EMPro (Electro-Magnetic Professional) Workshop

HEESOO LEE Agilent EEsof 3DEM Application Lead

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Objectives
o During the course of the EMPro workshop, students will learn how to use EMPro to complete Electro-Magnetic (EM) simulation flow and process from solid modeling, simulation setup, simulations, data display, and postprocessing

o Students will also learn the most prevalent EM simulation technologies, FEM (Finite Element Method) and FDTD (Finite Difference Time Domain) technologies
o Students will learn 3D Component Technology that bridges EMPro and ADS and expands the simulation space into mechanical designs o Various application examples will be covered, however the application examples used will be based on the audiences interests and their field

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Agenda
Module 1: Introduction to 3D EM Technologies Module 2: EMPro Basics Module 3: EMPro Electro-Magnetic Simulations

Module 4: Data Display and Post-processing in EMPro

Module 5: 3D component technology: Bridging 3DEM and circuit simulator Module 6: Additional Topics

Module 7: Additional Lab Exercises

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Module 1: Introduction to 3D EM Technologies

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3D EM Simulation Technologies
FDTD ( Finite Difference Time Domain ) FEM ( Finite Element Method ) MoM ( Method of Moment )
3D arbitrary structures Full Wave EM simulations Handles much larger and complex problems Time Domain EM Simulate full size cell phone antennas EM simulations per each port GPU based hardware acceleration

FDTD
3D Arbitrary Structures Full Wave EM Simulation Direct, Iterative Solvers Frequency Domain EM Multiport simulation at no additional cost High Q

FEM

MoM
3D Planar structures Full Wave and Quasi-Static Dense & Compressed Solvers Frequency Domain Multiport simulation at no additional cost High Q

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Agilent EEsofs Integrated 3D EM Flow

3D Modeling
EMPro Platform
Parameterized 3D Components

Circuit Design
ADS Platform

Layout CAD Data

FDTD Simulator

FEM Simulator

Momentum Simulator

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3D EM in a Big Picture, Co-Design!

o The old way, the sequential design process or Throw-The-Die-Over-TheWall, breaks down due to much smaller design form factors of packages, chips, and substrates in modern high frequency and high speed designs o Much closer proximity, embedded passives increased parasitics, couplings o Multichip modules, and stacked die become more common - forcing IC, package, and board designers to work together more closely o Chip/package/module/board co-design from the beginning of design process is inevitable! Chips Packages
RF SiP SiP SMD PoP Board

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A Reference Example For Co-Design with 3D EM RFIC Differential Power Amplifier Test Board
Bondwires
Single Ended PA Output

PCB

LTCC Balun

Si PA

LTCC Balun

Single Ended PA Input

Package
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3D Component Technology for 3D EM Simulations

o Bridges circuit designers to 3D EM simulation space o Augments ADS 2D layout drawing into 3D EM space for packages o Two types of 3D components
ADS default 3D components
Custom Parameterized 3D components
ADS Default 3D Components

Custom Parameterized 3D Components

EMPro Platform ADS Platform
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You Can Build Custom 3D Component Library for ADS Circuit/EM Co-Simulations
o Build a set of custom 3D component library for ADS
Very useful library when a package is often combined with a layout Makes dynamic EM simulations for package plus layout a lot easier Multiple packages can be added to the package 3D EM component design kit

ADS 3D EM Package Component Custom Library

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EMPro (Electro-Magnetic Professional)

o Modern 3D EM Design Environment o Flexible choice of full wave 3D EM simulation technologies, FDTD and FEM o Wide range of industry standard CAD format support such as SAT, Pro-E, and odb++ format o Parameterized Solid Modeling o Supports Windows & Linux o Innovative 3D Component Technology that bridges 3D EM design environment to your favorite circuit design environment, ADS

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