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DGG OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
OEA
LE1B
2B3
GND
2B2
2B1
V
CC
A1
A2
A3
GND
A4
A5
A6
A7
A8
A9
GND
A10
A11
A12
V
CC
1B1
1B2
GND
1B3
LE2B
SEL
OE2B
LEA2B
2B4
GND
2B5
2B6
V
CC
2B7
2B8
2B9
GND
2B10
2B11
2B12
1B12
1B11
1B10
GND
1B9
1B8
1B7
V
CC
1B6
1B5
GND
1B4
LEA1B
OE1B


























































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C1
1D
C1
1D
C1
1D
C1
1D
To 11 Other Channels
LE1B
LE2B
LEA1B
LEA2B
OE2B
OE1B
OEA
SEL
A1 1B1
2B1
27
2
30
55
56
29
1
28
8 23
6
G1
1
1




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V
CC
/2
V
CC
/2
V
CC
/2 V
CC
/2
V
CC
/2 V
CC
/2
V
CC
/2 V
CC
/2
V
OH
V
OL
t
h
t
su
From Output
Under Test
C
L
= 30 pF
(see Note A)
LOAD CIRCUIT
S1
Open
GND
1 k
1 k
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 V
CC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
t
PZL
t
PZH
t
PLZ
t
PHZ
0 V
V
OL
+ 0.15 V
V
OH
0.15 V
0 V
V
CC
0 V
0 V
t
w
V
CC
V
CC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
t
pd
t
PLZ
/t
PZL
t
PHZ
/t
PZH
Open
2 V
CC
GND
TEST S1
NOTES: A. C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z
O
= 50 , t
r
2 ns, t
f
2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as t
en
.
G. t
PLH
and t
PHL
are the same as t
pd
.
0 V
V
CC
V
CC
/2
t
PHL
V
CC
/2 V
CC
/2
V
CC
0 V
V
OH
V
OL
Input
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
V
CC
/2 V
CC
/2
t
PLH
2 V
CC
V
CC



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t
PHL
t
PLH
V
CC
/2
V
CC
/2
V
CC
/2 V
CC
/2
V
CC
/2 V
CC
/2
V
CC
/2 V
CC
/2
V
OH
V
OL
t
h
t
su
From Output
Under Test
C
L
= 30 pF
(see Note A)
LOAD CIRCUIT
S1
Open
GND
500
500
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 V
CC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
t
PZL
t
PZH
t
PLZ
t
PHZ
0 V
V
OL
+ 0.15 V
V
OH
0.15 V
0 V
V
CC
0 V
0 V
t
w
V
CC
V
CC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
t
pd
t
PLZ
/t
PZL
t
PHZ
/t
PZH
Open
2 V
CC
GND
TEST S1
NOTES: A. C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z
O
= 50 , t
r
2 ns, t
f
2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as t
en
.
G. t
PLH
and t
PHL
are the same as t
pd
.
0 V
V
CC
V
CC
/2
V
CC
/2 V
CC
/2
V
CC
0 V
V
OH
V
OL
Input
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
V
CC
/2 V
CC
/2
2 V
CC
V
CC



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t
PHL
t
PLH
V
OH
V
OL
From Output
Under Test
C
L
= 50 pF
(see Note A)
LOAD CIRCUIT
S1
6 V
Open
GND
500
500
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
t
PZL
t
PZH
t
PLZ
t
PHZ
1.5 V 1.5 V
1.5 V 1.5 V
2.7 V
0 V
1.5 V 1.5 V
V
OH
V
OL
0 V
1.5 V
V
OL
+ 0.3 V
1.5 V
V
OH
0.3 V
0 V
1.5 V
2.7 V
0 V
0 V
2.7 V
0 V
Input
2.7 V
2.7 V
3 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Output
Input
t
pd
t
PLZ
/t
PZL
t
PHZ
/t
PZH
Open
6 V
GND
TEST S1
1.5 V 1.5 V
t
w
t
h
t
su
1.5 V 1.5 V
NOTES: A. C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z
O
= 50 , t
r
2.5 ns, t
f
2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as t
en
.
G. t
PLH
and t
PHL
are the same as t
pd
.







PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
74ALVCH162260DLG4 ACTIVE SSOP DL 56 20 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ALVCH162260DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ALVCH162260GRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ALVCH162260GRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ALVCH162260DGGR OBSOLETE TSSOP DGG 56 TBD Call TI Call TI
SN74ALVCH162260DL ACTIVE SSOP DL 56 20 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ALVCH162260DLR ACTIVE SSOP DL 56 1000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ALVCH162260GR ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Jul-2006
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
SN74ALVCH162260DLR SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
SN74ALVCH162260GR TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ALVCH162260DLR SSOP DL 56 1000 346.0 346.0 49.0
SN74ALVCH162260GR TSSOP DGG 56 2000 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA


MTSS003D JANUARY 1995 REVISED JANUARY 1998
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/ F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M 0,08
0,10
0,50
08
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA


MSSO001C JANUARY 1995 REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/ E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
48 28
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M 0.005 (0,13)
0.025 (0,635)
08
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118

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