DATA SHEET

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MOS FIELD EFFECT TRANSISTOR

2SK3570
SWITCHING N-CHANNEL POWER MOS FET

DESCRIPTION
The 2SK3570 is N-channel MOS FET device that features a low on-state resistance and excellent switching characteristics, designed for low voltage high current applications such as DC/DC converter with synchronous rectifier.

ORDERING INFORMATION
PART NUMBER 2SK3570 2SK3570-S 2SK3570-ZK PACKAGE TO-220AB TO-262 TO-263 TO-220SMD Note

FEATURES
4.5V drive available. Low on-state resistance, RDS(on)1 = 12 m MAX. (VGS = 10 V, ID = 24 A) Low gate charge QG = 23 nC TYP. (VDD = 16 V, VGS = 10 V, ID = 48 A) Built-in gate protection diode Surface mount device available

2SK3570-Z

Note TO-220SMD package is produced only in Japan.

ABSOLUTE MAXIMUM RATINGS (TA = 25C)

Drain to Source Voltage (VGS = 0 V) Gate to Source Voltage (VDS = 0 V) Drain Current (DC) (TC = 25C) Drain Current (pulse)
Note

VDSS VGSS ID(DC) ID(pulse) PT1 PT2 Tch Tstg

20 20 48 160 1.5 29 150 55 to +150

V V A A W W C C

Total Power Dissipation (TA = 25C) Total Power Dissipation (TC = 25C) Channel Temperature Storage Temperature Note PW 10 s, Duty Cycle 1%

The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. D16256EJ2V0DS00 (2nd edition) Date Published September 2002 NS CP (K) Printed in Japan

The mark ! shows major revised points.

2002

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2SK3570

ELECTRICAL CHARACTERISTICS (TA = 25C)

Characteristics Zero Gate Voltage Drain Current Gate Leakage Current Gate Cut-off Voltage Forward Transfer Admittance Drain to Source On-state Resistance Symbol IDSS IGSS VGS(off) | yfs | RDS(on)1 RDS(on)2 Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate to Source Charge Gate to Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD VF(S-D) trr Qrr VDD = 16 V VGS = 10 V ID = 48 A IF = 48 A, VGS = 0 V IF = 48 A, VGS = 0 V di/dt = 100 A/s Test Conditions VDS = 20 V, VGS = 0 V VGS = 20 V, VDS = 0 V VDS = 10 V, ID = 1 mA VDS = 10 V, ID = 24 A VGS = 10 V, ID = 24 A VGS = 4.5 V, ID = 15 A VDS = 10 V VGS = 0 V f = 1 MHz VDD = 10 V, ID = 24 A VGS = 10 V RG = 10 1.5 8.0 8.2 12.3 930 360 250 13 20 39 14 23 4 7 1.1 33 25 12 22 MIN. TYP. MAX. 10 10 2.5 Unit

A A
V S m m pF pF pF ns ns ns ns nC nC nC V ns nC

TEST CIRCUIT 1 SWITCHING TIME

TEST CIRCUIT 2 GATE CHARGE

D.U.T.

D.U.T. RL VGS PG. RG

Wave Form

VGS
0 10% VGS 90%

IG = 2 mA 50

RL VDD

VDD

PG.
90%

VDS
90% 10% 10%

VGS 0 = 1 s Duty Cycle 1%

VDS

VDS
Wave Form

0 td(on) ton

tr

td(off) toff

tf

Data Sheet D16256EJ2V0DS

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2SK3570

TYPICAL CHARACTERISTICS (TA = 25C)

DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA dT - Percentage of Rated Power - %
120 30

TOTAL POWER DISSIPATION vs. CASE TEMPERATURE PT - Total Power Dissipation - W

100

25

80

20

60

15

40

10

20

0 0 25 50 75 100 125 150 175

0 0 25 50 75 100 125 150 175

TC - Case Temperature - C FORWARD BIAS SAFE OPERATING AREA

1000
R DS(on) limited ID(pulse)

TC - Case Temperature - C

ID - Drain Current - A

PW = 10 s

100

100 s 10
I D(DC)

DC

1 ms 10 m s

Power dissipation limited T C = 25C Single pulse

0.1 0.1 1 10 100

VDS - Drain to Source Voltage - V TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH rth(t) - Transient Thermal Resistance - C/W 100 Rth(ch-A) = 83.3C/W

10 Rth(ch-C) = 4.31C/W 1

0.1

Single pulse 0.01 10 100 1m 10 m 100 m 1 10 100 1000

PW - Pulse Width - s

Data Sheet D16256EJ2V0DS

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2SK3570

DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE

200 180 100

FORWARD TRANSFER CHARACTERISTICS

ID - Drain Current - A

ID - Drain Current - A

160 140 120 100 80 60 4.5 V 40 20 0 0 0.5 1 1.5 2 2.5 3 Pulsed V GS = 10 V

10

T ch = 150C 75C 25C 55C

0.1 V DS = 10 V Pulsed 0.01 0 1 2 3 4 5

VGS - Gate to Source Voltage - V VDS - Drain to Source Voltage - V GATE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE
V DS = 10 V ID = 1 mA 2.5 2 1.5 1 0.5 0 -50 0 50 100 150

FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT | yfs | - Forward Transfer Admittance - S
100

VGS(off) - Gate Cut-off Voltage - V

10
T ch = 150C 75C 25C 55C

V DS = 10 V Pulsed 0.1 0.1 1 10 100

Tch - Channel Temperature - C ID - Drain Current - A DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT
25 Pulsed 20

RDS(on) - Drain to Source On-state Resistance - m

RDS(on) - Drain to Source On-state Resistance - m

DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE

25 P u ls e d 20

15

V GS = 4.5 V

15 ID = 2 4 A

10

10 V

10

0 1 10 100 1000

0 0 5 10 15 20

ID - Drain Current - A VGS - Gate to Source Voltage - V

Data Sheet D16256EJ2V0DS

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2SK3570

RDS(on) - Drain to Source On-state Resistance - m

DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE

20

CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE

10000

15

V G S = 4 .5 V

Ciss, Coss, Crss - Capacitance - pF

1000

C is s C oss C rs s

10

10 V

100

5 ID = 2 4 A P u ls e d 0 -5 0 0 50 100 150

VGS = 0 V f = 1 MHz 10 0 .0 1 0 .1 1 10 100

Tch - Channel Temperature - C SWITCHING CHARACTERISTICS

100

VDS - Drain to Source Voltage - V DYNAMIC INPUT/OUTPUT CHARACTERISTICS

20 10 V D D = 16 V 10 V

VDS - Drain to Source Voltage - V

t d (o ff) tf t d (o n ) 10 tr

16

12 V GS

VDD = 10 V VGS = 10 V RG = 10 1 0 .1 1 10 100

4 VDS 0 0 5 10 15 20 25 I D = 48 A

QG - Gate Change - nC

ID - Drain Current - A SOURCE TO DRAIN DIODE FORWARD VOLTAGE

1000 P u ls e d 100 1000

REVERSE RECOVERY TIME vs. DRAIN CURRENT

trr - Reverse Recovery Time- ns

IF - Diode Forward Current - A

100

10

V GS = 10 V 0 V

10

0 .1

d i/ d t = 1 0 0 A / s VGS = 0 V 1 0 0 .5 1 1 .5 0 .1 1 10 100

0 .0 1

VF(S-D) - Source to Drain Voltage - V

ID - Drain Current - A

Data Sheet D16256EJ2V0DS

VGS - Gate to Source Voltage - V

td(on), tr, td(off), tf - Switching Time - ns

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2SK3570

5 PACKAGE DRAWINGS (Unit: mm)

1) TO-220AB (MP-25)
3.00.3
10.6 MAX. 10.0 TYP. 4.8 MAX.

2) TO-262 (MP-25 Fin Cut)

1.00.5

3.60.2
5.9 MIN.

4.8 MAX. 1.30.2

1.30.2

10 TYP.

15.5 MAX.

4 1 2 3

4 1 2 3

6.0 MAX.

1.30.2

1.30.2

12.7 MIN.

12.7 MIN.

8.50.2

0.750.3 2.54 TYP.

0.50.2 2.54 TYP. 1.Gate 2.Drain 3.Source 4.Fin (Drain)

2.80.2

0.750.1 2.54 TYP.

0.50.2 2.54 TYP. 1.Gate 2.Drain 3.Source 4.Fin (Drain)

2.80.2

3) TO-263 (MP-25ZK)
10.00.2 No plating 0.4 8.4 TYP. 4

4) TO-220SMD (MP-25Z)
1.350.3

Note
4.8 MAX. 1.30.2

10 TYP.
4.450.2 1.30.2

1.00.5

8.0 TYP.

9.150.2

15.250.5

0.025 to 0.25

1 1.40.2
2.450.25

3
1.10.4

0.750.3 2.54 TYP.

P. TY P. R Y 0.5 R T 0.8 2.54 TYP.

3.00.5

8.50.2

0.50.2

0.70.15 2.54 1 2 3

0.5 0.2 0 to 8o

0.25 1.Gate 2.Drain 3.Source

2.5

4.Fin (Drain)

Note This package is produced only in Japan.

EQUIVALENT CIRCUIT
Remark
Drain

The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding

Gate

Body Diode

the rated voltage may be applied to this device.

Gate Protection Diode

Source

Data Sheet D16256EJ2V0DS

2.80.2

1.Gate 2.Drain 3.Source 4.Fin (Drain)

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2SK3570

[MEMO]

Data Sheet D16256EJ2V0DS

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2SK3570

The information in this document is current as of September, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
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