OUTPUT
FUNCTION TABLE
(each driver)
H = high-level, L = low-level
X = irrelevant
Z = high-impedance (off)
SLRS007B NOVEMBER 1986 REVISED NOVEMBER 1995
2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
logic symbol
logic diagram
EN
EN
EN
EN
4A
3, 4EN
3A
2A
1,2EN
1A
15
9
10
7
1
2
4Y
3Y
2Y
1Y
14
11
6
3
4A
3, 4EN
3A
2A
1, 2EN
1A
15
9
10
7
1
2
4Y
3Y
2Y
1Y
14
11
6
3
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to network GND.
2. For operation above 25C free-air temperature, derate linearly at the rate of 16.6 mW/C. To avoid exceeding the design maximum
virtual junction temperature, these ratings should not be exceeded. Due to variations in individual device electrical characteristics
and thermal resistance, the built-in thermal overload protection can be activated at power levels slightly above or below the rated
dissipation.
recommended operating conditions
MIN MAX UNIT
Output supply voltage, V
CC1
4.5 5.5 V
Output supply voltage, V
CC2
4.5 36 V
High-level input voltage, V
IH
2 5.5 V
Low-level input voltage, V
IL
0.3
0.8 V
Operating virtual junction temperature, T
J
40 125 C
Operating free-air temperature, T
A
40 85 C
The algebraic convention, in which the least positive (most negative) limit is designated as minimum, is used in this data sheet for logic voltage
levels.
SN754410
QUADRUPLE HALFH DRIVER
SLRS007B NOVEMBER 1986 REVISED NOVEMBER 1995
4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
electrical characteristics over recommended ranges of supply voltage and free-air temperature
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
MAX UNIT
V
IK
Input clamp voltage I
I
= 12 mA 0.9 1.5 V
I
OH
= 0.5 A V
CC2
1.5 V
CC2
1.1
V
OH
High-level output voltage I
OH
= 1 A V
CC2
2 V V
OH
High-level output voltage
I
OH
= 1 A, T
J
= 25C V
CC2
1.8 V
CC2
1.4
V
I
OL
= 0.5 A 1 1.4
V
OL
Low-level output voltage I
OL
= 1 A 2 V V
OL
Low-level output voltage
I
OL
= 1 A, T
J
= 25C 1.2 1.8
V
V
OKH
High-level output clamp voltage
I
OK
= 0.5 A V
CC2
+1.4 V
CC2
+2
V V
OKH
High-level output clamp voltage
I
OK
= 1 A V
CC2
+1.9 V
CC2
+2.5
V
V
OKL
Low-level output clamp voltage
I
OK
= 0.5 A 1.1 2
V V
OKL
Low-level output clamp voltage
I
OK
= 1 A 1.3 2.5
V
I
OZ(off)
Off-state high-impedance-state
V
O
= V
CC2
500
A I
OZ(off)
Off-state high-impedance-state
output current
V
O
= 0 500
A
I
IH
High-level input current V
I
= 5.5 V 10 A
I
IL
Low-level input current V
I
= 0 10 A
All outputs at high level 38
I
CC1
Output supply current I
O
= 0 All outputs at low level 70 mA I
CC1
Output supply current I
O
= 0
All outputs at high impedance 25
mA
All outputs at high level 33
I
CC2
Output supply current I
O
= 0 All outputs at low level 20 mA I
CC2
Output supply current I
O
= 0
All outputs at high impedance 5
mA
SLRS007B NOVEMBER 1986 REVISED NOVEMBER 1995
6 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
APPLICATION INFORMATION
5 V 24 V
SN754410
Control A
10 k
16
Control B
8
2
1
7
10
9
15
4, 5, 12, 13
14
11
6
3
Motor
V
CC1
GND
V
CC2
2
1
EN
EN
EN
EN
Figure 3. Two-Phase Motor Driver
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN754410NE ACTIVE PDIP NE 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN754410NEE4 ACTIVE PDIP NE 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Jan-2006
Addendum-Page 1
MECHANICAL DATA
MPDI003 OCTOBER 1994
1 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
NE (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE
20 PIN SHOWN
20 16
PINS **
0.780 (19,80)
0.240 (6,10)
0.260 (6,60)
Seating Plane
DIM
0.975 (24,77)
0.914 (23,22)
0.930 (23,62)
1.000 (25,40)
0.260 (6,61)
0.280 (7,11)
Seating Plane
0.010 (0,25) NOM
4040054/ B 04/95
0.310 (7,87)
0.290 (7,37)
0.070 (1,78) MAX
C
10
0.021 (0,533)
0.015 (0,381)
A
11
1
20
0.015 (0,381)
0.021 (0,533)
B
0.200 (5,08) MAX
0.020 (0,51) MIN
0.125 (3,17)
0.155 (3,94)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.155 (3,94)
0.125 (3,17)
M 0.010 (0,25)
M 0.010 (0,25)
0.100 (2,54) 015
0.100 (2,54)
C
B
A
MIN
MAX
MIN
MAX
MIN
MAX
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001 (16 pin only)