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INDUSTRIAL TRAINING REPORT

SUBMITTED BY :

MUHAMMED MASIN . K S7 ECE (B) Roll No : 24

L.B.S COLLEGE OF ENGINEERING KASARAGOD, KERALA

INDUSTRIAL TRAINING REPORT


Submitted in partial fulfillment of the requirements for the award of the degree of Bachelor of Technology in Electronics & Communication Engineering

Submitted By

MUHAMMED MASIN . K

Department of Electronics & Communication Engineering KANNUR UNIVERSITY 2011

L.B.S COLLEGE OF ENGINEERING KASARAGOD

CERTIFICATE

This is to certify that Mr. MUHAMMED MASIN . K of VII nth semester Electronics and Communication has completed their Industrial Training work at ITI Palakkad on May,2011 satisfactorily in partial fulfillment of requirement of Bachelor of Technology degree of Electronics and Communication Engineering 2008-2012,batch of Kannur University in L.B.S COLLEGE OF ENGINEERING, KASARAGOD.

PLACE: DATE:

KASARAGOD

HOD ECE Dept

ACKNOWLEDGEMENT

I take this opportunity to humbly express my sincere thanks to all those concerned with our training at ITI Palakkad. I express deep feelings of gratitude to Sri. Wilson SDE (Training) for providing me the opportunity to work on such an interesting training, without his help I could not have completed it satisfactorily. His invaluable guidance has proved to be a key to our success in overcoming difficulties we faced during the course of the training work. I are also obliged to Smt.HARINI (HR Dept.) for their guidance in training at the company. I express my thanks to all the members of ITI Palakkad for their help as and when situation demanded. We are also obliged to MaryReena K.E, H.O.D Electronics & Communication Department in LBS College, for allowing us to do this, Finally, we thank all the staff members of our college for their support and guidance to us.

Date: Place:

ABSTRACT
The following report describes an overview of the outcome of an Industrial training undertaken by the author at ITI Palakkad so as to get a close look into the production as well as co-ordination processes in an electronic/Telecom equipment manufacturing Company. The above mentioned Industrial training was conducted during a 5 days of period from 02-05-2011 to 07-05-2011 along with other 6 members from various Institutions.

INTRODUCTION

The organizational study undergone during the month of May was for partial fulfillment of the award of degree of Bachelour of Technology under kannur University. This study was a good experience to know all about ITI Palakkad. Indias first Public Sector Unit (PSU) ITI Ltd was established in 1948.Eversince, as pioneering venture in the field of telecommunication. It has contributed to the 50% of the present national telecom network. With state of the art manufacturing facilities spread across six locations and a country wide network of marketing /service outlets, the company offers a complete range of telecom products and total solutions covering the whole spectrum of switching, transmission ,access and subscriber premise equipment. ITI joined the league of world class vendors of Global System for Mobile(GSM) technology with the inauguration of mobile equipment manufacturing facilities at its Mankapur and Rae Bareli plants in 2005-06.This ushered in a new era of indigenous mobile equipment production in the country. These two facilities supply more than nine million lines per annum to both domestic as well as export markets. The company is consolidating its diversification into Information and Communication Technology (ICT) to hone its competitive edge in the convergence market by deploying its rich telecom expertise and vast infrastructure Network Management Systems encryption and networking solutions for internet connectivity are some of the major initiatives taken by the company. Secure communications is companys forte with a proven record of engineering strategic communication network for Indias defence forces. Extensive in house R&D work is devoted towards specialized areas of encryption of Network Management System, IT and Access products to provide complete customized solutions to various customers.

OBJECTIVES OF THE STUDY:


The following are the specific objectives of this Organization Study. To acquire knowledge regarding the technical profile of the company. To study the various operations in formulation of products. To analyze functions performed by the various Departments in the organization. To gather close understanding of existing telecom trend . To get familiarized with the real world electronic equipment manufacturing company.

METHODOLOGY: Primary sources of data :


Direct personal interview with manager of concerned departments, detailed Interview with department heads and other lower level (production segmented) workers in the company.

LIMITATIONS OF STUDY:
The limitations of the study were-

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Time constraint. Difficulty in meeting the official because of their busy schedule. Due to the short span of time allotted the project work; an intense study was not possible. Since industrial works and designing operations are less during the period of training,it was almost not possible to get an exact thread over the all sections. Management did not exposed some confidential processes and control.

CHAPTER-I

COMPANY OVERVIEW

INDUSTRIAL PROFILE:
The Indian telecommunication industry, with about 584 million mobile phone connections as of March 2010, is the third largest telecommunication network in the world and the second largest in terms of number of wireless connections. The Indian telecom industry is the fastest growing in the world and is projected that India will have a 'billion plus' mobile users by 2015.Projection by several leading global consultancies is that India s wireless telecom network will overtake China s in the next 2 years.The industry is expected to reach a size of RS 344,921 crore by 2012 at a growth rate of over 26 per cent, and generate employment opportunities for about 10 million people during the same period. According to analysts, the sector would create direct employment for 2.8 million people and for 7 million indirectly. For the past decade or so, telecommunication activities have gained momentum in India. Efforts have been made from both governmental and non-governmental platforms to enhance the infrastructure. The idea is to help modern telecommunication technologies to serve all segments of India s culturally diverse society, and to transform it into a country of technologically aware people. It is noteworthy that the Indian Mobile subscriber base grew 10 fold in just 4 years(from 7.56 million subscribers in Dec 2001 to 75.94 million subscribers in Dec 2005) and then over the next 4 years it grew 7 fold (from 75.94 million subscribers in Dec 2005 to 525.94 million subscribers in Dec 2009). In the first two months of 2010 there have been a record breaking 38.59 million mobile subscriber additions - More than twice as many added in China during the same period (18.6 million), which is currently leading with 766 million mobile subscribers as of Feb 2010. The unprecedented rise in the number of new connections has lent credence to the popular belief that India will soon overtake China as the country with the world's largest mobile subscriber population.

Modern growth
A large population, low telephony penetration levels, and a rise in consumers' income and spending owing to strong economic growth have helped make India the fastest-growing telecom market in the world. The first and largest operator is the state-owned incumbent BSNL, which is also the 7th largest telecom company in the world in terms of its number of

subscribers. BSNL was created by corporatization of the erstwhile DTS (Department of Telecommunication Services), a government unit responsible for provision of telephony services. Subsequently, after the telecommunication policies were revised to allow private operators, companies such as Vodafone,Bharthi Airtel,Idea Cellular,Aircel and Loop Mobile have entered the space.. In 2008-09, rural India outpaced urban India in mobile growth rate. India's mobile phone market is the fastest growing in the world, with companies adding some 19.1 million new customers in December 2009. The total number of telephones in the country crossed the 543 million mark on Oct 2009.The overall tele-density has increased to 44.85% in Oct 2009.Telecom Regulatory Authority of India,Information note to the Press (Press Release No. 61 / 2007), 20 Jun 2007 In the wireless segment, 19 million subscribers have been added in Dec 2009. The total wireless subscribers (GSM, CDMA & WLL (F)) base is more than 543.20 million now. The wireline segment subscriber base stood at 37.06 million with a decline of 0.12 million in Dec 2009.

History
Telecom in the real sense means transfer of information between two distant points in space. The popular meaning of telecom always involves electrical signals and nowadays people exclude postal or any other raw telecommunications methods from its meaning. Therefore, the history of Indian telecom can be started with the introduction of telegraph.

COMPANY PROFILE :
India s first Public Sector Unit (PSU) - ITI Ltd was established in 1948. Ever since, as a pioneering venture in the field of telecommunications, it has contributed to 50% of the present national telecom network. With state-of-the-art manufacturing facilities spread across six locations and a countrywide network of marketing/service outlets, the company offers a complete range of telecom products and total solutions covering the whole spectrum of Switching, Transmission, Access and Subscriber Premises equipment. ITI joined the league of world class vendors of Global System for Mobile (GSM) technology with the inauguration of mobile equipment manufacturing facilities at its Mankapur and Rae Bareli Plants in 2005-06. This ushered in a new era of indigenous mobile equipment production in the country. These two facilities supply more than nine million lines per annum to both domestic as well as export markets. The company is consolidating its diversification into Information and Communication Technology (ICT) to hone its competitive edge in the convergence market by deploying its rich telecom expertise and vast infrastructure. Network Management Systems,

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Encryption and Networking Solutions for Internet Connectivity are some of the major initiatives taken by the company. Secure communications is the company's forte with a proven record of engineering strategic communication networks for India's Defence forces. Extensive in-house R&D work is devoted towards specialized areas of Encryption, NMS, IT and Access products to provide complete customized solutions to various customers.

OVERVIEW
Corporate Head Quarters: ITI BHAVAN, Doorvani Nagar, Bangalore 560 016

Manufacturing Units

1) Bangalore, Naini (Allahabad-UP), 2) Mankapur, Rae Bareli (UP), 3) Palakkad (Kerala), 4) Srinagar (J&K).

Network System Unit Regional offices

: :

Bangalore Cochin, Bangalore, Kolkata Luck now, Chennai, Mumbai Hyderabad, Bhubaneswar, Bhopal, Ahmadabad

MORE ABOUT ITI:


y y y y Multi-locational state-of-the-art electronic assembly & component manufacturing facilities accredited with ISO 9001:2000 . Multi-locational ISO 14001 :2004 Environmental Management System certified plants First Indian company to manufacture BTS & other infra products for GSM / WiMAX. Countrywide marketing and customer care centers. In-house R&D for absorption of technology, indigenous development of products for inhouse manufacturing.

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STOCK PRICE(NSE):
Rs. 21.85/share (as on 1/10/2011)

RESOURCES:
Dedicated Network Systems Unit (Bangalore, New Delhi, Kolkata, Bhopal, Ambala) . State-ofthe-art Manufa~turing Plants (Bangalore, Mankapur, Rae Bareli, Naini, Palakkad, Srinagar) . R&D Centre SMPS : Fabrication of 100 A - 150A Power Plants with 25A base Module for GSM . Fabrication of 200A-3000A' Power Plants with 100A base Modules for telecom installation

COMPANY VISION & MISSION


To re-establish leadership in manufacturing and supply of Telecom equipments and also to retain the status of top turnkey solution provider.

PERFORMANCE
Performance from 2004 to 2009 in Rs. Crores Year Sales(Incl. ED) Production Profit After tax /Loss (309.82) (428.76) (405.26) (358.00) (668.00) 2004-05 1389.01 1362.22 2005-06 1,749.38 1,607.20 2006-07 1,818.33 1,797.05 2007-08 1,210.00 1,250.42 2008-09 1,741.00 1835.36

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PRODUCTS

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GSM (Global System for Mobile) - BTS, BTS Shelter, Roof Top Tower CDMA ( Code Division Multiple Access) Switching : Large Switches, Medium Switches, Small Switches Transmission : Microwave, Fibre Optic, Satellites Access : Wireless in Local Loop (WLL), Digital Loop Carrier (DLC),Paigrain Terminal Equipment: Telephones, ISDN Products, Video Conferencing Microelectronics : Application Specific Integrated Circuits (ASICs) IT Products : Computer Technology Integration (CTI), ITI PC Defence : OWS Orderwire Secrecy, MIC PCM Secrecy,etc

SERVICES :
System Integration - Telecom, IT . Shared Hub V -SAT Services . Customer Care Service . Installation & Commissioning of Telecom Eqpt like GSM, CDMA, MLLN, Microwave, Optical Fibre, etc. . Pre-warranty & Post-warranty maintenance services for all Products/Projects . Services for all products/projects . Enterprise businesses like Data Centers etc

TECHNICAL COLLABORATIONS/ STRATEGIC ALLIANCES


In order to meet the emerging needs of the customers as well as to develop cutting edge capabilities ITI Limited has select strategic alliance with leading companies from around the world.
Alcatel Lucent, France ZTE, China Alphion, USA SemIndia, India Huawei, China GSM Infrastructure CDMA Infrastructure, DWDM, GE-PON, NGN (IP TAX) Class 5 G-PON ADSL-CPEs NGN (IP TAX)- Class 4, GSM (South zone)

13 Tekelec Inc, USA Tejas Networks India Xalted, India Mobi, China SAF Tehnika, Latvia WatchData, China Tellabs, Finland Vuppala, India VNT, India C-DOT, India Alcatel, France Eltek / DACS, India SSTP SDH Optical Transmission Eqpt STM-64 Antenna for GSM & CDMA 15/18 GHZ Microwave Equipment SIM Card MLLN CLIP Phones Automated Integrated Management System Small, Medium and Large Digital Switches Large digital switches SMPS

CUSTOMERS
Indian Customer Profile : Department of Telecommunications (DoT),Government of India ,BSNL Mahanagar Telephone Nigam ,Defence Services, Paramilitary, Police Internal Security organisations ,Power, Steel and Oil sectors , Railways, Post Offices, Factories, Offices, Bank ,Corporates Hotels , State and Central Government Organizations . Global Customer Profile : Afghanistan , Botswana, Bhutan, Comoros, Gambia , Ireland, Madagascar Malaysia, Nepal, Rwanda ,Sri Lanka, Sudan, Switzerland, Uganda ,Vietnam Yemen ,Zimbabwe.

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RESEARCH & DEVELOPMENT


y y y ITI's technological strength lies in its vibrant R&D Unit. Products developed by R&D forms a major portion of the company's turnover. An exclusive core R&D manned by highly qualified and talented engineers with ISO 9001 certification and representation in national and international level quality standard panels . State- of -the- art design aids Modern facilities for complete equipment and system evaluation Comprehensive vendor evaluation facilities Approval and qualification facilities to match international standards. Customised Telecom and IT solution expertise. Expertise in adapting imported technology/products to the country's requirement.

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CHAPTER II

ITI Palakkad
INFRASTRUCTURE : was established in the year 1976, as the Nation s first Electronic Switching Systems Production Unit. The Unit is situated in the Industrial corridors of Coimbatore and Kochi (Kanjikode) in the NH-47 and only 10 kms from Palakkad Town.
ITI LIMITED, PALAKKAD

The Unit went into production in 1976 with a meager overall investment of Rs.26 Lakhs for producing 10,500 lines of small electronic exchanges of 10 to 50 Lines capacity. In 1980,the Unit was expanded with an investment of Rs.98 lakhs, to produce 60,000 lines of medium size electronic exchanges of 200 lines capacity. The product range at that stage included sophisticated microprocessor controlled Exchanges for Civilian and Defense use and Subscriber Line Routiner used for maintaining the telephone lines. In 1985, it was decided to establish manufacturing facilities for Digital Trunk Automatic Exchanges, with an investment of Rs.67.57 Crores. The planned capacity was to manufacture 30,000 circuits of DTAX equipment, 50,000 lines of ILT and 50,000 lines of other exchanges totaling 1,60,000 lines apart from PCB manufacturing facilities. With some modifications within the overall investment, facilities were established to manufacture EIOB local exchanges also, thereby increasing the overall capacity to 2,60,000 lines. Quality of the products has been consistently good. The uncompromising attitude to Quality has fetched ITI Ltd., Palakkad, and the coveted Self-Certification Scheme for DTAX. Quality system in the unit was audited and certified to ISO-9002 QMS Standard in Sept. 93. The Unit has emerged successful through the surveillance audits conducted by IRQS and was reassessed and certified as per ISO-9002:1994 version in 1996 and in 1999. ISO 9001:2000 Edition Certification was awarded to ITI Palakkad Unit during Sept.2002. The surveillance audit for QMS and the Certification audit for SMART card were successfully completed during Sept 2003 and ISO 9001:2000 edition Certification was awarded to ITI Palakkad unit for Smart card manufacturing during this audit. ISO 9001:2000 Edition 2nd Surveillance audit was successfully completed during September 2005 and subsequently Surveillance audit was successfully completed during September 2006. Environmental Management System in Palakkad unit was audited by IRQS and certified to ISO 14001:1996 Standard in January 2005 and upgraded to 14001:2004 Edition in April 2006.Subsequently Surveillance audit was conducted successfully during February 2007.

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The unit is also engaged in the manufacture of OCB 283 switching system, in technical collaboration with ALCATEL-CIT. Total production capacity of the unit is ONE MILLION lines as per annum. Over these years, the Unit has grown to become one of the World Class Manufacturing Plants, with the state-of-the-art FUJI SMT Assembly Line, PCB Plant with a capacity of 10,000 Sq. Meters of PCBs per annum.(Double sided equivalent). Based on the consistent quality of the product and service ,ITI Ltd, Palakkad is certified under Approved Inspection Scheme for supplying OCB 283 Core equipment to BSNL/MTNL with effect from 23/06/99. ITI Palakkad Unit has entered into the new business areas of Information Technology. Company has Introduced new products in order to exploit the business opportunities of IT SMART Card Manufacturing is started in 2001 in Palakkad Unit in collaboration with Incard Italy and manufacturing of SMART cards in collaboration with G&D Germany started from 2005:Recently: in July 2007, manufacturing of SMART cards in collaboration with M/s Watch Data started. The unit is gearing towards the Approved Inspection Scheme for SIM Card Assembly.ITI Palakkad has started the production of Multinational ID Cards for RGI during March-2007. In order to meet the emerging needs of the customers as well as to develop cutting edge capabilities ITI has select strategic alliance with leading companies from around the world. The strategic alliance with M/s. Teklec Inc., USA for SSTP and collaboration with M/s. Tellabs, Finland are two backbone projects of ITI Palakkad. Managed Leased Line Network is an integrated fully managed, multi-service digital network platform through which service provider can offer wide range of services at an optimal cost of Business subscribers. BSNL and MTNL are the two major customers. MLLN and its applications are beneficial to large sectors like banking, financial institutions, Stock Markets, News Paper Industry Broadcasting houses and Internet service providers etc. With a proven record of engineering strategic communication networks for India s Defence Forces, ITI have also proven their mettle in developing superior telecommunication products and solutions, in highly secure environs.

RANGE OF PRODUCTS
y y y y y y Large Digital Switches and Digital Trunk Exchanges (OCB) Double Sided & Multi Layer Printed Circuit Boards (PCB) Assembly of state-of the-art Surface Mounted Devices (SMD) SIM Cards / Smart Cards / National ID Cards New Generation Network (NGN) Equipment Network Management Systems(NMS)

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Managed Leased Line Network (MLLN) Voice over Internet Protocol (VoIP) Virtual Private Network (VPN) Stand-alone Signaling Transfer Point (SSTP) Equipment Integrated Manufacturing Management System (IMMS) and other customized software solutions

HIGHLIGHTS

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SMD Technology, PCB Assembly Installation, Commissioning & Technical Support of exchanges Nationwide Annual Maintenance Contract (AMC) for OCB Complete turnkey implementation of Nationwide Managed Leased Line Network (MLLN) in collaboration with Tellabs AMC for all the new products Installation and commissioning of all the new solutions deployed like VoIP, MLLN, SSTP, IPTAX etc. Equipment Calibration

CHAPTER-III

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PROCUCTS AND PRINCIPLES:


 Large Digital Switches and Digital Trunk Exchanges (OCB283)
OCB283 is a digital switching system, which supports a variety of communications, needs like basic telephony, ISDN, mobile communication, data communication etc. This system has been developed by CIT Alcatel of France Over the years the system has been undergoing routine upgrades to take care of the evolving trends as well as the augmentation of new features and presently the R25 version is being supplied in India.

THEORY AND ARCHITECTURE: OCB Exchange consists of 3 Blocks 1) Connecting Unit 2) Switching Unit 3) Control Units

Structure of Exchange:

ETM(Translator and Interpretor)

EXPLOITATION ROOM

OMC ROOM

SWITCH ROOM

MDF(Main Distribution Frame)

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Salient features of the system 1. It is a digital switching system with single T stage. A maximum of 2048 PCMs can be connected. 2. It supports both analog and digital subscribers. 3. The system supports all the existing signaling systems like decadic, MF (R2), CAS and also CCITT No7 signaling system. 4. It provides telephony, ISDN, data communication, cellular radio and other value added services. In Palakkad plant the core switching part of OCB 283 is manufactured (production includes manufacture and assembly of PCBs, Rack / sub racks and interconnecting cables etc) and conducting the full range of testing from Printed circuit board level to Integration testing level of exchanges.

 Double Sided & Multi Layer Printed Circuit Boards(PCB)


ITI Limited, Palakkad, has a full fledged and fully air conditioned PCB Plant spread over a carpet area of 4000 sq.m. The Plant, set up with the technical collaboration of Alcatel, France is one among the best in South India, having a capacity of 12,000 Sq.M. per annum of various layer mixes of 4,6,8 and 10 layers, apart from the conventional Double and Single side PCBs with SMOBC finish. The Plant is equipped with the Industry s latest and reputed machineries, which include: Excellon Mark VII Drilling Machine, Schering (Presently Atotech) fully automatic

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Plating Line, C Sun Collimated UV Exposure, PAL Desmear Black Oxide Line, Atotech Developing Machines, Wabash Multilayer Press, CEMCO- Quicksilver and TTM Hot Air Leveling Machines etc. The Plant is integrated with a Quality Control Department which is fully equipped with the latest Flying Probe Testing facilities from the industry s premier equipment manufactures like Probot, USA and Seica, Italy, in addition to conventional BBTs. The Plant is also well supported by the Pre Engineering Department, where the UCAM and GC CAM software are utilized in the generation of manufacturing data. The Plant certified for ISO 9001(2000) and ISO 14001(2004) has a full-fledged Effluent Treatment plant which is in strict compliance to KSPCB Effluent standards. The Plant is approved by Alcatel France, C DOT and LCSO (Defense) JSS : 52302. The Plant is engaged in manufacturing PCBs for Defence and Space related applications of customers like M/s HAL, BEL etc in addition to the PCB manufacture for telecom requirements.

THEORY The Printed Circuit Board Manufacturing Process:


The process starts once your files and specifications have been sent to Triangle Circuits. Our engineers review each order to ensure design for manufacturability and proper selection of materials and technologies before manufacturing begins.

Patterning | Etching
The majority of printed circuit boards are manufactured by applying a layer of copper over the entire surface of the circuit board substrate either on one side or both sides. This creates what is referred to as a blank printed circuit board, meaning the copper is everywhere on the surface. From here the unwanted areas are removed, this is called a subtractive method, the most common subtractive method is known as photoengraving.

Photoengraving
The photoengraving process uses a mask or photomask combined with chemical etching to subtract the copper areas from the circuit board substrate The photomask is created with a photoplotter which takes the design from a CAD PCB software program. Lower resolution photomasks are sometimes created with the use of a laser printer using a transparency.

Lamination
Many printed circuit boards are made up of multiple layers, these are referred to as multi-layer printed circuit boards. They consist of several thin etched boards or trace layers and are bonded together through the process of lamination.

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Drilling
Each layer of the printed circuit board requires the ability of one layer to connect to another, this is achieved through drilling small holes called "VIAS". These drilled holes require precision placement and are most commonly done with the use of an automated drilling machine. Theses machines are driven by computer programs and files called numerically controlled drill or (NCD) files also referred to as excellon files. These files determine the position and size of each file in the design. Some files require very small vias to be drilled which results in heavy wear and tear of the drill bit itself. Drilling through different substrates may require the drill bit to be made of tungsten carbide and are costlier than other materials but required to provide a proper hole. Controlled depth drilling can be used to drill just one layer of the circuit board rather than drilling through all the layers. This can be accomplished by drilling the individual sheets or layers of the PCB prior to lamination. Blind Vias : Is when the holes connect a layer to the outside surface Buried Vias : Is when the holes only connect interior layers and not to the outside surface. The walls of each hole (for multi-layer boards) are copper plated to form plated-through holes that connect the conductive layers of the printed circuit board.

Solder Plating | Solder Resist


Pads and lands which will require components to be mounted on are plated to allow solderability of the components. Bare copper is not readily solderable and requires the surface to be plated with a material that facilitates soldering. In the past a lead based tin was used to plate the surfaces, but with RoHS compliance enacted newer materials are being used such as nickel and gold to both offer solderability and comply with RoHS standards. Areas that should not be solderable are covered with a material to resist soldering. Solder resist refers the a polymer coating that acts as a mask and prevents solder from bridging traces and possibly creating short circuits to nearby component leads.

Silk Screen
When visible information needs to be applied to the board such as company logos, part numbers or instructions, silk screening is used to apply the text to the outer surface of the circuit board. Where spacing allows, screened text can indicate component designators, switch setting requirements and additional features to assist in the assembly process. NOTE: "Red Print" refers to the silk screening of a one sided printed circuit board.

Testing
Unpopulated circuit boards are subjected to a bare board test where each circuit connection (as defined in a netlist) is verified as correct on the finished circuit board. In high volume circuit board production, a

22 bed of nails tester or fixture is used to make contact with the copper lands or holes on one or both sides of the board to facilitate testing. Computers are used to control the electrical testing unit to send a small current through each contact point on the bed of nails and verify that such current can be detected on the appropriate contact points. For small to medium volume production runs, a flying probe tester is used to check electrical contacts. These flying probes employ moving heads to make contact with the copper lands and holes to validate the electrical connectivity of the board being tested.

 Sim Cards / Smart Cards / National ID Cards


ITI Limited, Palakkad is equipped with a world class Smart Card Assembly Facility integrated with most modern Manufacturing Machines and Level 4 Security for assembly, personalization and testing of SIM cards. An annual capacity of 18 Million cards exists, which si primarily catering to the requirements of BSNL and MTNL. The Facility is also being used for the prestigious National ID Card Project. Figure below shows a sample personalized smart card.

 Managed Leased Line Network (MLLN)


The MLLN is a Managed Leased Line Network (MLLN) system, which can provide managed leased line connectivity. A leased line is a telecommunications path between two points that is

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available 24 hours a day for use by a designated user (individual or company). These leased lines can carry data, voice and video information. It is not shared in common among multiple users as dialup line. Bandwidth of a leased line can be (E0 Interface) at 64Kbps and n x 64 Kbps up to a maximum of 2 Mbps (E1 Interface). MLLN is capable of supporting two types of leased line circuits. 1. Point to Point Circuit 2. Point to Multi Point Circuit The MLLN is an integrated, fully managed, multi-service digital network platform through which service providers can offer a wide range of services at an optimal cost to Business Subscribers. Backed by a flexible Network Management System with powerful diagnostics and maintenance tools, the MLLN can be used to provide high-speed leased lines with improved QoS (Quality of Service), high availability and reliability. The Network Management System also supports Service Provisioning, Network Optimization, Planning and Service Monitoring. Due to its wide range of applications in various sectors like banking, financial institutions, stock markets, newspaper industry, broadcasting houses and Internet Service Providers, this managed leased line equipment will benefit all sections of people by way of faster Internet access, accessibility of bank accounts from anywhere, instant news coverage etc. Various organizations like banks, ATM operators, and IT companies will be using this flexible leased line solution.

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ITI Palakkad, in collaboration with M/s Tellabs, Finland had carried out the supply installation, commissioning and AMC of more than 8000 Physical nodes in India, for the BSNL Data network, spread out from Kashmir to Kanyakumari.

 Stand Alone Signaling Transfer Point Network (SSTP)


The Signaling Transfer Point (STP) system is a digital system used in the telecommunication network for transfer of signaling data between telecommunication system (mobile exchanges, local exchanges, trunk exchanges etc). Signaling data is the information related to calls between subscribers or those related to management of calls or network management messages. The Short Message Service (SMS), widely used in the mobile network is also treated as signaling data. The STP system acts as a transit system for the transfer of Signaling data from one location to a distant location through defined transmission network. The capacity of a STP system is measured by the equipped capacity of narrow band signaling link (64 kbps) as well as high speed signaling link (2Mbps).
Service Switching Points (SSPs) In conventional telephone networks, Service Switching Points (SSPs) are usually telephone central offices, also known as End-Offices, or Access Tandems. In the cellular mobile or wireless communications environment, an SSP is frequently located at the Mobile Switching Center (MSC). In either case, the SSPs perform circuit-switching functions, and are capable of using the SS7 protocol to signal other SSPs for call setup, or to query the centralized databases that are stored in Service Control Points (SCPs). Service Control Points (SCPs) Service Control Points (SCPs) are network intelligence centers where databases of call processing information are stored. The primary function of SCPs is to respond to queries from other SCPs, by retrieving the requested information from the appropriate database within the SCP node, and sending it back to the originator of the request. Signaling Transfer Points (STPs) STPs are ultra-reliable, high-speed packet switches at the heart of SS7 networks, which terminate all link types except F links. For reliability reasons, they are nearly always deployed in mated pairs.The primary functions of STPs are to provide access to SS7 networks and routing of signaling messages. The SS7 protocol itself defines destination routing for both circuitrelated signaling (inter-SSP) and noncircuit-related database inquiries to Service Control Points (SCPs). Many STPs contain additional routing information concerning the exact location of specific databases stored at different SCPs, so that an SSP can request information without knowing in which specific SCP it is stored.

SSTP Functions can be concluded as :

25 SS7 Message routing Global Title Translation SS7 Network Management Network Interconnection Gateway Screening

ITI Palakkad has set up the Stand Alone Signaling Transfer Point Network (SSTP) for the State owned operator, BSNL, covering the entire country. The STP system is supplied by M/s Tekelec, USA, who is the world leader in STP related products. ITI had bagged the orders from BSNL for setting up the SSTP network in 2005 and have successfully completed three phases of the project covering 5000 Signaling links.

MANUFACTURING FACILITY ITI Limited, Palakkad , has a highly productive Plant equipped with modern facilities for Surface Mounted Devices (SMD) assembly and automated testing to ensure zero defect product and Printed Circuit Board (PCB) manufacture of various layer counts. ITI also have state-of-the art SIM Card Manufacturing and Personalization Centre, Modern Calibration Lab, Cable Assembly and Harnessing Equipments, PC based Microprocessor Development Systems and the latest Test Equipments. ITI fully networked over a Local Area Network with more than 200 nodes connecting all the Departments along with VSAT connectivity with all the other manufacturing Plants. TESTING & QA The facility has highly sophisticated tools and programmes to test the functionality of the card, rack, cables and simulation activity based on the exact site installation layout.The Manufacturing Automation Protocol (MAP) Test, Integration Test and Climatic Test ensure a failure rate less than 2 % . The facility has been approved by BSNL with a Self Certification stature.

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TECHNICAL SUPPORT ON PRODUCTS


ITI Palakkad is providing warranty and AMC support to their customers for all their products. As part of this ,ITI has a Web based CRM (Customer Relationship Management) package which can be accessed by their customers spread across the country through the web. In addition they also have dedicated Tele Assistance Groups for each product/project that provide Technical assistance for resolving operational & maintenance related issues being faced by their customers.The product support and AMC is part of all new Projects with BSNL/MTNL. The ITAC (Integrated Technical Assistance Center) will be integrating all these activities to form a unified support organization in line with a call center concept. The ITAC consists of a Digital PABX of Ericsson make with Automatic Call Distribution facility and Digital Phones for each workstation. BSNL/MTNL will be provided with a unique calling number for the ITAC. Once the call lands on the PABX, it will first be routed to one of the extensions in the Welcome Center. Simultaneously a pop up window will appear on the Welcome Center Operator Workstation. The Welcome Center Operator will book a docket containing details of the site, broad nature of the problem and then transfer the call along with the docket to the support engineer of the corresponding project for further action.

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Q: What

I learned from Industrial Training/Industry?

Since the target/company that I have planned my Industrial training to was a company which operates in my favourite field of work, I was in a full of confidence to go through the training and enjoy it the most. The training was started on 2-05-2011 with some introductory on the company.On the following days, I got familiarized with some most newer technologised processes like wave soldering,Surface moulding operations,etc in PCB section.One of the interesting newer term that I learned about was Leased Line Network,which has a wide range of applications in requirement for networks with full-time connectivity. Subscriber Identity modules and their working was most passionating inventory as I feel.One of the executive from ITI gave us a brief idea on mini OS and file system format used in those modules. More over,I was abe to catch up an overall outlook of a production oriented company and its essential departments for a feasible working and better turn over.

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CONCLUSION

The opportunity to work/familiarize with almost all of the industrial processes that are being conducted in a company under electronic/telecom industry was the most valuable thing that I got after all. As I believe,I made it more useful by utilizing this opportunity to clarify almost all of the doubts and by making my mind to be interesting on every new info that I was about to get through this training.

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