Introduction of Thermal

GGT/RE Environment Test

Team

Primary Mechanic of Heat

Transfer
Thermal energy transport:
cause by temperature difference, high T -> low T

Conduction
Heat transferring by solid medium

Convection
Transferring energy between solid surface and fluid
Mass transport
Natural (free) convection
Forced convection

Radiation
Heat transferring by electromagnetic waves

Conduction
Fouriers Law
Q= -KA T/L
Q: heat transfer rate
A: cross-sectional area of heat flux
T/L: temperature gradient
K: thermal conductivity (W/mk)
Ex. Al = 230
Cu = 380
Mylar = 1.8

Convection
Newtonian cooling Law
Qc = hc As (Ts Ta)
Qc: convection heat transfer rate
As: surface area
Ts: surface temperature of solid
Ta: tmperature of ambient
hc: heat transfer coefficient, f(flow type,
body geometry, physical property,
temperature, velocity, viscosity)

Natural convection & Forced convction

hc of air, natural convection: 0.0015~0.015 W/in2
forced convection: 0.015~0.15 W/in2

Radiation
Qa = AF1-2( Ts4 Ta4)
Qa: radiation heat transfer rate
: emissivity, 0 1
: Stefan-Boltzmann constant
A: surface area
F1-2: view factor
Ts: temperature of body s
Ta: temperature of body a

Thermal Resistance
R=V/I
V: voltage = T: temperature difference
I: current = Q: heat

Conduction
Rk = L/KAk

Convection
Rs = 1 / hcAs

Radiation
Ra = (Ts Ta) /AF1-2( Ts4 Ta4)

Basic Concepts for NB Thermal

Design
Thermal Design Target
Thermal design must meet thermal spec. of CPU,
all key components (HDD, FDD, CD-ROM,
PCMCIA), and all IC chips (Chipset, VGA, RAM,
PCMCIA), and all IC chips (Chipset, VGA, RAM,
Audio) in each user conditions

Thermal Resistance
j-a = (Tj Ta) / Pcpu
j-a : CPU junction to ambient thermal resistance
Tj: CPU junction temperature
Ta: ambient temperature
Pcpu: CPU power

Basic Concepts for NB Thermal

Design
System Thermal Coupling effect
j-a = (Tj Ta Tsys) / Pcpu
Tsys: system temperature = Psys *
= Pi*i, (i: DRAM, Chipset, HDD, FDD, CDROM)
R: thermal coupling factor between Pcpu and Psys

Tj: CPU spec. for Intel: 100

Ta: OEM spec., 35
j-a, Tsys: OEM design dependent, Tsys =
10~15

Basic Concepts for NB Thermal

Design
Thermal Solutions

Passive thermal solution

Active thermal solution
Hybrid thermal solution

RHE

Remote Heat Exchanger

Basic Concepts for NB Thermal

Design
Characteristic of a good passive
components

Spreader plate connected to CPU should be as

large as possible
Temperature variation on spreader plate should be
minimal

Characteristic of a good active component

Air inlet and outlet should be clearly defined

Length of air passage through NB should be small
to keep pressure drop low, flow rate high
Possible reduce noise level of the fan
Design must be capable of venting a portion of hot
air from NB inside

Important Components For Thermal Desig

Heat Sink
Heat Pipe
Fan
TIM ( Thermal Interface Material)
Combination of aforementioned
components

Heat Sink
Material
Material
: A1050
K(W/mk)
: 230
Specific gravity: 2.71

A6063
ADC12
C1100
210
192
384
2.69 2.70
8.92

Production
Die-casting
Extruded

Q = -KAT/L
Fin, Q = hAT
Die-casting, extrusion, folder, stack, soldering fins

Heat Pipe
Basic configuration and characteristic
Basic specification
Material: copper
Working fluid: pure water
Standard working temperature: 0~100
Size: 3, 4, 5, 6, 8

Typical heat pipe wick structures

Fiber, mesh, groove, powder

Typical modification of heat pipe

Flattening
Bending

Heat Plate

Fan
Structure

Rotator: magnetic blade, shaft

Stator: bearing, wire, stainless plate
Control circuit

Theory
Type

Axial fan
Blower fan

Selection

Total cooling requirement

Q = Cp * m * T = * Cp * CFM * T

Total system resistance / system characteristic curve

System operating point

Fan
Parallel and series operation
Acoustical noise level (dB)
To achieve low noise should consider
System impedance
Flow disturbance
Fan speed and size
Temperature rise
Vibration
Voltage variation
Design considerations

TIM
Thermal Interface Material

To reduce contact thermal resistance

between CPU die and thermal module

Important of TIM
Material

Various material: silicon-base, carbon

Non-phase change
Phase change

Pressure effect

Pressure spec. on CPU spec. 100psi

Thermal Design Procedure

Clarify Thermal Specification
DesignThermal
Thermal Solution
Design
Solution
Analytic Approach
Evaluate

Solution Performance
Experiment Approach

Numerical Approach

Fail

Verify
Pass

Evaluate heat generation

Allowable thermal resistance
Allowable design space

Evaluate Chassis heat dissipation

Evaluate heat exchange area
Evaluate fan flow rate

Inspect Structure.Production method.Cost

Recommend Thermal Solution
Thermal Test in Working Sample
Examine and Modify
Thermal Solution
Fail

Verify Overall System

Meeting Thermal Specification

Pass
Thermal Design OK!

Thermal Design Guides

Design guide for thermal
(Ver. 0.2)

Thank You!


( )

fiber

Mes
h

groove

Powder : Heat Pipe

,

Hall IC N.S.
,

S
N
N

Static pressure
Fan
curve

System
resistance
curve
System
operating
point

CFM(ft3/min
)

1. Thermal Module
1) Reserve space for thermal
module (Intel recommendation)
Coppermine:
70*50*11.5mm
Tualatin:
75*55*11.5mm
Northwood:
85*60*19mm

2) It should reserve a gap between

thermal module and top cover
(keyboard cover)

1. Thermal Module
3) The gap between thermal module
exit and NB case vent should be
sealed well so the hot air couldnt
flow back to system. If leave an
open gap along air flow path, it
will affect thermal efficiency and
acoustic noise.

1. Thermal Module
4) The thermal module and CPU
should contact well.

a)

b)

The max pressure of the thermal

module on CPU is 100psi. Within
SPEC, efficiency of thermal module
increases with pressure.
Its better to fix module on M/B by
four screws (avoiding three screws)
and spring design.

2. Fan
1) Fan inlet constraints: gap 3~5mm
is needed.

3mm ~ 80% performance

4mm ~ 90% performance
5mm ~ 100% performance

2) Configuration of air inlet & outlet

vents can make dramatically flow

resistance; therefore high open
rate is better.

2. Fan
3) Dont place blocks (large ICs or

connector) near or below the fan

to affect airflow induced into fan.

4) It is better for fixing fan by

rubber instead of metal screws to

avoid vibration.

2. Fan
5) The fan space design has some
restrictions.
a)

b)

c)

For efficiency and acoustic, the gap

between fins and fan blade should
keep a distance of L= 5 ~ 10 mm.
The distance W is better to keep as
large as possible for good efficiency.
Fan blade should close to fan tongue
for better efficiency.

3. PCMCIA Card
1) Dont place PCMCIA on lower side of

M/B, near hotter ICs, and stacked up

key components (HDD, CD-ROM,
DVD, FDD).
2) If it needs to place PCMCIA near heat
source, it is necessary to induce
airflow to cool it.
(Ex. For J2I++, L1R, it is removed metal plate on
PCMCIA slot and makes holes above PCMCIA if
there is an Al plate upon it. By this way, air can
flow through this area to cool PCMCIA card.)

3. PCMCIA Card
3) Due to aforementioned solution,
PCMCIA should place near fan in
order to induce airflow to cool.

4. Key Components
1) Because HDD, CD-ROM, FDD thermal
SPCE is low, these key components
need to be placed in colder region.
(Avoid placing them in the middle of the
system and upon M/B with hot ICs, and
stacking up each other).

2) Its better to place FDD alone, not to

put on/beneath CD-ROM or HDD.

5. Palm-Rest and Glid Pad

1) It should avoid placing hot
components and ICs below palmrest and glid pad.
2) It should reserve a gap to make a
thermal resistance between palmrest and the hot components or to
add a metal plate for spreading
heat.

6. LCD Inverter
It should reserve a gap between
Inverter and LCD cover to make a
thermal resistance or to add a
metal plate for spreading heat.

7. Bottom case and Dimm

Door
1) It should reserve a gap between IC

chips and bottom case(gap > 3mm is

better).
2) It might have a large Al-plate on
bottom case for spreading heat.
3) M/B has a hole below fan in order to
induce airflow under M/B.
4) Its better to place hotter chips on
upper side of M/B.
5) It should reserve a gap between
Memory chips and dimm door (gape >
1.5mm is better).

8. M/B Layout
1) If theres thermal issue of ICs, it
should reserve space for thermal
solutions
(Ex. Dont place higher components beside these
ICs, so it could put metal plate on ICs in
future)

2) Dont place low temperature spec

ICs and components near hotter
region or high temperature spec ICs
and components.

9. Others
1) Its better to use the thinner or phase
change TIM (thermal interface
material)
Ex. 28W CPU
(phase change)
(phase change)

Powerstrate
T-pcm
T-pcm
(phase change with Al)
T-mate
(non-phase change) Tx
Tx

0.08mm
0.25mm
0.50mm

75
83
86

0.50mm
0.25mm
0.5mm

83
90
96

9. Others
1) Heat pipes on thermal module have

some restrictions
2) The thickness shouldnt be less than
2mm when be made flat.
3) The curve radius should be larger
than triple diameter at least when be
bended.
4) It might need some holes on bottom
case and sidewall of NB in order to
induce airflow to dissipate heat.

3mm ~ 80% performance

4mm ~ 90% performance
5mm ~ 100%
performance

3~5m
m

Fa
n
Air
flow

Bad
design
Fa
n

Blocks

Tongue

L: , Fan
;
,
.

L
W

W: ,

Fan
,
Noise

Pressur
e

Single
fan
Double fan

Pressur
e

Paralle
l

CF
M
Single
fan

Serie
s

Double fan

CF
M

TIM: thermal interface material

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