By ANJALI ANAND
What is a PCB?
A printed circuit board or PCB interconnects electronic components without discrete wires. The Printed Circuit Board (PCB) is the laminate to which all the electronic components are soldered, with one or more layers of etched metal tracks making the connections. The components and connections in the PCB Layout are derived from the circuit diagram, and physically placed and routed by the designer to get the best result.
MANUAL METHODS
2. TAPED ARTWORK METHOD SIZE 2:1 OR 4:1 3. MATERIALS USED Transparent polyester Sheet Black, Blue & Red color Tapes This method of preparing PCB artwork or PCB Design has become obsolete
DISADVANTAGESMANUAL METHOD
1. 2. 3. 4. Time consuming Less accurate (specially in MLB designs) Storage life is less Cannot meet the present day component package densities
Design Technologies
Digital Analog Mixed signals (analog & digital) R.F Using SMT with single side and two side mounting Micro vias/ fine line Buried/ Blind via
Schematic diagram
The schematic diagram is the logical connections between the electronic components Netlist: Looks like .pcb .con .cod2 U1 1 r2 1 U3 5 c1 1
2.The component pitch and no of pins etc 3.Lead diameter 4.Body dimension 5.Any heat sink requirement etc.. 6.Data sheet for any nonstandard components
Component placement
1.Auto placement 2.Manual placement The following points shall be considered for component placement 1.Component with nearest connections 2.Preferably mount all ICs in same orientation 3.Provide sufficient free space on the board edge for card-guides/handles
Component Placement
4.Distribute the components for uniform package density over the entire board 5.Keep the components accessible for easy replacement 6.Keep heat sensitive components away from heat producing components
Routing
1.Auto routing 2.Manual routing The following design rules/assignments are to be defined before routing 1.Minimum conductor width for signals,power ground etc.. 2.Minimum conductor spacing
Routing
3.Pad size for all components 4.Minimum drill size 5.Minimum via/PTH size with drill size 6.No. of layers 7.Routing of critical signals 8.Board edge clearance
Post processing
The following activities are done in post processing after routing 1.Smoothing 2.Mitering 3.DRC checking 4.Addition of polarity marking 5.Addition of copper marks for board circuiting
Post Processing
6.Layer no indication 7.Addition of skirting on power plane layers 8.Addition of registration marks 9.Add board dimension & layer identification for each layer 10.Generate spool/plot file called as Gerber file in RS-274X format for each layer 11.Generate N.C drill file in Excellon format for drilling.
Photo plotting
The process of converting/imaging a gerber file on to a film is photo plotting the following types of plotters are available for photo plotting 1.Vector photo plotters 2.Laser photo plotters 3.Direct write plotters 4.Laser direct imaging (LDI)
In a drum type laser photo plotter, the drum will rotate at a low speed of about 60 rpm, the film is loaded on to the drum automatically and is held securely by vacuum. A laser light source moves along the drum rotation and the image created by CAD / CAM software called as GERBER file is reproduced on the film
Developing
After exposure of the film , the developing is performed in a four chambered conveyorised developer that includes developer, fixer , water rinse and drier
CAM
The image files often called as gerber files along with NC drill file received from CAD are manipulated and edited to create the Gerber , NC drill and route file
CAM
CAM also perform the following DRC check Copper area calculation Netlist for BBT Gerber , drill and route file generation Create Autocad DXF file for fabrication drawing Removal of unconnected pads in inner layer etc
Fabrication of PCBs
Dr. T.S. Krishna Ram
Blanking Scrub cleaning Printing 1. Screen 2. Photo Etching Drilling Solder coating 1. Roller Tinning, 2. HAL Cutting Inspection Despatch
DSB
contd..
Etching TIN stripping Inspection Solder Masking Hot Air Levelling Cutting final BBT (Bare Board Testing Flying Probe) Inspection Despatch
Component Division
Welcome to the presentation on Central PCB facility
Our mission
Our Commitment
Brief profile
Production started : 1972 Quality approval : ISO 9001:2000 Membership : IPC (US) IPCA (India) Capacity / Annum : 1000 sqmtr Plant Area : 2000 sqmtr
Specifications Min. conductor width : 8mils / 0.2mm Min. Conductor spacing : 8mils / 0.2mm Min. plated hole size : 12mils / 0.4mm Max. board size : 400mm x 500mm Max. no. of layers : 8 Max. outer layer Cu. Thickness : 2oz. Max. inner layer Cu. Thickness :2oz. Board thickness tolerance : +/- 10%
Technical Capability
Technical capability
Available finish :
HAL, Electroless Nickel & Gold (ENIG) plating for SMT/SMD, BGA, TSOP etc Liquid Photo imageable soldermask (PILSM), Soldermask on Bare copper (SMOBC) White
Laminates:
Equipments
We are in the process of continuous investment in plant and machinery to meet the ever increasing demands of quality and volume The following slides shows our equipments to ensure quality
Direct Metalization
Pre cleaning Swill Conductive graphite coating Fixing Drying chamber Inspection Microetch Anti tornish drying
Developer
Plating
Pattern plating of copper and tin on the printed pattern and inside the holes
Etching
Solder Masking
Scrubber Screen printer UV Exposer Tunnel Oven
Electrical Testing of bare PCBs for shorts and opens by using gerber Data
END OF PRESENTATION
THANK YOU.