable Figure 111
Input +12 to 35 V
Ground
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DISASSEMBLY 1. Introduction Disassemble the HMEC 25 Boomset only when repair is necessary and only to the extent necessary to effect repair. Perform the performance tests and the fault isolation test given in the Testing and Troubleshooting section to determine if and what disassembly is required. Procedures are in the order of disassembly from the highest to the lowest subassembly. Disassemble only as far as indicated by the nature of the fault. The order of disassembly of electronic equipment can usually be determined by inspection. Special techniques, cautions, warnings, and unique procedures, when required, are in this section. 2. Precautions and General Techniques Mark, or otherwise identify, all disconnected electrical wiring. Make note of coding, placement of leads, and methods of applying insulation (if any) before unsoldering or removing any electrical parts. WARNING: REMOVE POWER BEFORE DISASSEMBLING ANY PORTION OF THE EQUIPMENT. DISASSEMBLING THE EQUIPMENT WITH THE POWER CONNECTED IS DANGEROUS TO LIFE AND ALSO MAY CAUSE VOLTAGE TRANSIENTS THAT CAN DAMAGE THE EQUIPMENT.
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CAUTION:
CA
REFER TO ESDS HANDLING CAUTION IN ADVISORIES PARAGRAPH IN MANUAL INTRODUCTION. 3. Procedure NOTE: Numbers in parenthesis refer to item numbers on the referenced figures in the Illustrated Parts List. When an IPL item number is followed with a lettered suffix (25A, 25B, 25C, etc) that is used to list different part numbers for a given item required by use-on codes, only the basic IPL item number (25) is referenced in the following procedures.
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A. EAR PAD DISASSEMBLY (Refer to figure 301) (1) Place headphone capsule (1) face down on work surface and hold it in position with one hand. Remove the ear pad (2) with other hand.
HMEC 25 Ear Pad Disassembly Figure 301
B. HEADPHONE CAPSULE DISASSEMBLY (Refer to figure 302) (1) Insert a screw driver between rim of capsule housing (3) and headphone capsule (4). (2) Lever headphone capsule (4) out of capsule housing (3). (3) Unsolder wires and capsule connectors from circuit card assembly (5). (4) Remove circuit card assembly (5) and foam pad (6). 3
HMEC 25 Headphone Capsule Disassembly Figure 302
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C. MICROPHONE ARM HOLDER DISASSEMBLY (Refer to figure 303) (1) Loosen retain-clip (7) and pull microphone arm (8) out of its guide notch. (2) Loosen Phillips screws (9) and remove microphone arm holder as illustrated.
HMEC 25 Microphone Arm Holder Disassembly Figure 303
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CLEANING 1. Introduction This section presents the unique special instructions necessary for cleaning parts and disassembled assemblies of this equipment. For standard cleaning instructions, the technician should follow the instructions outlined in the Standard Shop Practices. 2. Cleaning Materials Cleaning materials required to clean special areas of this equipment are listed in figure 401. Equivalent substitutes may be used. MATERIAL RECOMMENDED TYPE
Isopropyl alcohol Watchmaker tissues
Various Various
Cleaning Materials Figure 401 3. Procedures WARNING: OBSERVE ALL WARNINGS AND CAUTIONS LISTED IN THE ADVISORIES PARAGRAPH OF THIS MANUAL. DO NOT REUSE TISSUES FOR CLEANING; DO NOT REUSE OR CONTAMINATE THE CLEANING SOLUTION BY REDIPPING THE TISSUE INTO THE CLEANING SOLUTION CONTAINER.
CAUTION:
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CHECK 1. Introduction This section presents the unique special instructions necessary to verify the condition of disassembled and cleaned assemblies of this equipment. For standard equipment checks, the technician should follow the instructions outlined in the Standard Shop Practices manual. 2. Procedures WARNING: OBSERVE ALL WARNINGS AND CAUTIONS LISTED IN THE ADVISORIES PARAGRAPH OF THIS MANUAL AND THE STANDARD SHOP PRACTICES.
A. Check all parts for perfect mechanical operation.
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REPAIR 1. Introduction This section presents the unique special instructions necessary for the repair of disassembled assemblies of this equipment. For standard repair procedures, the technician should follow the instructions outlined in the Repair section of the Standard Shop Practices. 2. Repair Supplies No special supplies are required to repair this equipment. 3. Procedures WARNING: OBSERVE ALL WARNINGS AND CAUTIONS LISTED IN THE ADVISORIES PARAGRAPH OF THIS MANUAL AND THE STANDARD SHOP PRACTICES.
No special procedures are required to repair this equipment.
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ASSEMBLY (INCLUDING STORAGE) 1. General This section presents instructions for assembling the HMEC 25 Boomset. Procedures are in order of the lowest major part or subassembly and proceed to a completely assembled unit. All necessary repairs or replacements should be made before beginning assembly procedures. 2. Precaution and General Techniques
IO N
CAUTION:
CA UT

REFER TO ESDS HANDLING CAUTION IN ADVISORIES PARAGRAPH IN MANUAL INTRODUCTION. CAUTION: WHEN REPLACING A SOLID-STATE COMPONENT, USE A HEAT SINK ATTACHED TO THE LEADS TO PREVENT DAMAGE TO THE DEVICE. SOLDER IRON SHOULD BE GROUNDED PROPERLY WITH RESPECT TO BOARD OR CHASSIS WHEN REPLACING LOW-VOLTAGE DEVICES (DIODES, TRANSISTORS, INTEGRATED CIRCUITS, ETC). BEFORE REPLACING MODULES OR SUBASSEMBLIES, DISCONNECT POWER FROM THE HMEC 25. FAILURE TO COMPLY WILL CAUSE DAMAGE TO ELECTRICAL COMPONENTS.
CA N IO UT
CAUTION:
A. Wiring NOTE: Before soldering any part, refer to notes on color coding, placement of leads, and wire insulation made during disassembly. If not available, determine by examining a unit known to be correct.
(1)
All wire connections are to be soldered as specified in MIL-S-6872 using rosin-cor4 solder, Federal Specification QQ-S-5716 composition Sn 60. Replace electrical wiring with wire of the same size and color code as that removed. Lace all electrical harness and tie at all breakouts. Lace ties should be approximately 13 mm (1/2 in) apart. Use Dacron lacing cord, nonwaxed lacing cord, or Tyraps.
(2) (3)
3. Detailed Assembly Procedures NOTE: All item numbers in parenthesis refer to item numbers on the referenced figures in the Illustrated Parts List. When an IPL item number is followed with a lettered suffix (25A, 25B, 25C, etc) that is used to list different part numbers for a given item required by use-on codes, only the basic IPL item number (25) is referenced in the following procedures.
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A. MICROPHONE ARM HOLDER ASSEMBLY (Refer to figure 701) (1) Assemble microphone arm holder as illustrated and secure Phillips screws (9). (2) Push microphone arm (8) onto its guide notch and secure with retain-clip (7).
HMEC 25 Microphone Arm Holder Assembly Figure 701
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B. HEADPHONE CAPSULE ASSEMBLY (Refer to figure 702) (1) Place circuit card assembly (5) and foam pad (6) in capsule housing (3) in sequence as below. (2) Solder wires and capsule connectors on circuit card assembly (5) in the same position when disassembling. (3) Fit headphone capsule (4) in capsule housing (3) matching with the notch guide.
4 HMEC 25 Headphone Capsule Assembly Figure 702 C. EAR PAD ASSEMBLY (Refer to figure 703) (1) Place headphone capsule (1) face down on work surface and hold it in position with one hand. Mount ear pad (2) with other hand. 2
HMEC 25 Ear Pad Assembly Figure 703
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4. Final Testing After all repairs have been made and the HMEC 25 has been reassembled, the unit should be checked according to the procedure in the Testing section. 5. Storage Instructions Ensure all subassemblies are secured to the chassis. Place the equipment in the original container if available. Do not store in polyurethane bags for longer than a few month. Before storing the equipment, include a desiccant. At no time should the ambient temperature of the storage area fall below 20 C ( 4 F) or rise above + 70 C (158 F).
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FITS AND CLEARANCES The fits and clearances that must be observed during assembly of this equipment are indicated, where applicable, in the Assembly section of this manual.
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SPECIAL TOOLS, FIXTURES, AND EQUIPMENT 1. Test Equipment/Resource Requirements Figure 901 provides the minimum use specifications (MUS) for the test equipment resources required to perform test and alignment procedures for the HMEC 25 Boomset. The MUS are the generic technical description, by parameter and characteristic, of the test equipment/resources required independent of a specific manufacturers model, and are provided to aid in utilization of existing or alternate test resources. Unless otherwise specified, only one unit of each test equipment/resource is required. A unit-under-test (UUT) requirement to test resource capability ratio of 1:1 was used to derive all accuracy parameter characteristics. The test performing activity should utilize test equipment/ resource with capability that exceeds the identified accuracy characteristic in accordance with applicable local test and measurement integrity control to those listed as representative, as other equipment may be entirely satisfactory if specified and recalibrated as necessary to maintain that capability.
ITEM (MUS REF NO)
MINIMUM USE SPECIFICATION NO FUNCTION/PARAMETER Vertical characteristics Modes of operation Bandwidth Signal amplitude range (p-p) Input impedance Deflection factor range Deflection factor accuracy 2-channel Dc to 10 MHz 10 mV to 200 V > 10 M 2 mV/div to 5 V/div 3 % of signal display (p-p) Ac / dc 50 V dc, 200 V ac Internal, external, channel A, channel B CHARACTERISTIC
MAINT REPRESENTATIVE LEVEL TYPE CODE Hitachi V-1150 Tektronix R5440 III
Oscilloscope 1.0 1.1 1.2 1.3 1.4 1.5 1.6
1.7 1.8 1.9
Input coupling Maximum input Trigger source
(Cont)
2.0
Horizontal characteristics
Tools, Fixtures, and Equipment Figure 901 (Sheet 1 of 4)
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ITEM (MUS REF NO)
MINIMUM USE SPECIFICATION NO FUNCTION/PARAMETER Sweep modes Sweep ranges Time base (sweep) accuracy Sweep trigger modes CHARACTERISTIC Norm, auto single 1 s to 1 s/div 3% Dc, ac and/or edge, single sweep, norm, auto Not applicable
MAINT REPRESENTATIVE LEVEL TYPE CODE
Oscilloscope 2.1 (Cont) 2.2 2.3 2.4
2.5 3.0 3.1 3.2 AF-meter 1.0 1.1 1.2 1.3 1.4 1.5 1.6
Delay time base General Remote operation Functions Ac voltage function Amplitude range Frequency range Accuracy Input impedance Display Dynamic properties
Optional All Sennheiser UPM 550-1 II, III
30 V to 300 V 10 Hz to 100 kHz 3 % of reading 1 M / 50 pF Ac V (rms) according to DIN 45633 and DIN 45500 0 dB to -10 dB
1.7 2.0 2.1
Input level potentiometer Integrated filter 1000 Hz stop filter
Attenuation at 1000 Hz > 66 dB
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ITEM (MUS REF NO) Audio Generator
MINIMUM USE SPECIFICATION NO 1.0 1.1 FUNCTION/PARAMETER Frequency range Output waveform CHARACTERISTIC 5 Hz to 500 kHz Sine and square wave, selectable
MAINT REPRESENTATIVE LEVEL TYPE CODE Leader LAG-126 III
1.2
Attenuator
10 dB x 7, 1 dB x 9, 0.1 x 9 dB, fine adjuster for sine wave 600 3 %, unbalanced
1.3
Output impedance
2.0 2.1
Sine wave function Maximum output voltage + 10 dB 0.3 dB, with a dBm - dBV changeover switch Less than 0.005 % : 20 Hz to 20 kHz Less than 0.01 % : 10 Hz to 50 kHz Less than 0.1 % : 5 Hz to 500 kHz 0.2 dB : 5 Hz to 20 kHz 0.5 dB : 20 kHz to 500 kHz
2.2
Distortion factor
2.3
Level flatness
3.0 3.1 3.2 3.3
Square wave function Maximum output voltage Rise - time Overshot Approx. 4 V p-p Less than 200 ns Less than 5 % at higher than - 30 dBV
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ITEM (MUS REF NO) Impedance meter
MINIMUM USE SPECIFICATION NO 1.0 FUNCTION/PARAMETER Test frequencies CHARACTERISTIC
MAINT REPRESENTATIVE LEVEL TYPE CODE II
63 Hz, 250 Hz, Sennheiser ZP 3 1 kHz, 4 kHz, 8 kHz, 16 kHz 3 1/2 digits 19.99 to 1.999 M 5% 5 pF to 2000 F 10 H to 5000 H
1.1 1.1
Display Measuring ranges
1.2 1.3 1.4
Accuracy Capacitances Inductances
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ILLUSTRATED PARTS LIST 1. Introduction The purpose of this parts list is for identification, requisition, and issuance of parts. Parts listed meet critical equipment design specification requirements. Use only part numbers specified in this parts list for replacement of parts. A. Detailed Parts List FIG-ITEM ColumnDigits are item numbers assigned in sequence to correspond with item numbers on the illustration. PART NO ColumnListed are standard Sennheiser part numbers. Sennheiser part numbering system consists of 5 digits. AIRLINE PART NO ColumnPart numbers will be included by the airlines as applicable. INDENT ColumnItems are coded 1, 2, 3, etc, to indicate the relationship to the next higher assembly. NOMENCLATURE ColumnListed are the noun name, modifier, descriptive information, and reference to other figures. REV (Revision Identifier) dash () denotes original, letter A first change, letter B second change, etc. Service Bulletins are identified by SB 1, SB 2, etc. Electrostatic Discharge Sensitive devices are identified by (ESDS). Refer to the Advisories at the front of the manual for proper handling of these parts. EFFECT CODE ColumnPart variations within a group of equipment are indicated by a letter code (A, B, C, etc). Absence of a code indicates part applies to all models. UNITS PER ASSY ColumnQuantities specified are per item number.
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80 160 10
90
90 150 20 70 60 120 30 140 130 170 110
40
100
50
HMEC 25-KAX Boomset Assembly Figure 1
23-41-35
DETAILED PARTS LIST

FIG-ITEM 1-001 1-010 1-020 1-030 1-040 1-050 1-060 1-070 1-070A 1-080 1-090 1-100 1-110 1-120 1-130 1-140 1-150 1-160 1-170 PART NUMBER 025-230-415 48234 75550 70743 58877 75818 24821 75527 69417 58715 24812 59997 19849 57122 57124 75427 75464 50722 44740 AIRLINE PART NUMBER
I N D E N T
NOMENCLATURE Boomset HMEC 25-KAX for Airlines Split headband Dyn. headphone capsule with PCB, Replacement Microphone arm holder Electret microphone with amplifier Cable 1.8m / jack 6.3m + 5.25s + XLR-3M Ring RD7.0, 6.0x2.5 (strain relief for 1-050) Annular earpad, pair Annular earpad, pair, velour Cable 500mm Ring RD5.0, 4.2x1.5 (strain relief for 1-080) Flexible microphone arm with plug Strain relief Sleeve RDI1.8x3.0 Sleeve RDI3.5x16.5 Cap, microphone side Cap housing HMEC 25-KAX Type plate Clip
EFFECT CODE
UNITS PER ASSY RF 1 2 1 1 1 1 1 1 1 3 1 1 3 1 1 1 1 1
1 2 2 2 2 2 3 2 2 2 3 2 2 2 2 2 2 2 2
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20 30 10 40 50 70 60 60
HMEC 25 Microphone Arm Holder Assembly Figure 2
23-41-35
DETAILED PARTS LIST

FIG-ITEM 2-001 2-010 2-020 2-030 2-040 2-050 2-060 2-070 PART NUMBER 70743 44619 39796 19846 33320 33321 46590 19848 AIRLINE PART NUMBER
I N D E N T
NOMENCLATURE Microphone arm holder Base for microphone arm Disk spring Ring Pressure spring Stop pin Lens screw M2x8 DIN7985 Cap
EFFECT CODE
UNITS PER ASSY RF 1 1 1 1 1 2 1
1 2 2 2 2 2 2 2
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Hmec 25: Component Maintenance Manual

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COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

component maintenance manual

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

Fits and Clearances Special Tools, Fixtures, and Equipment

Description and Operation

Illustrated Parts List

Testing and Troubleshooting

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

TABLE OF CONTENTS SUBJECT PAGE

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

TABLE OF CONTENTS SUBJECT PAGE

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

ELECTROSTATIC SENSITIVE DEVICES

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

Typical HMEC 25 Boomset

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

SENNHEISER PART NUMBER 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

Equipment Specifications Figure 2

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

HMEC 25-KAX Outline Dimensions Figure 3

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

HMEC 25-KAX Connector Pin Assignments Figure 4

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

SINE - WAVE GENERATOR

Audio frequency signal from Jack plug Pin 7,8 to Pin 6

from Jack plug Pin 7,8 to Pin 6

Test Setup Diagram 1 Figure 101

STEP 1.0 1.1

Aural test of headphone capsules. Check distortion. 200

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

FAULT ISOLATION PROCEDURE STEP (SEE FIGURE 105) 1.0 2.0

NoiseGard dc voltage NoiseGard signal processing

Checks internal dc voltages (NoiseGard) Checks NoiseGard active/passive function

Test Procedure Outline Figure 103

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

DC/DC CONVERTER (XLR 3-pin) +12 to 35 V +12 V

HMEC 25 NoiseGard Circuit Card Assembly

TP5/6 TP1 TP2

Test Setup Diagram 2 Figure 104

TEST STEP 1.0 1.1

+ 6 V dc. 6 V dc. + 5 V dc.

Check C18, R1.

Check Q5/7. Check Q6/8.

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

SINE - WAVE GENERATOR

Audio frequency 1 kHz / 775 mV ac

HMEC 25 NoiseGard Circuit Card Assembly

Passive Audio Circuit

2.2 2.3 2.4

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

HMEC 25 NoiseGard Circuit Card Assembly, Schematic Diagram Figure 108

COMPONENT MAINTENANCE MANUAL with IPL HMEC 25-KAX PART NO 025-230-415

HMEC 25-KAX Schematic Diagram Figure 109