Materials Science
and Engineering
AN INTEGRATED APPROACH
Fourth Edition
Chapter 1
Introduction
Copyright 2012 by John Wiley & Sons, Inc. All rights reserved.
Chapter 1 -
CHEN313: Introduction to
Materials Science & Engineering
Course Objective...
Introduce fundamental concepts in Materials
Science & Engineering
Chapter 1 - 3
Chapter 1 -
Chapter 1 -
COURSE MATERIALS
(with WileyPLUS)
Textbook:
WileyPLUS for Fundamentals of Materials Science and Engineering,
W.D. Callister, Jr. and D.G. Rethwisch, 4th edition, John Wiley
and Sons, Inc. (2012).
Website: http://www.wileyplus.com/xxxxxxxxxxx
Can be bought online at wileyplus.com for 40% of textbook price
Includes complete online version of textbook
Or comes bundled with textbook at bookstore
$5 more than textbook alone
Homework assignments with instant feedback and hints
Computer graded self-help problems
Hotlinks in homework to supporting text sections
Quizzes
Chapter 1 - 6
WEBSITES
Course Website: See Syllabus in the web page
Chapter 1 - 8
Chapter 1 - 9
Chapter 1 - Introduction
What is materials science?
Structure-properties
Applications
Why should we know about it?
All fields make use of materials
Materials drive our society
Stone Age
Bronze Age
Iron Age
Now?
Silicon Age?
Polymer Age?
Nano age
Chapter 1 - 10
Chapter 1 - 11
Chapter 1 - 13
Hip Implant
Key problems to overcome
fixation agent to hold
acetabular cup
cup lubrication material
femoral stem fixing agent
must avoid any debris in cup
Ball
Acetabular
Cup and Liner
Femoral
Stem
Adapted from chapter-opening
photograph, Chapter 22, Callister 7e.
Chapter 1 - 14
Chapter 1 - 15
Hardness (BHN)
600
500
400
(c)
(a)
(b)
4 m
300
200
30 m
30 m
100
0.01 0.1
30 m
1
10 100 1000
Cooling Rate (C/s)
Types of Materials
Metals:
Strong, ductile
High thermal & electrical conductivity
Opaque, reflective.
Chapter 1 - 17
2. Properties
3. Material
Chapter 1 - 18
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Chapter 1 -
Chapter 1 -
Chapter 1 -
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Chapter 1 -
ELECTRICAL
Electrical Resistivity of Copper:
6
(10-8 Ohm-m)
Resistivity,
5
4
3
2
1
0
Cu
2
3. 3
i
t %N
Ni
%
t
Ni
16 a
.
%
t
2
a
+
2
1
.
Cu
+1
u
C
d
e
i
rm
o
N
f
e
%
t
d
a
2
1
.
+1
u
C
Cu
e
r
Pu
-200
-100
T (C)
THERMAL
-- Silica fiber insulation
offers low heat conduction.
Adapted from chapteropening photograph,
Chapter 17, Callister &
Rethwisch 3e. (Courtesy
of Lockheed
Missiles and Space
Company, Inc.)
100 m
Thermal Conductivity
of Copper:
-- It decreases when
you add zinc!
Thermal Conductivity
(W/m-K)
Adapted from
Fig. 19.4W, Callister
6e. (Courtesy of
Lockheed Aerospace
Ceramics Systems,
Sunnyvale, CA)
(Note: "W" denotes fig.
is on CD-ROM.)
400
300
200
100
0
0
10 20 30 40
Composition (wt% Zinc)
MAGNETIC
Magnetic Storage:
vs. Composition:
-- Adding 3 atomic % Si
makes Fe a better
recording medium!
Magnetization
-- Recording medium
is magnetized by
recording head.
Magnetic Permeability
Fe+3%Si
Fe
Magnetic Field
Fig. 18.23, Callister & Rethwisch 4e.
OPTICAL
Transmittance:
-- Aluminum oxide may be transparent, translucent, or
opaque depending on the materials structure (i.e.,
single crystal vs. polycrystal, and degree of porosity).
single crystal
polycrystal:
no porosity
polycrystal:
some porosity
Chapter 1 -
DETERIORATIVE
Stress & Saltwater...
-- causes cracks!
10 -8
as-is
held at
160C for 1 hr
before testing
10 -10
increasing load
Chapter 1 - 32
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