WORKSHOP 3

FREE CONVECTION FROM PRINTED CIRCUIT BOARD

NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Problem Description

The figure on the next page depicts a printed circuit board (PCB) assembly which has three chip devices mounted on it. Each chip is generating heat at a rate that is consistent with the application of a heat flux of 5.0 W/in**2 over each device surface area. Heat is dissipated by thermal conduction within the chips and underlying board. Free convection to the ambient environment provides the ultimate heat take. The ambient temperature for convection is assumed to be 20.0 C, and a heat transfer coefficient of 0.02 W/(in**2*C) is used to apply convection to the entire assembly surface. Analyze the printed circuit board to determine the device temperature so that they can be compared to manufacturer allowables.

NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Suggested Exercise Steps

1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15.

Create a new database. Specify thermal analysis. Create surfaces for subsequent extrusion. Create solids by extruding surfaces. IsoMesh the parametric geometric solids. Connect elements by equivalencing. Specify materials. Define element properties. Color plot for element properties. Apply heat flux to chips. Apply convection boundary condition. Perform the thermal analysis. Attach the result file. Display the temperature results. Quit MSC.Patran.
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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

Step 1: Create a New Database

Create a new database a. File: New b. Enter free_conv_pcb.db for File name. c. Click Ok.

NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 2: Specify Thermal Analysis

Change the tolerance a. Select Default for Tolerance. b. Select MSC.Nastran for Analysis Code. c. Select Thermal for Analysis Type. d. Click OK.

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 3: Create Surfaces for Subsequent Extrusion

Create the surfaces of printed circuit board and electronic components. a. Geometry: Create/Surface/XYZ. b. Enter <9 6 0> for Vector Coordinates List. c. Enter [0 0 0] for Origin Coordinates List. d. Click Apply. e. Enter <1 1.5 0> for Vector Coordinates List. f. Enter [1 1 0] for Origin Coordinates List. g. Click Apply.

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 3: Create Surfaces for Subsequent Extrusion (Cont.)

Create the surfaces of printed circuit board and electronic components. a. Geometry: Create/Surface/XYZ b. Enter <1 1 0> for Vector Coordinates List. c. Enter [4 4 0] for Origin Coordinates List. d. Click Apply e. Enter <1 1 0> for Vector Coordinates List. f. Enter [5.5 2 0] for Origin Coordinates List. g. Click Apply

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 4: Create Solids by Extruding Surfaces

Create parametric solids by extruding parametric surfaces a. Geometry: Create/Solid/Extrude. b. Click IsoMeshable icon for Solid Type. c. Enter [0 0 0] for Origin of Scale and Rotate. d. Enter <0 0 -0.1> for Translation Vector. e. Deselect Auto Execute. f. Select Surface 1 for Surface List. g. Click Apply. h. Enter [0 0 0] for Origin of Scale and Rotate. i. Enter <0 0 0.2> for Translation Vector. j. Deselect Auto Execute. k. Select Surface 2:4 for Surface List. l. Click Apply.

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation WS3-10

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Step 5: IsoMesh the Parametric Geometric Solids

Create finite elements a. Elements: Create/Mesh/Solid. b. Select Hex for Elem Shape. c. Select IsoMesh for Mesher. d. Select Hex8 for Topology. e. Select Solid 1:4 for Solid List. f. Deselect Automatic Calculation. g. Enter 0.25 for Value of Global Edge Length. h. Click Apply.

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Step 6: Connect Elements by Equivalencing

Equivalence nodes a. Elements: Equivalence/All/ Tolerance Cube. b. Enter 0.005 for Equivalencing Tolerance. c. Click Apply. d. Elements: Verify/Element/ Boundaries. e. Select Free Edges for Display Type. f. Click Apply.

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Step 7: Specify Materials

Specify materials a. Material: Create/Isotropic/Manual Input. b. Enter pcb for Material Name. c. Click Input Properties d. Select Solid properties for Constitutive Model. e. Enter 0.066 for Thermal Conductivity. f. Click OK. g. Click Apply.

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 7: Specify Materials (Cont.)

Specify materials a. Material: Create/Isotropic/Manual Input. b. Enter chip for Material Name. c. Click Input Properties d. Select Solid properties for Constitutive Model. e. Enter 2.24 for Thermal Conductivity. f. Click OK. g. Click Apply.

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Step 8: Define Element Properties

Specify materials a. Properties: Create/3D/Solid. b. Enter pcb for Property Set Name. c. Select Standard Formulation for Option. d. Click Input Properties e. Click in the Material Name box then select pcb under Material Property Sets. f. Click OK. g. Select solid 1 for Select Members. h. Click Add. i. Click Apply.

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 8: Define Element Properties (Cont.)

Define element property for chip a. Properties: Create/3D/Solid. b. Enter chip for Property Set Name. c. Click Input Properties.. d. Click in the Material Name box then select chip under Material Property Sets. e. Click OK. f. Select solid 2:4 for Select Members. g. Click Add h. Click Apply.

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 9: Color Plot for Element Properties

Display color plot corresponding to element properties a. Properties: Show b. Select Material Name for Existing Properties. c. Select Scalar Plot for Display method. d. Select Current Viewport for Group Filter e. Click default_group. f. Click Apply.

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 10: Apply Heat Flux to Chips

Apply heat flux to chips a. Loads/BCs: Create/ Applied Heat/Element Uniform b. Select Normal Fluxes for Option. c. Enter flux for New Set Name. d. Select 3D for Target Element Type. e. Click Input Data f. Select Basic for Form Type. g. Enter 5 for Heat Flux. h. Click OK. i. Click Select Application Region.. j. Continued

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 10: Apply Heat Flux to Chips (Cont.)

Apply heat flux a. Click Geometry for Geometry Filter. b. Select Solid 2.6 3.6 4.6 for Select Solid Faces. See Figure. c. Click Add. d. Click OK. e. Click Apply.

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 11: Apply Convection Boundary Condition

Apply convection boundary condition a. Load/BCs: Create/ Convection/ Element Uniform. b. Select To Ambient for Option. c. Enter conv for New Set Name. d. Select 3D for Target Element Type. e. Click Input Data f. Enter 0.02 for Convection Coefficient. g. Enter 20 for Ambient Temperature. h. Click OK. i. Click Select Application Region.. j. Select Geometry for Geometry Filter. k. Select Solid 1.6 for Select Solid Faces. l. Click Add. m. Click OK. n. Click Apply.

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NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 12: Perform the Thermal Analysis

a
Perform the analysis a. Analysis: Analyze/Entire Model/Full Run. b. Enter free_conv_pcb for Job Name. c. Click Apply.

NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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Step 13: Attach the Result File

Attach the XDB file a. Analysis: Attach XDB/ Result Entities/ Local. b. Click Select Results File c. Select free_conv_pcb .xdb for File name. d. Click OK. e. Click Apply.

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Step 14: Display the Temperature Results

Display the result a. Results: Create/ Quick Plot. b. Select SC1:DEFAULT, A1:Non for Select Result Case. c. Select Temperatures for Select Fringe Result. d. Click Apply.

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Step 15. Quit MSC.Patran

a
Quit MSC.Patran a. Select File on the Menu Bar and select Quit from the drop down menu

NAS104, Workshop 3, March 2004 Copyright 2004 MSC.Software Corporation

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