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Hot Embossing Microfabrication

Hot Embossing is a technique of imprinting microstructures on a substrate (polymer) using a master mold (silicon tool).

Steps in Hot Embossing

Heating Silicon & Polymer above glass transition temperature (Tg). Applying load by pressing the silicon tool on polymer at certain embossing pressure. Cooling the silicon tool and polymer assembly below Tg and de-embossing the tool.
Heat the substrate and mold to just above Tg of the substrate Apply embossing force on the substrate via the mold under vacuum Cool the substrate and mold to just below Tg De-embossing of the mold and substrate

Master/Mold from FemtoSecond Laser

Advantages of Hot Embossing System


Cost effective Easy manufacturability. Time efficient Fast process. Fabrication of high aspect ratio features. Bio-Compatible surfaces Polymer substrates used. Disposable Low cost for volume production.

Applications of Hot Embossing


BioMEMS/Bio-Sensors Micro-Fluidic Devices

Micro-Optics
m-TAS (Micro Total Analysis Systems)

Hot Embossing v/s Other MEMS Fabrication Processes


Characteristics Number of layers Minimum feature size Aspect ratio Cost Productivity LIGA 1 5 microns 20 High Moderate Surface MicroHot machining Embossing 3-5 5 microns N/A Moderate Low 1 1 micron 10 Low High

Residual Stress

Very Low

High

Low

Product Comparison
Process Parameters Existing Systems Our System

Jenoptik
Maximum Substrate Size Embossing Force Heating Time Cooling Time 6" < 200kN

EV group
8" 40kN 8" 0 - 200kN ~ 3 minutes ~ 2 minutes

< 7 minutes 6 minutes < 7 minutes 5 minutes

Schematic Representation of Hot Embossing Setup

Hot Embossing Conceptual Solid Models

Heating Subsystem: Thermal Analysis

Heating block dimensions and number of cartridges found by a parametric study. 53 heating cartridges (1 kW, 1/2, 10 long) on each heating block of 10 (L) x 10.5 (B) x 4 (H).
Parametric study to determine heating block thickness Parametric study to determine number of cartridges

Heating Subsystem: Thermal Analysis (Cont..)

Appropriate zone configuration of heating cartridges for


optimal heating time, prevention of hot spots, and uniform heating on mold and substrate surfaces.

5 heating zones per heating block having different heating power/heat flux.

Heating Subsystem: Thermal Analysis (Cont..)

Zone Configuration obtained using iterative transient FEM thermal analysis in ANSYS. Transient behavior of heating cartridges also taken into account.

Forcing Subsystem: Structural Analysis


Forcing System used to provide embossing force. Forcing provided by a Dual Column Floor Mounted Frame material testing system by Instron Corporation model 5800. Thermal solution incorporated for FEM structural analysis.

Material modeling incorporates Youngs modulus and Poissons ratio variation with temperature.

Forcing Subsystem: Structural Analysis (Cont..)

1/4th model used for finite element analysis due to symmetry.


Displacement Profile at the Mold Surface

5
Displacement (Microns)

0 -5 0 -10 -15 -20 -25 -30 Width (Inches) 1 2 3 4 5 6

Displacement contour plot from structural analysis

Cooling Subsystem

15 Ton (52.76 kW) chiller and Temperature Controller used to cool the system within 2 minutes. Cooling plates divided into 5 zones (5 inputs, 5 outputs) to obtain

uniform temperature distribution on the mold and substrate surfaces. optimize cooling time.

Manifolds and flow-meters used to evenly distribute the cooling oil into the cooling plates.

Mini-Vacuum Chamber

Mini vacuum chamber used to provide a clean and moisture free environment during embossing. Mini vacuum chamber can accommodate an 8 substrate.

Control Subsystem

Compact Fieldpoint system and LabVIEW by National Instruments used for data acquisition and control of the main system and individual sub-system.

Control Subsystem (Cont..)

LabVIEW is used to:

Monitor

the chiller set-points, the temperature across the master and the substrate, the pressure in the vacuum chamber. the motion (displacement and velocity) of the embossing machine, the flow of the cooling oil through the cooling block, the current through the heater cartridges relief valve of the vacuum chamber.

Control

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