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XTR300 SBOS336B − JUNE 2005 − REVISED MARCH 2006
XTR300 SBOS336B − JUNE 2005 − REVISED MARCH 2006
XTR300 SBOS336B − JUNE 2005 − REVISED MARCH 2006
XTR300 SBOS336B − JUNE 2005 − REVISED MARCH 2006

XTR300

SBOS336B − JUNE 2005 − REVISED MARCH 2006

Industrial Analog Current/Voltage OUTPUT DRIVER

FEATURES

APPLICATIONS

USER-SELECTABLE: Voltage or Current

Output +40V SUPPLY VOLTAGE

V OUT : ±10V (up to ±17.5V at ±20V supply)

PLC OUTPUT PROGRAMMABLE DRIVER

INDUSTRIAL CROSS-CONNECTORS

INDUSTRIAL HIGH-VOLTAGE I/O

3-WIRE-SENSOR CURRENT OR VOLTAGE

I OUT : ±20mA (linear up to ±24mA)

SHORT- OR OPEN-CIRCUIT FAULT

INDICATOR PIN NO CURRENT SHUNT REQUIRED

OUTPUT DISABLE FOR SINGLE INPUT MODE

THERMAL PROTECTION

OVER-CURRENT PROTECTION

SEPARATE DRIVER AND RECEIVER CHANNELS

DESIGNED FOR TESTABILITY

C C XTR300 V+ V− Current Copy I MON R IMON I COPY 1kΩ I
C C
XTR300
V+
V−
Current Copy
I MON
R IMON
I COPY
1kΩ
I DRV
Input Signal
V IN
DRV
OPA
(Optional)
SET
IA IN+
R OS
R SET
I IA
RG 1
IA
Load
R GAIN
RG 2
GND1
V REF
IA IN−
IA OUT
GND2
OD
EF
R IA
CM
1kΩ
M1
Digital
Error
EF LD
Control
Flags
M2
EF OT
GND3
DGND

OUTPUT ±10V 2- AND 4-WIRE VOLTAGE OUTPUT

Patents Pending

DESCRIPTION

The XTR300 is a complete output driver for industrial and process control applications. The output can be configured as current or voltage by the digital I/V select pin. No external shunt resistor is required. Only external gain-setting resistors and a loop compensation capacitor are required.

The separate driver and receiver channels provide flexibility. The Instrumentation Amplifier (IA) can be used for remote voltage sense or as a high-voltage, high- impedance measurement channel. In voltage output mode, a copy of the output current is provided, allowing calculation of load resistance.

The digital output selection capability, together with the error flags and monitor pins, make remote configuration and troubleshooting possible. Fault conditions on the output and on the IA input as well as over-temperature

conditions are indicated by the error flags. The monitoring

pins provide continuous feedback about load power or impedance. For additional protection, the maximum output current is limited and thermal protection is provided.

Digital communication like HARTcan be modulated onto the input signal. The receive signal applied to the output can be detected at the monitor pins in both current and voltage output modes. In addition to HART communication, the device offers system or sensor configuration through the signal connector.

The XTR300 is specified over the −40°C to +85°C industrial temperature range and for supply voltage up to

40V.

Figure 1. XTR300 Basic Diagram

for supply voltage up to 40V. Figure 1. XTR300 Basic Diagram Please be aware that an

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

HART is a registered trademark of the HART Communication Foundation. All other trademarks are the property of their respective owners.

trademarks are the property of their respective owners. www.ti.com Copyright  2005−2006, Texas Instruments

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Copyright 2005−2006, Texas Instruments Incorporated

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ABSOLUTE MAXIMUM RATINGS (1)

. Signal Input Terminals

Supply Voltage

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+44V

Voltage (2)

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(V−) − 0.5V to (V+) + 0.5V

Current (2)

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±25mA

. Output Short Circuit (3) Operating Temperature Storage Temperature

DGND

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−55°C

−55°C to +125°C

to +125°C

Continuous

±25mA

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Junction Temperature

 

+150°C

ESD Rating Human Body Model Charged Device Model

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2000V

1000V

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited.

(3) See the Driver Output Disable section in Application Information section for thermal protection.

PIN CONFIGURATION

Top View

20 19 18 17 16 M2 1 Exposed 15 Thermal M1 14 2 Die Pad
20
19
18
17
16
M2
1 Exposed
15
Thermal
M1
14
2 Die Pad
3 on
V
13
IN
Underside.
4 (Must be
SET
12
connected
I
5 to V−)
11
MON
6
7
8
9
10
Pad
IA OUT
OD
IA IN−
EF OT
IA IN+
EF LD
RG1
EF CM
RG2
DGND

V+

NC

DRV

NC

V

QFN

RG1 EF CM RG2 DGND V+ NC DRV NC V − QFN This integrated circuit can

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION (1)

PACKAGE

DESIGNATOR

PACKAGE

MARKING

PRODUCT

PACKAGE-LEAD

XTR300

QFN-20

(5mm x 5mm)

RGW

XTR300

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.

PIN ASSIGNMENTS

PIN

NAME

FUNCTION

1

M2

Mode Input

2

M1

Mode Input

3

V

IN

Noninverting Signal Input

4

SET

Input for Gain Setting; Inverting Input

5

I

MON

Current Monitor Output

6

IA OUT

Instrumentation Amplifier Signal Output

7

IA

IN

Instrumentation Amplifier Inverting Input

8

IA

IN+

Instrumentation Amplifier Noninverting Input

9

RG1

Instrumentation Amplifier Gain Resistor

10

RG2

Instrumentation Amplifier Gain Resistor

11

V−

Negative Power Supply

12

NC

No Internal Connection

13

DRV

Operational Amplifier Output

14

NC

No Internal Connection

15

V+

Positive Power Supply

16

DGND

Ground for Digital I/O

17

EF CM

Error Flag for Common-Mode Over-Range, Active Low

18

EF LD

Error Flag for Load Error, Active Low

19

EF OT

Error Flag for Over Temperature, Active Low

20

OD

Output Disable, Disabled Low

Pad

Pad

Exposed thermal pad must be connected to V−

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ELECTRICAL CHARACTERISTICS: VOLTAGE OUTPUT MODE

Boldface limits apply over the temperature range, T A = −40°C to +85°C.

All specifications at T A = +25°C, V S = ±20V, R LOAD = 800, R SET = 2k, R OS = 2k, V REF = 4V, R GAIN = 10k, Input Signal Span 0V to 4V, and C C = 100pF, unless otherwise noted.

     

XTR300

 
 

PARAMETER

CONDITION

MIN

TYP

MAX

UNITS

OFFSET VOLTAGE

           

Offset Voltage, RTI

V OS dV OS /dT

±0.4

±1.9

mV

vs

Temperature

±1.6

±6

µV/°C

vs Power Supply

PSRR

V S = ±5V to ±22V

±0.2

±10

µV/V

INPUT VOLTAGE RANGE Nominal Setup for ±10V Output Input Voltage For Linear Operation

 

See Figure 2

(V−) + 3V

 

(V+) − 3V

V

NOISE Voltage Noise, f = 0.1Hz to 10Hz, RTI Voltage Noise Density, f = 1kHz, RTI

     

3

 

µV PP

e n

40

nV/Hz

OUTPUT Voltage Output Swing from Rail Gain Nonlinearity vs Temperature Gain Error vs Temperature Output Impedance, dV DRV /dI DRV Output Leakage Current While Output Disabled Short-Circuit Current Capacitive Load Drive Rejection of Voltage Difference between GND1 and GND2, RTO

 

I DRV 15mA

(V−) +3V

 

(V+) − 3

V

±0.01

±0.1

%FS

±0.1

±1

ppm/°C

I B

±0.04

±0.1

%FS

±0.2

±1

ppm/°C

7

m

Pin OD = L (1)

30

nA

I SC

±15

±20

±24

mA

C LOAD

C C = 10nF, R C = 15 (2)

1

µF

130

dB

FREQUENCY RESPONSE Bandwidth Slew Rate (2)

−3dB

G = 5

 

300

 

kHz

SR

1

V/µs

 

SR

C C = 10nF, C L = 1µ F, R C = 15V DRV = ±1V 50% Overdrive

0.015

V/µs

Settling Time (2)(3) , 0.1%, Small Signal Overload Recovery Time

8

µs

12

µs

(1) Output leakage includes input bias current of INA. (2) Refer to Driving Capacitive Loads section in Application Information. (3) 8µs plus number of chopping periods. See Application Information section, Internal Current Sources and Settling Time.

C C

XTR300 V+ V− Current Copy I MON I R IMON COPY 1kΩ Input Signal V
XTR300
V+
V−
Current Copy
I MON
I
R IMON
COPY
1kΩ
Input Signal
V IN = 0V to 4.0V
I DRV
GND3
V
IN
DRV
OPA
Transfer Function:
SET
IA IN+
R G
(
V IN
V OUT =
R OS
I
R SET
IA
RG 1
2
R SET
IA
Load
R GAIN
RG 2
V REF = 4.0V
IA IN−
IA
OUT
OD
EF CM
H
M1
Digital
Error
EF LD
L
Control
Flags
M2
EF OT
L
DGND
∆ V GND
GND1
GND2

+ V IN V REF

R OS

)

Figure 2. Standard Circuit for Voltage Output Mode

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ELECTRICAL CHARACTERISTICS: CURRENT OUTPUT MODE

Boldface limits apply over the temperature range, T A = −40°C to +85°C.

All specifications at T A = +25°C, V S = ±20V, R LOAD = 800, R SET = 2k, R OS = 2k, V REF = 4V, Input Signal Span 0 to 4V, and C C = 100pF, unless otherwise noted.

     

XTR300

 

PARAMETER

CONDITION

MIN

TYP

MAX

UNITS

OFFSET VOLTAGE Input Offset Voltage vs Temperature vs Power Supply

V OS

Output Current < 1µA

 

±0.4

±1.8

mV

dV OS /dT PSRR

±1.5

±6

µV/°C

V S = ±5V to ±22V

±0.2

±10

µV/V

INPUT VOLTAGE RANGE Nominal Setup for ±20V Output Maximum Input Voltage For Linear Operation

See Figure 3

(V−) + 3

 

(V+) − 3

V

NOISE Voltage Noise, f = 0.1Hz to 10Hz, RTI Voltage Noise Density, f = 1kHz, RTI

     

3

 

µV PP

i n

33

nV/Hz

OUTPUT Compliance Voltage Swing from Rail Output Conductance, (dI DRV /dV DRV ) Transconductance Gain Error vs Temperature Linearity Error vs Temperature Output Leakage Current While Output Disabled Short-Circuit Current Capacitive Load Drive (1)(2)

 

I DRV = ±24mA dV DRV = ±15V, dI DRV = ±24mA See Transfer Function I DRV = ±24mA I DRV = ±24mA I DRV = ±24mA I DRV = ±24mA Pin OD = L

(V−) +3

 

(V+) − 3

V

0.7

µA/V

±0.04

±0.12

%FS

±3.6

±10

ppm/°C

I B

±0.01

±0.1

%FS

±1.5

±6

ppm/°C

0.6

nA

I SC

 

±24.5

±32

±38.5

mA

C LOAD

1

µF

FREQUENCY RESPONSE Bandwidth Slew Rate (2) Settling Time (2)(3) , 0.1%, Small Signal Overload Recovery Time

−3dB

   

160

 

kHz

SR

1.3

mA/µs

I DRV = ±2mA C LOAD = 0, 50% Overdrive

8

µs

1

µs

(1) Refer to Driving Capacitive Loads section in Application Information. (2) With capacitive load, the slew rate can be limited by the short circuit current and the load error flag can trigger during slewing. (3) 8µs plus number of chopping periods. See Application Information section, Internal Current Sources and Settling Time.

C C XTR300 V+ V− Current Copy I MON I COPY Input Signal V IN
C C
XTR300
V+
V−
Current Copy
I MON
I COPY
Input Signal
V IN = 0V to 4.0V
I DRV
V IN
DRV
OPA
SET
IA IN+
R OS
R SET
I IA
RG
1
IA
RG
2
V REF = 4.0V
IA
IN−
IA OUT
OD
H
EF
I OUT
CM
L M1
Digital
Error
EF LD
Control
Flags
H M2
EF OT
DGND
GND1
GND2

Transfer Function:

I OUT = 10 (

V IN

V IN V REF

)

 

+

R SET

R OS

Figure 3. Standard Circuit for Current Output Mode

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ELECTRICAL CHARACTERISTICS: OPERATIONAL AMPLIFIER (OPA)

Boldface limits apply over the temperature range, T A = −40°C to +85°C.

All specifications at T A = +25°C, V S = ±20V, R LOAD = 800, unless otherwise noted.

     

XTR300

 

PARAMETER

CONDITION

MIN

TYP

MAX

UNITS

OFFSET VOLTAGE Offset Voltage, RTI Drift vs Power Supply

 

V OS

I DRV = 0A

 

±0.4

±1.8

mV

dV OS /dT PSRR

±1.5

µV/°C

V S = ±5V to ±22V

±0.2

±5

µV/V

INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio

 

V CM

 

(V−) + 3

 

(V+) − 3

V

CMRR

(V−) + 3V < V CM < (V+) − 3V

100

126

dB

INPUT BIAS CURRENT Input Bias Current Input Offset Current

 

I B

   

±20

±35

nA

I OS

±0.3

±10

nA

INPUT IMPEDANCE

         

Differential

10 8 || 5 10 8 || 5

|| pF

Common-Mode

|| pF

OPEN-LOOP GAIN Open-Loop Voltage Gain

A OL

(V−) + 3V < V DRV < (V+) − 3V , I DRV = ±24mA

100

126

 

dB

OUTPUT Voltage Output Swing from Rail Short-Circuit Current

 

I DRV = ±24mA M2 = High

(V−) + 3

 

(V+) − 3

V

I

LIMIT

±25.5

±32

±38.5

mA

 

I

LIMIT

M2 = Low Pin OD = L

±16

±20

±24

mA

Output Leakage Current While Output Disabled

I LEAK_DRV

10

pA

FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate

 

GBW

G = 1

 

2

 

MHz

SR

1

V/µs

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ELECTRICAL CHARACTERISTICS: INSTRUMENTATION AMPLIFIER (IA)

Boldface limits apply over the temperature range, T A = −40°C to +85°C.

All specifications at T A = +25°C, V S = ±20V, R IA = 2k, and R GAIN = 2k, unless otherwise noted. See Figure 4.

     

XTR300

 

PARAMETER

   

CONDITION

MIN

TYP

MAX

UNITS

OFFSET VOLTAGE Offset Voltage, RTI vs Temperature vs Power Supply

V OS dV OS /dT

 

I DRV = 0A

 

±0.7

±2.7

mV

 

±2.4

±10

µV/°C

 

PSRR

 

V S = ±5V to ±22V

±0.8

±10

µV/V

INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio

 

V CM

 

(V−) + 3

 

(V+) − 3

V

CMRR

 

RTI

100

130

dB

INPUT BIAS CURRENT Input Bias Current Input Offset Current

 

I B

   

±20

±35

nA

I OS

±1

±10

nA

INPUT IMPEDANCE

         

Differential

10 8 || 5

|| pF

Common-Mode

10 8 || 5

|| pF

TRANSCONDUCTANCE (Gain) Transconductance Error vs Temperature Linearity Error Input Bias Current to G1, G2 Input Offset Current to G1, G2 (1)

 

IA

OUT = 2 (IA IN+ − IA IN− )/R GAIN

       

IA OUT = ±2.4mA, (V−) + 3V < V IAOUT < (V+) − 3V

±0.04

±0.1

%FS

±0.2

ppm/°C

(V−) + 3V < V IAOUT < (V+) − 3V

±0.01

±0.1

%FS

±20

nA

±1

nA

OUTPUT Output Swing to the Rail Output Impedance Short-Circuit Current

   

IA OUT = ±2.4mA IA OUT = ±2.4mA M2 = High

(V−) + 3

 

(V+) − 3

V

600

M

I

LIMIT

±7.2

mA

 

I

LIMIT

M2 = Low

±4.5

mA

FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate

 

GBW

G

= 1, R GAIN = 10k, R IA = 5k

 

1

 

MHz

SR

G

= 1, R GAIN = 10k, R IA = 5k

1

V/µs

Settling Time (2) , 0.1%

IA OUT = ±40µA, R GAIN = 10k, R IA = 5k, C L = 100pF

6

µs

Overload Recovery Time, 50%

R GAIN = 10k, R IA = 15k, C L = 100pF

10

µs

(1) See Typical Characteristics curve. (2) 6µs plus number of chopping periods. See Application Information section, Internal Current Sources and Settling Time.

 

ELECTRICAL CHARACTERISTICS: CURRENT MONITOR

 

Boldface limits apply over the temperature range, T A = −40°C to +85°C.

All specifications at T A = +25°C, V S = ±20V, unless otherwise noted. See Figure 4.

     

XTR300

 

PARAMETER

   

CONDITION

MIN

TYP

MAX

UNITS

OUTPUT Offset Current vs Temperature vs Power Supply Monitor Output Swing to the Rail Monitor Output Impedance

 

I OS

 

I DRV = 0A

 

±30

±100

nA

dI OS /dT PSRR

 

±0.06

nA/°C

 

V S = ±5V to ±22V I MON = ±2.4mA I MON = ±2.4mA

±0.1

±10

nA/V

 

(V−) + 3

(V+) − 3

V

200

M

MONITOR CURRENT GAIN Current Gain Error vs Temperature Linearity Error vs Temperature

   

I MON = I DRV /10

       

I DRV = ±24mA I DRV = ±24mA I DRV = ±24mA I DRV = ±24mA

±0.04

±0.12

%FS

±3.6

ppm/°C

±0.01

±0.1

%FS

±1.5

ppm/°C

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ELECTRICAL CHARACTERISTICS

Boldface limits apply over the temperature range, T A = −40°C to +85°C.

All specifications at T A = +25°C, V S = ±20V, unless otherwise noted. See Figure 4.

     

XTR300

 

PARAMETER

CONDITION

MIN

TYP

MAX

UNITS

POWER SUPPLY Specified Voltage Range Operating Voltage Range Quiescent Current Over Temperature

 

V S

 

±5

 

±20

V

 

±5

±22

V

 

I Q

I DRV = IA OUT = 0A

1.8

2.3

mA

 

2.8

mA

TEMPERATURE RANGE Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Resistance Junction-to-Case Junction-to-Ambient

   

−40

 

+85

°C

−55

+125 (1)

°C

−55

+125

°C

JC

6

°C/W

JA

38

°C/W

THERMAL FLAG (EF OT ) Output Alarm (EF OT pin LOW) Return to Normal Operation (EF OT pin HIGH)

   

140

 

°C

125

°C

DIGITAL INPUTS (M1, M2, OD) V IL Low-Level Input Voltage V IH High-Level Input Voltage Input Current

     

0.8

 

V

1.4

V

±1

µA

DIGITAL OUTPUTS (EF LD , EF CM , EF OT ) I OH High-Level Leakage Current (Open-Drain) V OL Low-Level Output Voltage V OL Low-Level Output Voltage

   

−1.2

 

µA

I OL = 5mA I OL = 2.8mA

0.8

V

0.4

V

DIGITAL GROUND PIN Current Input

 

(V−) DGND (V+) − 7V

       

M1 = M2 = L, OD = H, All Digital Outputs H

−25

µA

(1) EF OT not connected with OD.

−25 µ A ( 1 ) EF O T not connected with OD. Feedback Network XTR300
Feedback Network XTR300 V+ V− Current Copy I MON I COPY I DRV GND3 V
Feedback
Network
XTR300
V+
V−
Current Copy
I MON
I COPY
I DRV
GND3
V IN
DRV
Input Signal
OPA
SET
IA IN+
R SET
I IA
RG 1
IA
R GAIN
RG 2
GND1
IA IN−
IA OUT
OD
EF CM
R IA
H M1
Digital
Error
EF LD
Control
Flags
M2
EF OT
DGND
GND3
Figure 4. Standard Circuit for Current Output Mode

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TYPICAL CHARACTERISTICS

At T A = +25°C and V+ = ±20V, unless otherwise noted.

QUIESCENT CURRENT vs TEMPERATURE

3.0 2.5 2.0 1.5 1.0 0.5 0 I Q (mA)
3.0
2.5
2.0
1.5
1.0
0.5
0
I Q (mA)

50

25

0

25

50

75

Temperature ( C)

100

125

INPUT BIAS CURRENT vs TEMPERATURE (V IN , SET, IA IN+ , IA IN , RG1, RG2)

0 −5 −10 −15 −20 −25 −30 I B (nA)
0
−5
−10
−15
−20
−25
−30
I B (nA)

50

25

0

25

50

75

Temperature ( C)

100

125

QUIESCENT CURRENT vs SUPPLY VOLTAGE

1.90 1.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 I Q (mA)
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
I Q (mA)

10

15

20

25

30

35

Total Supply Voltage (V)

40

45

OPA OUTPUT SWING TO RAIL vs TEMPERATURE

2.2 I DRV = +24mA −24mA I DRV = 2.0 I DRV = +20mA 1.8
2.2
I DRV = +24mA
−24mA
I DRV =
2.0
I DRV = +20mA
1.8
1.6
I
= +10mA
DRV
1.4
I DRV = −10mA
20mA
I DRV = −
1.2
1.0
 V S − V OUT 
(V)

50

25

0 25

50

75

Temperature ( C)

100

125

OPA GAIN AND PHASE vs FREQUENCY

180 0 160 −20 140 −40 120 −60 Phase 100 −80 80 −100 60 −120
180
0
160
−20
140
−40
120
−60
Phase
100
−80
80
−100
60
−120
40
−140
Gain
20
−160
0
−180
−20
−200
0.001 0.01
0.1
1
10
100
1k
10k
100k
1M
10M
Gain (dB)
Phase ( )
Gain (dB)

Frequency (Hz)

80

60

40

20

0

20

40

IA GAIN AND PHASE vs FREQUENCY

0 10kΩ R GAIN = −45 R IA = 500kΩ −90 R IA = 50kΩ
0
10kΩ
R GAIN =
−45
R IA = 500kΩ
−90
R IA = 50kΩ
−135
R IA = 10kΩ
−180
R IA = 5kΩ
−225
Gain
R
= 1kΩ
IA
Phase
−270
1 10
100
1k
10k
100k
1M
10M
Phase ( )

Frequency (Hz)

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TYPICAL CHARACTERISTICS (continued)

At T A = +25°C and V+ = ±20V, unless otherwise noted.

OPA CMRR AND PSRR vs FREQUENCY

IA CMRR AND PSRR vs FREQUENCY

160 140 140 120 120 100 PSRR+ 100 PSRR− 80 80 PSRR− 60 60 PSRR+
160
140
140
120
120
100
PSRR+
100
PSRR−
80
80
PSRR−
60
60
PSRR+
CMRR
40
40
CMRR
20
20
0
0
1
10
100
1k
10k
100k
1
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
SMALL−SIGNAL STEP RESPONSE
CURRENT MODE
LARGE−SIGNAL STEP RESPONSE
CURRENT MODE
I
=
±200µ
A
±20mA
OUT
I OUT =
G=8
G=8
100nF || R L
= 800Ω
C L =
C C =
100nF || R L
= 800Ω
4.7nF
C L =
C C =
4.7nF
R SET = 1kΩ
=
1kΩ
R SET
R G = 10kΩ
10kΩ
R G =
See
Figure 3
See Figure
3
200µs/div
200µs/div
CMRR, PSRR (dB)
100mV/div
CMRR, PSRR (dB)
10V/div

SMALL−SIGNAL STEP RESPONSE VOLTAGE MODE

G=5 100nF || R L = 800Ω C L = C C = 4.7nF R
G=5
100nF || R L = 800Ω
C L =
C C = 4.7nF
R SET = 1kΩ
R G = 10kΩ
See
Figure 2
50mV/div

200µs/div

LARGE−SIGNAL STEP RESPONSE VOLTAGE MODE

G=5 C L = 100nF || R L = 800Ω C C = 4.7nF R
G=5
C L = 100nF || R
L = 800Ω
C C = 4.7nF
R SET = 1kΩ
=
10kΩ
R G
See Figure 2
5V/div

200µs/div

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TYPICAL CHARACTERISTICS (continued)

At T A = +25°C and V+ = ±20V, unless otherwise noted. INPUT−REFERRED NOISE SPECTRUM
At T A = +25°C and V+ = ±20V, unless otherwise noted.
INPUT−REFERRED NOISE SPECTRUM
VOLTAGE OUTPUT MODE
1M
G=5
100k
10k
1k
100
10
1
1 10
100
1k
10k
100k
(nV/ √Noise Hz)
Frequency (Hz) INPUT−REFERRED NOISE SPECTRUM CURRENT OUTPUT MODE 1M G = 10 100k 10k 1k
Frequency (Hz)
INPUT−REFERRED NOISE SPECTRUM
CURRENT OUTPUT MODE
1M
G = 10
100k
10k
1k
100
10
1
1
10 100
1k
10k
Frequency (Hz)
Noise (nV/ √Input−Referred Hz)

100k

IA INPUT−REFERRED NOISE SPECTRUM 1M G = 20 100k 10k 1k 100 10 1 1
IA INPUT−REFERRED NOISE SPECTRUM
1M
G = 20
100k
10k
1k
100
10
1
1
10 100
1k
10k
Frequency (Hz)
Noise (nV/ √Input−Referred Hz)

100k

INPUT−REFERRED 0.1Hz to 10Hz NOISE VOLTAGE OUTPUT MODE

µ1 V/div
µ1 V/div

1s/div

INPUT−REFERRED 0.1Hz to 10Hz NOISE CURRENT OUTPUT MODE

µ1 V/div
µ1 V/div

1s/div

IA INPUT−REFERRED 0.1Hz to 10Hz NOISE

µ1 V/div
µ1 V/div

1s/div

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0.4

2.0

1.6

0.8

1.2

2.4

0.6

2.0 3.0

1.8

1.2

0
0.4

1.2
1.6

0.8

1.8
2.4

0
0.6

3.0

1.2

TYPICAL CHARACTERISTICS (continued)

At T A = +25°C and V+ = ±20V, unless otherwise noted.

OPA OFFSET VOLTAGE DISTRIBUTION

18 16 14 12 10 8 6 4 2 0 Percent of Population (%)
18
16
14
12
10
8
6
4
2
0
Percent of Population (%)

Offset Voltage (mV)

OPA OFFSET VOLTAGE DRIFT DISTRIBUTION

IA OFFSET VOLTAGE DISTRIBUTION

30 25 20 15 10 5 0 Percent of Population (%)
30
25
20
15
10
5
0
Percent of Population (%)

Offset Voltage (mV)

IA OFFSET VOLTAGE DRIFT DISTRIBUTION

60 40 35 50 30 40 25 30 20 15 20 10 10 5 0
60
40
35
50
30
40
25
30
20
15
20
10
10
5
0
0
Percent of Population (%)
−10
−8
−6
−4
−2
0
2
4
6
8
10
−10
Percent of Population (%)
−8
−6
−4
−2
0
2
4
6
8
10

Offset Voltage Drift (µV/ C)

VOLTAGE MODE GAIN ERROR DISTRIBUTION

Offset Voltage Drift (µV/ C)

CURRENT MODE GAIN ERROR DISTRIBUTION

40 30 35 25 30 20 25 20 15 15 10 10 5 5 0
40
30
35
25
30
20
25
20
15
15
10
10
5
5
0
0
Gain Error (ppm)
Gain Error (ppm)
Percent of Population (%)
−1000
−800
−600
−400
−200
0
200
400
600
800
1000
−1000
Percent of Population (%)
−800
−600
−400
−200
0
200
400
600
800
1000

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1000

800

600

200

400

600
800

200
400

1000 1000

0

400

200

600

800

600

800
1000

200
400

0

TYPICAL CHARACTERISTICS (continued)

At T A = +25°C and V+ = ±20V, unless otherwise noted.

VOLTAGE MODE NONLINEARITY DISTRIBUTION

60 50 40 30 20 10 0 Percent of Population (%)
60
50
40
30
20
10
0
Percent of Population (%)

Nonlinearity (ppm)

VOLTAGE MODE GAIN ERROR DRIFT DISTRIBUTION

CURRENT MODE NONLINEARITY DISTRIBUTION

60 50 40 30 20 10 0 Percent of Population (%)
60
50
40
30
20
10
0
Percent of Population (%)

Nonlinearity (ppm)

CURRENT MODE GAIN ERROR DRIFT DISTRIBUTION

70 60 60 50 50 40 40 30 30 20 20 10 10 0 0
70
60
60
50
50
40
40
30
30
20
20
10
10
0
0
Percent of Population (%)
−1.0
−0.8
−0.6
−0.4
−0.2
0
0.2
0.4
0.6
0.8
1.0
−10
Percent of Population (%)
−8
−6
−4
−2
0
2
4
6
8
10

Gain Error Drift (ppm/ C)

VOLTAGE MODE NONLINEARITY DRIFT DISTRIBUTION

Gain Error Drift (ppm/ C)

CURRENT MODE NONLINEARITY DRIFT DISTRIBUTION

80 100 90 70 80 60 70 50 60 40 50 40 30 30 20
80
100
90
70
80
60
70
50
60
40
50
40
30
30
20
20
10
10
0
0
Percent of Population (%)
−1.0
−0.8
−0.6
−0.4
−0.2
0
0.2
0.4
0.6
0.8
1.0
−10
Percent of Population (%)
−8
−6
−4
−2
0
2
4
6
8
10

Nonlinearity Drift (ppm/ C)

Nonlinearity Drift (ppm/ C)

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I LIMIT (mA)

TYPICAL CHARACTERISTICS (continued)

At T A = +25°C and V+ = ±20V, unless otherwise noted. POSITIVE CURRENT LIMIT
At T A = +25°C and V+ = ±20V, unless otherwise noted.
POSITIVE CURRENT LIMIT vs TEMPERATURE
36
34
32
Current Mode
30
28
26
24
Voltage Mode
22
20
18
16
I LIMIT (mA)

50

25

0

25

50

75

Temperature ( C)

100

125

NONLINEARITY vs OUTPUT CURRENT (±24mA End Point Calibration)

0.025 +25 C −55 C 0 −0.025 +85 C −0.050 −0.075 +125 C −0.10 Nonlinearity
0.025
+25 C
−55 C
0
−0.025
+85 C
−0.050
−0.075
+125 C
−0.10
Nonlinearity (%)
Nonlinearity (%)

24 20

16 12 8

0

Output Current (mA)

4

4

8

12

16

20

24

16

18

20

22

24

26

28

30

32

34

36

0.025

0

0.025

0.050

0.075

0.10

NEGATIVE CURRENT LIMIT vs TEMPERATURE Voltage Mode Current Mode
NEGATIVE CURRENT LIMIT vs TEMPERATURE
Voltage Mode
Current Mode

50

25

0

25

50

75

Temperature ( C)

100

125

NONLINEARITY vs OUTPUT CURRENT (±20mA End Point Calibration) −55 C +25 C +125 C +85
NONLINEARITY vs OUTPUT CURRENT
(±20mA End Point Calibration)
−55
C
+25 C
+125 C
+85 C

24 20

16 12

8

0

Output Current (mA)

4

4

8

12

16

20

24

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APPLICATION INFORMATION V+ V− GND C 2 100nF C 3 100nF C C 47nF GND1
APPLICATION INFORMATION
V+
V−
GND
C 2
100nF
C 3
100nF
C C
47nF
GND1
(2)
Thermal
XTR300
V+
V−
Pad
Current Copy
I MON
I−MON
I COPY
R 3
1kΩ
I DRV
V IN
External Load
R C
S−IN
15Ω
DRV
R OS
OPA
2kΩ
C
4
SET
OS
100nF
R 6
2.2kΩ
GND1
IA IN+
R IMON
1kΩ
R SET
I IA
C LOAD
R LOAD
RG
1
SG
R GAIN
IA
C 5
10kΩ
R 7
10nF
RG
GND1
2
2.2kΩ
IA−O
IA
IN−
IA OUT
GND2
EF
OD
CM
R IA
1kΩ
M1
Digital
Error
EF LD
Control
Flags
Logic Supply
(+2.7V to +5V)
M2
EF OT
DGND
GND3
(1)
Pull−up Resistors
(10kΩ)
GND4

NOTE: (1) See the Electrical Characteristics and Digital Input and Output section for operating limits of DGND. (2) Connect thermal pad to V.

The following information should be considered during XTR300 circuit configuration:

Recommended bypassing: 100nF or more for

supply bypassing at each supply. R IMON can be in the k-range or short-circuited if not

used. Do not leave this current output unconnected—it would saturate the internal current source. The current at this I MON output is I DRV /10. Therefore, V IMON = R IMON (I DRV /10). R 3 is not required but can match R SET (or R SET ||R OS )

to compensate for the bias current. R IA can be short-circuited if not used. Do not leave

this current output unconnected. R GAIN is selected to 10kto match the output of 10V with 20mA for the equal input signal. R C ensures stability for unknown load conditions and limits the current into the internal protection diodes. C 4 helps protect the device. Over-voltage clamp diodes (standard 1N4002) might be necessary to protect the output.

R 6 , R 7 , and C 5 protect the IA. R LOAD and C LOAD represent the load resistance and load capacitance. R SET defines the transfer gain. It can be split to allow a signal offset and, therefore, allow a 5V single- supply digital-to-analog converter (DAC) to control a ±10V or ±20mA output signal.

The XTR300 can be used with asymmetric supply voltages; however, the minimum negative supply voltage should be equal to or more negative than −3V (typically −5V). This sup- ply value ensures proper control of 0V and 0mA with wire re- sistance, ground offsets, and noise added to the output. For positive output signals, the current requirement from this negative voltage source is less than 5mA.

GND1 through GND4 must be selected to fulfill speci− fied operating ranges. DGND must be in the range of (V−) DGND (V+) −7V.

Figure 5. Standard Circuit Configuration

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Built on a robust high-voltage BI-CMOS process, the XTR300 is designed to interface the 5V or 3V supply do- main used for processors, signal converters, and amplifi- ers to the high-voltage and high-current industrial signal environment. It is specified for up to ±20V supply, but can also be powered asymmetrically (for example, +24V and −5V). It is designed to allow insertion of external circuit protection elements and drive large capacitive loads.

FUNCTIONAL FEATURES

The XTR300 provides two basic functional blocks: an in- strumentation amplifier (IA) and a driver that is a unique operational amplifier (OPA) for current or voltage output. This combination represents an analog output stage which can be digitally configured to provide either current or volt- age output to the same terminal pin. Alternatively, it can be configured for independent measurment channels.

Three open collector error signals are provided to indicate output related errors such as over-current or open-load (EF LD ) or exceeding the common-mode input range at the IA inputs (EF CM ). An over-temperature flag (EF OT ) can be used to control output disable to protect the circuit. The monitor outputs (I MON and IA OUT ) and the error flags offer optimal testability during operation and configuration. The I MON output represents the current flowing into the load in voltage output mode, while the IA OUT represents the volt- age across the connectors in current output mode. Both monitor outputs can be connected together when used in current or voltage output mode because the monitor sig- nals are multiplexed accordingly.

VOLTAGE OUTPUT MODE

In voltage output mode (M1 and M2 are connected low or

left unconnected), the feedback loop through the IA pro- vides high impedance remote sensing of the voltage at the destination, compensating the resistance of a protection circuit, switches, wiring, and connector resistance. The output of the IA is a current that is proportional to the input voltage. This current is internally routed to the OPA sum- ming junction through a multiplexer, as shown in Figure 6.

A 1:10 copy of the output current of the OPA can be moni-

tored at the I MON pin. This output current and the known output voltage can be used to calculate the load resistance or load power.

During an output short-circuit or an over-current condition the XTR300 output current is limited and EF LD (load error, active low) flag is activated.

C C XTR300 V+ V− Current Copy I MON I COPY R IMON I DRV
C C
XTR300
V+
V−
Current Copy
I MON
I COPY
R IMON
I DRV
Input Signal
GND3
V IN
DRV
OPA
SET
IA IN+
R SET
I IA
RG 1
IA
Load
R GAIN
RG 2
GND1
IA IN−
IA OUT
OD
EF
CM
GND2
M1
Digital
Error
EF LD
L
Control
Flags
L
M2
EF OT
DGND

Figure 6. Simplified Voltage Output Mode Configuration

Applications not requiring the remote sense feature can use the OPA in stand-alone operation (M1 = high). In this case, the IA is available as a separate input channel.

The IA gain can be set by two resistors, R GAIN and R SET :

V OUT R GAIN

2R SET

V IN

(1)

or when adding an offset, V REF , to get bidirectional output with a single-ended input:

V

OUT R GAIN

2

V IN

R SET

V IN V REF

R OS

(2)

The R SET resistor is also used in current output mode. Therefore, it is useful to define R SET for the current mode, then set the ratio between current and voltage span with

R GAIN .

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CURRENT OUTPUT MODE

The XTR300 does not require a shunt resistor for current control because it uses a precise current mirror arrange- ment.

In current output mode (M1 connected low, or left uncon- nected and M2 connected high) a precise copy of 1/10th of the output is internally routed back to the summing junc- tion of the OPA through a multiplexer, closing the control loop for the output current.

The OPA driver can deliver more than ±24mA within a wide output voltage range. An open-output condition or high-im- pedance load that prevents the flow of the required current activates the EF LD flag.

While in current output mode, a current (I IA ) that is propor- tional to the voltage at the IA input is routed to IA OUT and can be used to monitor the load voltage. A resistor con- verts this current into voltage. This arrangement makes level shifting easy.

Alternatively, the IA can be used as an independent moni- toring channel. If this output is not used, connect it to GND to maintain proper function of the monitor stage, as shown in Figure 7.

XTR300 V+ V− Current Copy I MON I COPY I DRV Input Signal V IN
XTR300
V+
V−
Current Copy
I
MON
I
COPY
I
DRV
Input Signal
V
IN
DRV
OPA
SET
IA IN+
R
SET
I
IA
RG 1
IA
Load
R GAIN
RG 2
GND1
IA
IN−
IA
OUT
GND2
OD
EF
CM
R
IA
M1
Digital
Error
EF LD
L
Control
Flags
M2
EF OT
H
DGND
GND3

Figure 7. Simplified Current Output Mode Configuration

The transconductance (gain) can be set by the resistor, R SET , according to the equation:

I OUT

10

R SET

V IN

(3)

or when adding an offset V REF to get bidirectional output with a single-ended input:

I OUT 10

V IN