ZNO THIN FILM DEPOSITION USING MAGNETRON SPUTTERING

Overview
Thin film Sputtering Zinc Oxide thin film

Thin film
Layer of material on a substrate less than about one micron

Properties of Thin film

Lower in density (compared to bulk material) Under stress Different defect structures from bulk Strongly influenced by surface and interface effects

Steps in Thin film Growth

Emission of Particle from the source Transport of the particle to the substrate Condensation of particles on the substrate
Impinging material

Desorption Bulk Diffusion

Thin film Deposition Process

Source

Solid Liquid Vapor Gas

Transport

Vacuum Fluid Plasma

Deposition

Substrate condition Reactivity of source material Energy input

1. Source
Physical Vapor Deposition Solid material need to be vaporized to transport them into substrate This can be done by heat or energetic beam of
Electrons (e-beam evaporation) Photons (Laser ablation) Positive ions (Sputtering)

Chemical Vapor Deposition Source materials

Gases Evaporating liquids Chemically gasified solid

2. Transport
Uniformity of arrival rate over the surface area Factors affecting uniformity
High vacuum Lowers melting point Maintains purity Increases mean free path of particles Geometry Fluid collisions Gas flow pattern Diffusion of source molecules through other gases

present

3. Deposition
Substrate surface condition
Roughness Level of contamination Degree of chemical bonding with arriving material

Reactivity of the arriving material

Probability of arriving material reacting with the

surface and becoming incorporated into the film

Energy input
Substrate energy Photons in Laser assisted deposition Positive ion beams

Types of Thin film

High Quality Thin film Slow deposition rate
High vacuum High substrate temperature Single crystalline

Low Quality Thin film High deposition rate

Low vacuum Low substrate temperature Poly crystalline

Applications of Thin film

Thin film Property Category Optical Typical Applications Reflective/antireflective coatings Decorative coatings Memory discs Wave guide Insulation Conduction Semiconductor devices Piezo-electric devices Memory discs Spintronics Barriers to diffusion/alloying Protection against oxidation/corrosion Gas/Liquid sensors Wear-resistant coatings Hardness Adhesion Barrier layers Heat sinks

Electrical

Magnetic Chemical

Mechanical

Thermal

Zinc Oxide Thin films

II-IV compound semiconductor Band gap 3.4 eV Crystal structure Hexagonal
a=0.325 nm b=0.521 nm

Applications

Thin film transistors UV light emitters Chemical sensors Piezo electric devices Sprintronics

Synthesis
Vapor Transport Synthesis
Zno & Oxygen Decomposition of ZnO Heating Zn powder under Oxygen flow

Indirect Method (Organometallic Vapor Phase

Epitaxy)
Di-ethyl Zinc & Oxygen

Carbothermal Method
ZnO & Graphite

Sputtering

Ion impact setup a series of collisions between the atoms of the target Which leads to ejection of atoms from the target called sputtering

Sputter Yield
Sputter yield (S) =
Ejected atoms or molecules Incident ion

S values are typically in the range of 0.01 and 4 and increase with the mass of metals and energy of the sputtering gas.