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Fourier Transform Infra Red

(FTIR)

GROUP 3
1. DWI YULIANTININGSIH
2. WIFQUL LAILI
3 . R I S K I AY U C A N D R A
4. RINA RUKAENAH
What is Infrared Region?

 Infrared radiation lies between the visible and microwave


portions of the electromagnetic spectrum.
 Infrared waves have wavelengths longer than visible and
shorter than microwaves, and have frequencies which are
lower than visible and higher than microwaves.
 The Infrared region is divided into: near, mid and far-
infrared.
 Near-infrared refers to the part of the infrared spectrum
that is closest to visible light and far-infrared refers to
the part that is closer to the microwave region.
 Mid-infrared is the region between these two.
 The primary source of infrared radiation is thermal
radiation. (heat)

 It is the radiation produced by the motion of atoms and


molecules in an object. The higher the temperature, the
more the atoms and molecules move and the more infrared
radiation they produce.
What is FT-IR-

 FT-IR stands for Fourier Transform Infra Red, the preferred method of
infrared spectroscopy.

 In infrared spectroscopy, IR radiation is passed through a sample, Some of the


infrared radiation is absorbed by the sample and some of it is passed through
(transmitted). The resulting spectrum represents the molecular absorption and
transmission, creating a molecular fingerprint of the sample.

 Like a fingerprint no two unique molecular structures produce the same


infrared spectrum.

 This makes infrared spectroscopy useful for several types of analysis.


COMPONENTS OF FTIR

 SOURCE
 AN OPTICAL SYSTEM WHICH USES
INTERFEROMETER
- BEAM SPLITTER
- S TAT I O N A RY M I R R O R
- MOVING MIRROR
 SAMPLE
 DETECTOR
COMPONENTS OF FTIR

 Source : Nernst glower, Global source, Tungsten Lamps, Mercury arc.

 Beam splitter : It is made of material which has 50% refractive index


o For far IR : Mylar film sandwiched between halide plate of low
refractive index solid used.
o For Middle IR : Thin film of germanium or silicon deposited on CsI
or CsBr or KCl or NaCl
o For Near IR : Thin Film of Ferric oxide deposited on calcium
Chloride

 Detector : Pyroelectric detector is used


FTIR DIAGRAM

He-Ne gas laser

Beam splitter
Moveable mirror

Sample chamber

Fixed mirror Detector


Interferometer
 It consist of two perpendicular mirrors, one of which is stationary mirror and
the other is a moveable mirror.
 The position of the moveable mirror is controlled by HeNe Laser (632,8 nm)
 Between these two mirrors, set a beam splitter at 45° from the initial position
of the moveable mirror.
 A parallel beam of radiation from the IR source is passed on to the mirrors
through the beam splitter.
 The beam splitter divides the beam and transmits half of the incoming
radiation to the fixed mirror and the other half to the movable mirror.
 Upon reflection from the fixed and moveable mirrors, the light is recombined
at the beam splitter.
 The recombined radiation is then directed through the sample and focused
on to the detector (Pyroelectric Detector).
 When the path difference is ZERO, all the spectral components are in phase
and the output is a MAXIMUM.
How to operate FTIR? How to manage the sample?
Turning on the instrument a. Sample of gas
a. Reflectation method b. Sample of liquid
b. Transmission method c. Sample of solid
1. Manage the spectrum
2. Save the peak without label
3. Save the peak with label
4. Coupling the peak
Principle Of FTIR Spectroscopy

Lambert-Beer´s law
• FTIR spectra can provide quantitative information
• Lambert-Beer´s law correlates physical properties and chemical
composition :

– The concentration of a sample can be estimated by:


A = ε.c.d
– Where:
• ε is the molar absorption coefficient
• c is the sample concentration
• d is the sample thickness
FTIR limitations

1. Molecule must be active in the IR region. (When exposed to IR radiation, a


minimum of one vibrational motion must alter the net dipole moment of the
molecule in order for absorption to be observed.)

2. Minimal elemental information is given for most samples.

3. Material under test must have some transparency in the spectral region of
interest.

4. Accuracy greater than 1% obtainable when analysis is done


under favourable conditions.
How to treat FTIR?

 Let the instrument warming up for 15-20 minutes


 Keep away the spectrofotometer from sunlight,
because sunlight can interfere the measurement
 Save the spectrofotometer in the place which the
temperature is stabil
 when entering a cuvette, make sure the cuvette is dry
 Calibrate the wavelength and absorbance regularly
How to Calibrate FTIR?

One of calibration of FTIR can be done by using


Polystyrene film. Polystyrene spectrum is used as a
comparator to the sample spectrum as measured by
the sama instrument.
If there are shifts in absorbtion bands from the
sample, correction can be made.
Comparison of FT-IR & IR

Dispersive IR Fourier transform IR

1. There are many moving parts, 1. Only the mirror moves during the
resulting in mechanical slippage. experiment.

2. Calibration against reference spectra 2. Use of laser provides high frequency


is required to measure frequency. accuracy (to 0.01 cm-1).

3. Stray light causes spurious readings. 3. Stray radiations do not affect the
detector.

4. To improve resolution only a small 4. A much larger beam may be used at


amount of IR beam is allowed to pass. all time. Data collection is easier.
Dispersive IR Fourier transform IR

5. Only radiation of a narrow frequency 5. All frequency of radiation falls on the


range falls on the detector at one time. detector simultaneously.

6. Slow scan speed. 6. Rapid scan speed.


Conclusion

Advantages-

– FTIR is a simple and sensitive analytical tool.


– Provide fast data acquisition tool.
– Simple to operate
– Most useful analytical tool
• To determine the composition of organic materials
• To identify IR transparent or semi-transparent inorganic films
• Provides quantitative determination of compounds in mixtures
Disadvantages-

– Interpretation of the data requires some experience.


– No useful detailed database available for the semiconductor
processes.
– Carbon di-oxide & Water Sensitive.

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