MEMS AND NANOTECHNOLOGY

PRESENTED BY

K.S.N.SANDEEP
M.RAMPRASAD M.SIDDHARTHA

CONTENTS:
Introduction
MEMS & NANOTECHOLOGY
General methods of FABRICATION of MEMS Devices BASIC PROCESSES

FUTURE APPLICATIONS
ADVANTAGES

Conclusion!

INTRODUCTION :

MEMS is an enabling technology allowing the development of smart products, augmenting the computational ability of microelectronics with the perception and control capabilities of microsensors and microactuators and expanding the space of possible designs and applications. In this paper we have discussed some of the fabrication techniques and packaging. Some of the obstacles preventing its wider adoption are: Limited Options, Fabrication and Packaging. The MEMS and Nanotechnology Exchange provides services that can help with some of these problems .

What is MEMS Technology ?

Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. While the electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micromechanical components are fabricated using compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices. MEMS promises to revolutionize nearly every product category by bringing together silicon-based microelectronics with micromachining technology, making possible the realization of complete systems-on-a-chip.

MEMS and ICs: two of a kind

MEMS microstructures are manufactured in batch methodologies similar to computer microchips. The photolithographic techniques that mass-produce millions of complex microchips can also be used simultaneously to develop and produce mechanical sensors and actuators integrated with electronic circuitry. Most MEMS devices are built on wafers of silicon, adopting micromachining technologies from integrated circuit (IC) manufacturing and batch fabrication techniques.

The fabrication process is usually a structured sequence of THREE BASIC PROCESSES: 1. Deposition Deposition is a key building block in that it is the ability to deposit thin films of material (for subsequent local etching). MEMS deposition technology is classified in two groups: Depositions resulting from chemical reactions: chemical vapor deposition, electrodeposition, epitaxy, and themal oxidation. Depositions resulting from physical reaction: physical vapor deposition, casting. The material deposited is physically moved on to the substrate (a chemical byproduct is not created).

2. Etching In order to form a functional MEMS structure on a substrate it is necessary to etch the thin films previously deposited and/or the substrate itself. In general, there are two classes of etching processes: Wet etchng: the material is dissolved when immersed in a chemical solution Dry etching: the material is sputtered or dissolved using reactive ions or a vapor phase etchant.
3. Lithography Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive material by selective exposure to a radiation source such as light. When a photosensitive material is selectively exposed to radiation (e.g. by masking some of the radiation), the radiation pattern on the material is transferred to the material exposed (the properties of the exposed and unexposed regions differ).

MEMS Applications:
Automotive: The first high volume application After spending about 25 years in the lab, however, it was the automotive industry which first commercially embraced MEMS devices in the '90's as airbag accelerometers, recognizing the benefits of MEMS devices' small size, relative low cost and high degree of sensitivity . There are many other automotive applications for MEMS either in use now or coming soon, including fuel pressure sensors, air flow sensors, tire pressure sensors with automatic built-in tire pumps, smart sensors for collision avoidance and skid detection, smart suspension for sport utility vehicles to reduce rollover risk, automatic seatbelt restraint and door locking, vehicle security, headlight leveling, and navigation.

MEMS in Wireless : More functionality but more components

Wireless system manufacturers compete to add more functionality to equipment. A 3G smart phone, PDA, or base station, for example, will require the functionality of as many as five radios for TDMA, CDMA, 3G, Bluetooth and GSM operation.

Towards a single-chip RF circuit

A solution with tighter and cost-effective integration is clearly needed. Integrating MEMS devices directly on the RF chip itself or within a module, can enable the replacement of numerous discrete components while offering such competitive benefits as higher performance and reliability, smaller form factors, and lower cost as a result of high-volume, high-yield IC-compatible processes.

Higher performance, reliability, lower cost per unit

Higher speed and reliability are other likely improvements. Having components onchip means they are more tightly integrated and can communicate faster with the IC. And because lighter MEMS components are really part of the chip and not attached to the board, they are less likely to be damaged if a phone is dropped.

MEMS and Nanotechnology Applications

BIOTECHNOLOGY :
MEMS and Nanotechnology is enabling new discoveries in science and engineering such as the Polymerase Chain Reaction (PCR) microsystems for DNA amplification and identification, micromachined Scanning Tunneling Microscopes (STMs), biochips for detection of hazardous chemical and biological agents, and microsystems for high-throughput drug screening and selection.

COMMUNICATIONS : High frequency circuits will benefit considerably from the advent of the RF-MEMS technology. Electrical components such as inductors and tunable capacitors can be improved significantly compared to their integrated counterparts if they are made using MEMS and Nanotechnology. Reliability and packaging of RF-MEMS components seem to be the two critical issues that need to be solved before they receive wider acceptance by the market. ACCELEROMETERS : MEMS accelerometers are quickly replacing conventional accelerometers for crash air-bag deployment systems in automobiles. The conventional approach uses several bulky accelerometers made of discrete components mounted in the front of the car with separate electronics near the air-bag; this approach costs over $50 per automobile.

Advantages of MEMS and Nano Manufacturing

MEMS and Nanotechnology are extremely diverse technologies that could significantly affect every category of commercial and military product.

MEMS and Nanotechnology blurs the distinction between complex mechanical systems and integrated circuit electronics.

CONCLUSION :

Prospects of MEMS and Nanotechnology are discussed.The first thing that matters most is the cost, and then matters the rest of the things. Using MEMS and Nanotechnology, the cost of electronic things and other equipments decreases drastically, because of its very led equipment, light in weight and way of manufacture. So these devices are expected to be more used in practice in the future.