PCB Training Presentation

PRINTED CIRCUIT BOARD
(PCB) PRODUCTION
PRINTED CIRCUIT BOARD (PCB) PRODUCTION
Production of a Printed Circuit Board
The reason of producing a Printed Circuit Board (PCB) is to achieve

an electronic circuit most economic with clearly arranged
components, easy to handle and with best quality and reliability.
The basis is a copper-plated board. The principle of producing the

board for placing the electronic components is, to cover the copper
at those places where a conductor has to be positioned. The
unwanted copper simply has to be removed in a process with a
corrosive chemicals. The Iron III Chloride (3 )
1. Basic Materials for Printed Circuit Board (PCB)
1.1 Type FR-2
Light brown phenol-resin paper. Thickness mainly 1.5 mm. It

is a low cost basis material. It has some disadvantages in
thermal, electrical and mechanical properties. Not very often
used anymore.
1.2 Type FR-3
Epoxy resin paper with orange like color. It is very common

in use but mainly in consumable electronics.
1.3 Type FR-4
Epoxy resin with glass fiber mats. It is the top quality with very
good thermal, electrical and mechanical properties. It is somewhat
expensive.
1.4 Type CEM-1
It is composite from FR-3 and FR-4

A strip conductor with a width of 1mm has a resistance of
approximately 0.5/m. This means, that this resistance cannot be
neglected when strong current are flowing.
For laboratory purpose a standard size (100 x 160mm) of boards with
different kind of strip conductors are available.
2. Types of Etching Chemicals
2.1 Iron III Chloride ( )
This corrosive material is most commonly used in the corrosive
process of PCB production. It has to be diluted with water. The
way of diluting it has to be seen from the manufacturers
instructions. The best concentration is usually 35% of this acid
in water at a temperature of 45o when applied. Lower
temperature has no impact on quality it only elongates the
process. After the corrosive process the remaining fluid is
contaminated with copper. The disposal of the fluid has to
be carried out with special care in order to avoid
environmental pollution.
2.2 Fine Acid Crystals
To use these crystal is very suitable and it can be

handled without problems. The dilution of 1 liter of
water requires for the best result 230g of these
crystal. Best temperature when applied is 45o . The
solution can be used several times, but it must not be
stored in a sealed container because gas pressure can
burst the container.
2.3 Ammonium Persulfate (NH4)2S2O8
Not very often, because of the disadvantages, that it can be

used only for one time.
2.4 Sodium Persulfate (NaPS)
It has the disadvantage, that the corrosive process is very
slow
2.5 Copper Chloride (CuCl)
It is a corrosive material, composed out of hydro-chloride acid
(HCL) and hydrogen peroxide (H2O2). It is used mainly in
extended production processes.
3. Layout Design of the circuit
3.1 There are several possibilities to transfer of a circuit to

the copper side of the PCB. In any case, the copper
has to be very clean. Cleaning can be done by using
alcohol or simply with emery paper. Any corrosion has
to be avoided, because it will prevent perfect soldering.
It should not be touched directly anymore, because the
oil or dust from the finger can prevent a good etching
process.
3.2 The layout has to be developed in such a way to be

able to transfer it in a 1:1 scale to the board. The
simplest possibility of transferring the layout is, to
draw it with a 1:1 scale in positive application.
Positive means that the PCB has to be seen from
the component side.
3.3 All the component will be oriented on the X or Y axis
if possible.
3.4 Components will be mounted on only one side of the
copper board.
3.5 Maintain minimal spacing for resistor (0.1 to 0.25

inches and above), capacitor (0.1 to 0.5 and above).
3.6 Components which dissipate more than 2w should

not mounted on pc board and should be heat sunk to
chassis.
3.7 Allow 0.002 inch for etching tolerance.
3.8 Conductor path shall be at least 0.025 inch to the

edge of the board and component shall be at least
0.05 inch from the edge of the board.
3.9 Conductor paths should be oriented to the XY

coordinate system. Always use shorter routing.
3.10 Maintain uniform pattern around holes.

3.11 Layout analog and digital circuits in separate section
of the board.
3.12 Make separation between sections.
3.13 Mixed mode device (A/D or D/A) on edge of each
section
3.14 Decoupling Analog/Digital power to each section
digital circuitry gap mixed mode device.
3.15 Draw the complete schematic, which include all the

components which are to be placed on to the board.
To simplify the viewing, avoid using ground
symbol. Draw all the wire. Also for convenience
ground network should be at the bottom of the
schematic, and the power line- at the top.
3.16 Then size of particular components should be

determined according to what you have. Typically,
there are a lot of similar components (resistor,
capacitor, low power transistor etc. ) the bigger is
the ratio between smaller and larger components,
the difficulty is lay out creation.
3.17 At the same time also decide to use single or double
layer PCB.
Strategy and rules of placing component and routing

Try to keep ground track near the bottom of PCB
(looking from track side), keep the power track at
the top.
Try to make lay out similar to the schematic, dont
try to make complicated rearrangement unless it is
possible to simplify.
At the beginning, set the approximate width of the
board and then try to fill it moving. Moving from
right to the left.
Dont forget parts for external connections. If some
net has more than one external connection.
Materials for PCB design

Photographic Paper
Photographic Developer Chemical
Steel wool.
Printed Circuit Board
Etching solution (Ferric chloride).
1mm drill bit
Dry clothe
PROCEDURES ON PRINTED CIRCUIT

BOARD FABRICATION
Step 1:
Prepare a layout of the circuit on any commonly
used PCB designing software. A layout is a design
which interconnects the components according to
the schematic diagram (circuit diagram). Print the
layout using a Laser Printer. Make sure that the
design is correct with proper placement of the
components.
Step 2:
Cut the copper board according to the size of layout. A
copper board is the base of a PCB, it can be single layer,
double layer or multi layer board.
Single layer copper board has copper on one side of the
PCB, they are used to make single layer PCBs, it is widely
used by hobbyist or in the small circuits. A double layer
copper board consists of copper on both the sides of the
PCB. These boards are generally used by the industries. A
multilayer board has multiple layers of copper; they are quite
costly and mainly used for complex circuitries like mother
board of PC.
Step 3:
Rub the copper side of PCB using steel wool. This removes
the top oxide layer of copper as well as the photo resists
layer if any.
Step 4:
Print the PCB Layout on any white paper using
Laser Jet printer.
Step 5:
Put the printed PCB Lay-out on the Printed Circuit Board
and place it to the photo developer. Set the time on the
photo developer to 25 seconds
Step 6:
Submerge the PCB on the Photo Developer chemical

at the compartment of the PCB Fabrication machine.
Step 7:
After it is fully developed, put the PCB on the

washing compartment of the PCB fabrication
machine. Wash the PCB using clean water.
Step 8:
Now the layout is printed on PCB. The area covered
by photo mark is known as the masked area and the
unwanted copper not covered by photo mark is
known as unmasked area. Now make a solution of
ferric chloride. Take a plastic box and fill it up with
some water. Dissolve the crystalize Ferric Chloride
35% of the water in the container. Pour the solution
to the intended compartment of the PCB Fabrication
Machine.
Step 9:
Plug the PCB fabrication Machine to 220 ACV
supply and turn it ON. Set the timer at 15 minutes then
put the Printed Circuit Board on the compartment.
Step 10:
Turn on the spray motor and wait until the setting
time met then the spray motor will stop. Take out
the PCB and put into the washing compartment if it
has still remaining copper put again the PCB on the
etching compartment and turn on the spray motor.
Until such time all copper in the unmasked area is
being etched.
Step 11:
Take out the PCB wash it in cold water and remove the ink
by rubbing it with steel wool. The remaining area which
has not been etched is the conductive copper tracks
which connect the components as per the circuit diagram.
Step 12:
Now carefully drill the PCB using a drilling machine on the
pads.
Step 13:
Put the components in the correct holes and solder
them.
This completes your PCB fabrication now put the
components on mounting side and solder
them. Make sure that you properly dispose of the
FeCl3 solution, clean your tools and wash your
hands after this exercise. You can also store the
solution in a plastic box for future use but not for too
long.

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PRINTED CIRCUIT BOARD

Production of a Printed Circuit Board

The reason of producing a Printed Circuit Board (PCB) is to achieve

The basis is a copper-plated board. The principle of producing the

1.1 Type FR-2

Light brown phenol-resin paper. Thickness mainly 1.5 mm. It

1.2 Type FR-3

Epoxy resin paper with orange like color. It is very common

1.4 Type CEM-1

It is composite from FR-3 and FR-4

2.2 Fine Acid Crystals

To use these crystal is very suitable and it can be

2.3 Ammonium Persulfate (NH4)2S2O8

Not very often, because of the disadvantages, that it can be

3. Layout Design of the circuit

3.1 There are several possibilities to transfer of a circuit to

3.2 The layout has to be developed in such a way to be

3.5 Maintain minimal spacing for resistor (0.1 to 0.25

3.6 Components which dissipate more than 2w should

3.8 Conductor path shall be at least 0.025 inch to the

3.9 Conductor paths should be oriented to the XY

3.10 Maintain uniform pattern around holes.

3.15 Draw the complete schematic, which include all the

3.16 Then size of particular components should be

Strategy and rules of placing component and routing

Materials for PCB design

PROCEDURES ON PRINTED CIRCUIT

Submerge the PCB on the Photo Developer chemical

After it is fully developed, put the PCB on the

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