UNGKU OMAR POLYTECHNIC

CHAPTER 2

SUMMERIZE OF INDUSTRIAL TRAINING ACTIVITIES

29 November 2010 -3 December 2010 (1st week of training) Register. Reporting to the Human Resource staff, Miss Fauzana. Briefing by Miss Fauzana about the work time, break time and attendance. They introduce company worker and organization member to me. Ive been posted to the IE Department. New intake orientation program. Briefing about the company rules and regulation,

compensation and benefits, security, clinic, quality induction, zero defects today, data logging, mixed device and electro static charge (ESD). Briefing about the process flow, ISO14111, environment, safety and health, restriction of hazardous substances (Rolts), and SPC and OCAP.

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Briefing about the E-Spec system, I2 Mec, QPP, 5S Manufacturing. Learn basically about the operation at FOL (Front Of Line).

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6 December 2010 - 10 December 2010 (2nd week of training) Observed layout, project and information that related to the Carsem. Learn how to use E-Spec. Briefing about the usage of autocad. Briefing about the protection method that used at FOL and EOL. Know the types of machine at MLP FOL. Learn basically about the operation at EOL (End of Line).

13 December 2010 17 December 2010 (3rd week of training) Collect machine information that have in warehouse. Update the FG Stote layout. Evacuate machine. Introduction of the defects. Learn the defects that happen at die attach process. 20 December 2010 24 December 2010 (4th week of training) Learn basically about the epoxy cure process. Update the Die Store layout. Learn basically about the saw singulaion process. Learn defect criteria for assembly package for wire bond process. Learn comparison between defect for wire bond process.

27 December 2010 31 December 2010 (5th week of training) Introduction of the red tag and white tag. Send Die Store layout that have modify to Die Store. Update the General Store layout. Evacuate rack from warehouse to ICB FOL. Enter quatity IC used by line MLP on September, October and November into computer.

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Update data in the computer to know about machine used by guest to produce production. Update data in the computer to know about body size, unit per frame, UPH, frame per sublot and utilisation % (current). Help IE staff from M-Site to write down machne information.

3 January 2011 7 January 2011 (6th week of training) Perform checking machine at warehouse. Check warehouse machine from computer data. Do some house keeping at the warehouse. To arrange and clean the warehouse HR room. Learn basically about the laser marking process.

10 January 2011 14 January 2011 (7th week of training) Find bond head spare part from wire bond machine. Learn basically about the wire bond process at PLCC/PDIP. Introduction of the gate pass. Perform checking M-Site machine. Perform checking at Final Test.

17 January 2011 21 January 2011 (8th week of training) Learn basically about the underfill machine process. Capture picture of M-Site machine. Perform checking at Finance Department. Thaipusam. Evacuate machine from MLP to M-Site.

24 January 2011 28 January 2011 (9th week of training)

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Evacuate two wire bond twineagle xtreme machine from AP FOL to MLP FOL. Evacuate magazine and stopper from MLP Production Storage Room to warehouse. Update the MLP EOL layout. Perform checking at MLP FOL. Update the MLP FOL layout.

31 January 2011 4 February 2011 (10th week of training) Capture picture of object that surrounded by yellow tape. Measure the 2nd Optical machine. Chinese New Year.

7 February 2011 11 February 2011 (11th week of training) Learn how to clean the flux. Learn basically about the 2nd Optical process . To wrap and bunble up object using marking tape. Evacuate rack. Perform checking at AP FOL.

14 February 2011 18 February 2011 (12th week of training) Perform checking at MLP FOL. Perform checking for M-Site and S-Site machine. Capture picture of object that surrounded by red tape and blue tape. Evacuate table. Write down machine ID at AP EOL. Upgrade the MLP FOL layout. Measure the Epoxy Cure machine at AP FOL.

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21 February 2011 25 February 2011 (13th week of training) Measure the Scribe & Break machine. Evacuate two scrap bin to warehouse. Evacuate fourteen wire bond to warehouse. Learn to install telephone onto wall. Help HR staff to tidy the room.

28 February 2011 4 March 2011 (14th week of training) Remove five wire bond machine and one die attach machine to MSite. Learn to install fire extinguisher onto wall. Perform checking for S-Site machine. Measure Die Pad with lead line. Learn basically about the wafer mounting process.

7 March 2011 11 March 2011 (15th week of training) Fixing of board onto the wall. Send hanging signage to facility room. Co-operate with other staff to manage the warehouse. Perform checking at HR Department. Perform checking at FA Lab.

14 March 2011 - 18 March 2011 (16th week of training) Evacuate Twin-Head Multi Chip Die Bonder (DataCon) machine to AP FOL. Help Final Test staff (BU2) to evacuate things to warehouse. Search ID machine that are TOQS 002 and TOQS 003. Learn how to prepare boxes for shipping. Evacuate things from warehouse to scrap.

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Perform checking at IT Department. 21 March 2011 25 March 2011 (17th week of training) Perform checking at Training Department. Help MLP FOL staff to find workbench. Help EE staff to capture pictures. Checking warehouse stocks and parts. Evacuate new machine for type model XTV160 to ICB FOL. Perform checking at SSOP/TSSOP FOL. Perform checking at ICB FOL.

28 March 2011 1 April 2011 (18th week of training) Help MLP staff to manage and arrange stocks. Shift the . Perform checking at PDIP/PLCC. Measure the thickness of lot Suzaka wire bond ball. Re-help MLP staff to manage stock. Measure the size of wire bond ball of lot Suzaka. Evacuate four Die Bonder machine to MLP FOL. To recongnize new staff in HR Department. Learn to install Cell Map program.

4 April 2011 8 April 2011 (19th week of training) Recongnise staff HRD. Perform checking at Wafer Probe Store BU5. Get the measurement of vacuum sealing machine at BU5. Do marking at MLP FOL to locate Sawing and Placement-20000D machine. Label machine in warehouse. Measure the thickness of wire bond bump of lot Suzuka. Help staff HR to arrange boxes.

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Go BU5 to see the process of vacuum sealing of tape and reel. Perform checking for Backgrind area at ICB FOL. Observed the process of scraping useless items in the warehouse.

11 April 2011 15 April 2011 (20th week of training) Perform checking at Backgrind. Get the measurement of workbench at Admin Office. Perform checking at lobby. To accompany visitor to look after the machine in the warehouse. Evacuate Die Bonder machine to MLP FOL. Help other staff to make document marker. Get the measurement for spaces that have in the ERT room. Learn basically about the C Perform checking for Form Singulate area at ICB FOL. Write down machine ID and model for type Evacuate two vision scanner table from warehouse to MLP EOL. Perform checking for Final Visual area at ICB FOL. Explaination of flow chart of assembly packaging in MLP FOL.

18 April 2011 22 April 2011 (21st week of training) Perform checking for QA area in MLP FOL. Perform checking for screen print, mounter and . Discard the monitor in the warehouse to Scheduled Waste Store 2. Perak Sultan Birthday. Perform checking for Plating area in Metal Finishing. To get the acknowledge ownership of the table. Perform checking for WM Station area in BU5. Observed the Substrate Cleaning System process for type model SCS112 at MLP FOL. Evacuate KnS Iconn Wire Bond to MLP EOL and CTC FOL.

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25 april 2011 29 April 2011 (Last week of training) Explaination of flow chart of assembly packaging in AP FOL. Enter data in the computer to obtain conclusion of saw singulation on minor stoppages on 23 April 2011 to 25 April 2011 . Perform checking for Form Singulate area in AP FOL. Look after the shipping process. Evacuate sawing machine from MLP FOL for shipping. Explaination of flow chart of assembly packaging in MLP EOL. Go MLP EOL to see process of packing.

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