Murata will explain what kind of problem will be caused in MLCC when it is soldered and solder correction by soldering iron. Also Murata will explain how to solve it.
Agenda
1. What kind of problem will be caused when MLCC is soldered by soldering iron? 2. Relationship between preheating temperature of PCB bending strength 3. Mechanism of bending strength deterioration 4. Method of hand soldering. 4.1 Using soldering iron 4.2 Using hot air gun 4.3 Hot air gun operating procedure
1. What kind of problem will be caused when MLCC is soldered by soldering iron? Cracking might be occurred into MLCC due to thermal shock by rapid and local heating from soldering iron. The bending strength might decrease due to low temperature preheating condition of PCB. (because of increasing remained tensile stress) Then, What shall we do?
Not preheating
Hand work by soldering iron after reflow will decrease bending strength.
Only reflow
Optimized preheating temperature condition of PCB is effective to improve decreasing bending strength.
Bend length (mm) 4
(2)MLCC (3)solder
(1) : compressive stress by shrinking PCB (2) : tensile stress by shrinking MLCC (3) : tensile stress by shrinking solder
(ref) Line expansion coefficient (ppm/deg C) FR4 board20, MLCC11, solder22
Hand soldering without preheating of PCB Compressive stress (+) Tensile stress (-)
Remained tensile stress of hand soldering without preheating of the PCB is bigger than reflow soldering.
5
BC Type/3mm
350 deg. C max 150 deg. C min 280 deg. C max 150 deg. C min
350 Temperature (deg. C) 300 250 200 150 100 50 0 0 10 20 30 Time (sec) 40
Nozzle 1hole
distance5mm
Photo image
50
Only using hot air gun is better than using soldering iron without preheating substrate.
0603Size