Ultrasonic Grinding
Vishnu Prasad K
No:17
S2, M Tech, Production Engineering
Mechanical Department
Overview
Introduction
Micro holes and Existing Techniques of production
Drilling by Grinding
Grinding Tool and Fabrication
Experimental Setup and Machine Specification
Experiment and Results: 30m
Experiment and Results: 20m
A.WITHOUT HELICAL FEEDING
Introduction
Micro-hole
Holes with dimensions
most conveniently
described in micrometers
Used in:
Micro-nozzles
Micro-electro-mechanical
systems (MEMS) Accelerometer
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Existing Techniques
on Hard and Brittle Materials
Laser Processing
Low Dimensional Accuracy
High Surface Roughness
Chemical Etching
High Running Cost
Produces Toxic Chemicals
Ultrasonic Machining
Low Material Removal Rate
Drilling by Grinding
Widely Used for Hard Brittle
Materials
Finishing-Plane and Curved
Surfaces, Also Drilling
Limited to sub-millimeter
Dimensions
Difficulty in Tool Making for
micro dimensions
Tool Breakage Due to
Grinding Forces
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Drilling by Grinding
High Dimensional Accuracy
Tool Used
Cemented Tungsten
Carbide
Fabricated by EDM
Ultrasonic Vibration
Reduce Grinding Force
Results in Drilling
capability down to 10m
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Grinding Tool
Referred as Micro-pins
Tool Made of Cemented
Tungsten Carbide
Tool Fabrication
Generally Micro Tools are Produced by
Electroplating Abrasive-grains to Shank
Highly Costly-Shank making and Electroplating
Required
Difficult to Electroplate with Ultrafine Grains for
Micro Tools with Constant Pitch and Protrusion
Height of Grains
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Tool Fabrication
Tool Shank Machined by
Electron Discharge Machining
Called Wire-Electro Discharge
Grinding (WEDG)
Wire Tool Electrode is Used for
Machining
Wire is Guided so as to reduce
Vibrations
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Tool Fabrication
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Tool Fabrication
Cemented Tungsten Carbide Pin
Placed in a mandrel and Clamped
Mandrel Placed on the V shaped
Bearing
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Machine Spec
Machine Designed for Micro-Ultrasonic Machining
ASWU-1, Creative Tech Corp
Machine Spec
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Ultrasonic Grinding
Either Helical Feed or Axial Feed
Helical Feed Provided to Avoid
Ground Chip Clogging
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20
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Length: 32m
23 Planetary Motion Radius: 2.5m
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Conclusion
In drilling 30-m-diameter holes with helical feeding, the
drilled holes had a taper and the grinding-force-reducing
effect was not observed.
The grinding-force-reducing effect of helical feeding was
observed in the drilling of 20-m-diameter holes. However,
it did not help prevent tool breakage, and the drilled holes
were tapered. These results suggest that helical feeding is
unnecessary.
Tools with a lower aspect ratio can be used without helical
feeding, leading to the improvement in tool breakage
resistance that enables the use of smaller-diameter tools.
As a result, the drilling of a micro hole 10 m in diameter
was successfully achieved. This is the smallest-diameter
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hole drilled by grinding, to the best of knowledge.
References
Kai Egashira, Ryokei Kumagai, Ryohei Okina, Keishi
Yamaguchi, Minoru Ota. Drilling of micro holes down to
10m in diameter using ultrasonic grinding. Precision
Engineering 2014
Egashira K, Mizutani K. Ultrasonic vibration drilling of
microholes in glass, CIRP Annals, 2002;51(1):339342
Masuzawa T, Fujino M, Kobayashi K. Wire electrodischarge grinding for micro-machining, CIRP Annals,
1985;34(1):431434
Egashira K, Mizutani K. Micro-drilling of monocrystalline
silicon using a cutting tool, Precision Engineering,
2002;26(3):263268
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THANK YOU
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