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Reliability Modeling and

Optimization of MEMS
Elements in Various
Devices Using Multi-Scale
Concepts
Rohit Pathak
Satyadhar Joshi
Satyadhar_joshi@yahoo.com
xrohit@hotmail.com
(Research Paper Available at IEEE Xplore
Kindly cite the PPT as per the IEEE copyright)
Introduction and Importance of
this Work
• The classical approaches play an important role in
Micro Electro Mechanical Systems (MEMS)
technology where the analysis is based on
abstraction level theories and no comprehensive
explanation of nano scale phenomenon are
proposed.
• It is proposed that High Performance Computing
(HPC) if used with multi scale optimization library
then the reliability calculation can be accelerated
and also research in reliability of MEMS
• In this work we have developed library where we
can select the various physics at different level
and then calculated reliability for better accuracy.
In the proposed work, Modeling and Computation
is performed using MATLAB distributed computing
RELIABILITY ANALYSIS OF
MEMS DEVICES AND MULTI-
SCALE MODELING
• ABSTRACTION LAYERS IN MULTI-SCALE
SETUP
• Abstraction Scale / Properties
• Nano CMOS 30-100nm Capacitance in
CMOS
• RF MEMS 100-500nm Properties of
antenna
• CNT 10-30 nm Conductance
• Mechanical modeling 100-500nm,
Electrical Modeling, Macro level
MEMS based system and
identification for Reliability
analysis
Outputs V

Support Inputs (Fuel) Boundary


Condition Intermitte Extended
s nt Failure Failure
MEMS
Fuel
Cells MEMS Complete Partial
membra Failure Failure
ne

MEMS Other Sudden Gradual


anodes System Failure Failure

Catastrop Sudden Gradual


hic Failure Failure
External
Outputs Failure
Threats
(V)
Degraded
Failure
Modeling of Redundant
array
use("mumps.net")
• CODE FROM use("stdlib.net")
beamLength = 80u
THE ancw=9u
DEVELOPED ancl=9u gap=9u prbl=4u
junc = { node{} }
LIBRARY for i=0,5 do
FOR junc[1] = node{0, i*gap, 0}
junc[2] = node{}
REDUNDANT junc[3] = node{}
MEMS anchor { junc[1] ; material=p1, l=ancl,
w=ancw, h=ancw }
ARRAY FOR beam3d { junc[1], junc[2] ; material=p1,
l=beamLength, w=2u }
IMPROVING f3d { junc[2] ; F=20u, oz=90 }
RELIABILITY beam3d { junc[2], junc[3] ; material=p1,
l=prbl, w=2u, oz=90 }
end
RELIABILITY CALCULATIONS
PERFORMED IN THIS ANALYSIS
 λ e− λ t fo r>t 0 , 0> λ
f ( t )= 
 0 o th e rw ise
−9 t
z (t ) = e 11

Diagram for speed-up vs.


configuration.
Conclusion
• Novel way to approach reliability calculations
and shown how properties at different levels
and types needs to be linked up in a multi
scale analysis where HPC can benefit
reliability calculations for MEMS devices.
• We have used basic program in from SUGAR
which can be expanded as per the needs.
• We have assumed some of the parameters in a
multi scale setup hence the reliability and
calculated results on an HPC setup.
• Merging of multi scale properties to calculate
the exact failure phenomenon and then with
MATLAB remains a major area to work on