--MELTING POINT AND BOILING POINT ACROSS PERIOD 2 AND PERIOD

3 ELEMENTS AND THE ENTHALPY OF VAPOURISATION

-ELECTRICAL CONDUCTIVITY
VARIATION OF MELTING AND BOILING POINT AND THE
ENTHALPY OF VAPORISATION

Factors that effect the MP/BP of elements:

The chemical bonding
The structure

Enthalpy of vapourisation:
Heat change when 1 mol of element
is converted from liquid to vapour at
its boiling point.
 CHEMICAL BONDING
The types of chemical bonding:
i. Covalent bond (Strongest bond)

ii. Ionic bond (Moderate)

iii. Metallic bond (Weak)

iv. Van der waals force of attraction (Weakest)

. Element with a strong chemical bond has

the highest melting and boiling point

. MP/BP can be used to measure the

strength of chemical bond to be broken.
STUCTURE
The structure can be defined as the
way the the atoms or molecules are
packed(arranged).

The types of structure:

i. Giant metallic structure.

ii. Giant covalent structure.

iii. Simple molecular structure.

GIANT METALLIC STRUCTURE

Positively charge metal ion is

attracted to the cloud of electrons
These responsible for the bonding
in metals.
Across period 2 and 3, the
increase in the number of electrons
and the nuclear charge will cause
the metallic bond to become
GIANT COVALENT STRUCTURE (MACROMOLECULES)

Molecules with a giant covalent

bond has high MP,BP and the
enthalpy of vapourisation.
It is because more heat is needed
to break the bond in the crystal
lattice structure.
SIMPLE MOLECULAR STRUCTURE

SMS has low MP,BP and enthalpy of

vapourisation.
The covalent bonds within the molecules
are strong.
But the forces of attraction FORMING
THE CRYSTAL are very weak(Van der
waals).
The van der waals forces will increase as
the molecular size increase which then
ELECTRICAL CONDUCTIVITY
Metals:
-Good conductor of electricity
There have delocalised electrons and
will move freely when electric potential
is applied.
The electrical conductivity will slowly
falls as temperature rises.