LAND PATTERN PARAMETERS FOR BGA (IN METRIC UNITS)

Collapsible / Eutectic Solder Balls

Package PCB Land Dogbone Via Route

Mask Power
Ball Mask on Pad
Ball Dia Land Dia Drill Dia on BGA Plane Trace Space
Pitch BGA Side Size
Side Antipad

0.75 1.50 0.61 0.75 0.34 0.63 0.41 0.86 0.13 0.13
0.75 1.27 0.61 0.75 0.34 0.63 0.41 0.86 0.13 0.13
0.6 1.00 0.45 0.56 0.30 0.61 0.36 0.81 0.13 0.13
0.5 1.00 0.4 0.51 0.30 0.61 0.36 0.81 0.13 0.13
0.5 0.80 0.4 0.51 0.25 0.48 0.00 0.69 0.10 0.10
0.45 1.00 0.35 0.46 0.30 0.61 0.36 0.81 0.13 0.13
0.45 0.80 0.35 0.46 0.25 0.48 0.00 0.69 0.10 0.10
0.45 0.75 0.35 0.46 0.13 Microvia - N/A - -
0.4 0.80 0.3 0.41 0.25 0.48 0.00 0.69 0.10 0.10
0.4 0.75 0.3 0.41 0.13 Microvia - N/A - -
0.4 0.65 0.3 0.41 0.13 Microvia N/A - -
0.3 0.80 0.25 0.36 0.25 0.48 0.00 0.69 0.10 0.10
0.3 0.75 0.25 0.36 0.13 Microvia - N/A - -
0.3 0.65 0.25 0.36 0.13 Microvia - N/A - -
0.3 0.50 0.25 0.36 0.13 Microvia - N/A - -

NOTE NSMD Land Patterns are recommended.

Dimensions in millimeters (mm)
Micro Via in pad (0.005-0.006") will be required in pads with higher circuit densities
Via in pad is not recommended if the component pitch allows a dogbone microvia with 0.005" minimum pad to
S)

Route
Number
of
Route
Channe
ls
2
2
1
1
1
1
1
-
1
-
-
1
-
-
-

with 0.005" minimum pad to pad spacing

 Land Pattern Parameters for BGA
Collapsible/Eutectic Solder Balls
Package PCB Land DogBone Via Route
No. of
Mask on Mask on Pwr Route
Land BGA BGA Plane Channel
Ball Dia. Ball Pitch Dia. side Drill Dia. Pad Size side Antipad Trace Space s
0.75 1.50 0.61 0.75 0.34 0.63 0.41 0.86 0.13 0.13 2
0.75 1.27 0.61 0.75 0.34 0.63 0.41 0.86 0.13 0.13 2
0.60 1.00 0.45 0.56 0.30 0.61 0.36 0.81 0.13 0.13 1
0.50 1.00 0.40 0.51 0.30 0.61 0.36 0.81 0.13 0.13 1
0.50 0.80 0.40 0.51 0.25 0.48 0.00 0.69 0.10 0.10 1
0.45 1.00 0.35 0.46 0.30 0.61 0.36 0.81 0.13 0.13 1
0.45 0.80 0.35 0.46 0.25 0.48 0.00 0.69 0.10 0.10 1
0.45 0.75 0.35 0.46 0.13 * Micro via - N/A - - -
0.40 0.80 0.30 0.41 0.25 0.48 0.00 0.69 0.10 0.10 1
0.40 0.75 0.30 0.41 0.13 * Micro via - N/A - - -
0.40 0.65 0.30 0.41 0.13 * Micro via - N/A - - -
0.30 0.80 0.25 0.36 0.25 0.48 0.00 0.69 0.10 0.10 1
0.30 0.75 0.25 0.36 0.13 * Micro via - N/A - - -
0.30 0.65 0.25 0.36 0.13 * Micro via - N/A - - -
0.30 0.50 0.25 0.36 0.13 * Micro via - N/A - - -
Notes: NSMD (non-solder masked defined) Land Patterns are recommended.
Dimensions in millimeters (mm).
* Micro via (0.005"-0.006" blind via) in pad will be required with higher circuit densities.
Via in pad is not recommended if the component pitch allows a dog bone micro via with
0.005" minimum pad to pad spacing.
 Land Pattern Parameters for BGA
Collapsible/Eutectic Solder Balls
Package PCB Land DogBone Via Route
No. of
Mask on Mask on Pwr Route
Land BGA BGA Plane Channel
Ball Dia. Ball Pitch Dia. side Drill Dia. Pad Size side Antipad Trace Space s
0.030 0.059 0.024 0.030 0.013 0.025 0.016 0.034 0.005 0.005 2
0.030 0.050 0.024 0.030 0.013 0.025 0.016 0.034 0.005 0.005 2
0.024 0.039 0.018 0.022 0.012 0.024 0.014 0.032 0.005 0.005 1
0.020 0.039 0.016 0.020 0.012 0.024 0.014 0.032 0.005 0.005 1
0.020 0.031 0.016 0.020 0.010 0.019 0.000 0.027 0.004 0.004 1
0.018 0.039 0.014 0.018 0.012 0.024 0.014 0.032 0.005 0.005 1
0.018 0.031 0.014 0.018 0.010 0.019 0.000 0.027 0.004 0.004 1
0.018 0.030 0.014 0.018 0.005 * Micro via - N/A - - -
0.016 0.031 0.012 0.016 0.010 0.019 0.000 0.027 0.004 0.004 1
0.016 0.030 0.012 0.016 0.005 * Micro via - N/A - - -
0.016 0.026 0.012 0.016 0.005 * Micro via - N/A - - -
0.012 0.031 0.010 0.014 0.010 0.019 0.000 0.027 0.004 0.004 1
0.012 0.030 0.010 0.014 0.005 * Micro via - N/A - - -
0.012 0.026 0.010 0.014 0.005 * Micro via - N/A - - -
0.012 0.020 0.010 0.014 0.005 * Micro via - N/A - - -
Notes: NSMD (non-solder masked defined) Land Patterns are recommended.
Dimensions in inches.
* Micro via (0.005"-0.006" blind via) in pad will be required with higher circuit densities.
Via in pad is not recommended if the component pitch allows a dog bone micro via with
0.005" minimum pad to pad spacing.