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Seminar Overview:
In today's layout environment IC devices are becoming more complex, smaller and being developed on shorter and shorter production schedules. This seminar is designed to introduce the Advanced Analog Layout Techniques needed to understand and develop great Mixed Signal and Custom Analog layout. We will strive to take you from understanding the basics of layout and device fabrication, to develop advanced strategies and solutions to deal with the issues addressed in Precise Analog Layout, such as Noise considerations, Isolation issues and Matching techniques. Related topics also discussed include ESD guidelines, coordinating Mixed Signal layout efficiently, and Chip level integration.
Seminar Overview:
In today's layout environment IC devices are becoming more complex, smaller and being developed on shorter and shorter production schedules. This seminar is designed to introduce the Advanced Analog Layout Techniques needed to understand and develop great Mixed Signal and Custom Analog layout. We will strive to take you from understanding the basics of layout and device fabrication, to develop advanced strategies and solutions to deal with the issues addressed in Precise Analog Layout, such as Noise considerations, Isolation issues and Matching techniques. Related topics also discussed include ESD guidelines, coordinating Mixed Signal layout efficiently, and Chip level integration.
Hak Cipta:
Attribution Non-Commercial (BY-NC)
Format Tersedia
Unduh sebagai PDF, TXT atau baca online dari Scribd
Seminar Overview:
In today's layout environment IC devices are becoming more complex, smaller and being developed on shorter and shorter production schedules. This seminar is designed to introduce the Advanced Analog Layout Techniques needed to understand and develop great Mixed Signal and Custom Analog layout. We will strive to take you from understanding the basics of layout and device fabrication, to develop advanced strategies and solutions to deal with the issues addressed in Precise Analog Layout, such as Noise considerations, Isolation issues and Matching techniques. Related topics also discussed include ESD guidelines, coordinating Mixed Signal layout efficiently, and Chip level integration.
Hak Cipta:
Attribution Non-Commercial (BY-NC)
Format Tersedia
Unduh sebagai PDF, TXT atau baca online dari Scribd