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Thermoelectric Modules and Systems

Development, Manufacturing, Industrialization


www.s-tt-s.com
COMPANY PROFILE

SmarTThermoelectrics «ST» specializes in design, developing and manufacturing of small


sized thermoelectric coolers (TECs) and completed thermal management systems based on
these TECs.

Our thermoelectric products are often integral part to the electronic and
optoelectronic components, assemblies and systems in variety of industrial sectors:
telecommunications, medical, aerospace, automotive, military, consumer electronics,
science and education etc.

«ST» TECs are widely used for cooling and temperature control
of semiconductor lasers, light emitting diodes (LEDs), X-Ray and IR detectors,
Charged Coupled Devices (CCD), central processor units (CPUs)and many other objects
where localized/spot heat rejection or heating is needed.
MANUFACTURING FACILITIES AND OFFICE LOCATION

«SmarTThermoelectrics»
Address: 30 Turbostroiteley St.,Kaluga 248032, Russia, PO:
1034
Tel./ Fax: +7 4842 901954
e-mail: info@s-tt-s.com

General Manager
Dr. Roman Dekhtiaruk
Email: roman.d@s-tt-s.com

Sales Department
Mr Steve Benson
Email: steve.b@s-tt-s.com
PRODUCT EXAMPLE THERMOELECTRIC COOLER / PELTIER ELEMENT

COOLING
The top ceramic plate

Thermoelectric elements

- The bottom ceramic plate


HEATING
+
Power wires
LAY OUT
Ceramic substrates
Ingots of N, P-type
with the
TE material
metallization

- EDM process; Laser cutting to


the billets
- electrochemical
TE elements deposition of
production: protective diffusion
layers;

- diamond cutting of
disk to TE elements
(with min cross-section
= 0.4*0.4 mm);
TE assembly:
- With lead-free 230 solder;
-TO sockets;
-Final assembly.
PRODUCTS
S-SERIES TECS
The «S-Series» is a line of the single stage thermoelectric
coolers which are able to provide maximum temperature
difference up to 76 (K).

These series includes more than 400 standard TECs


models. Here you will find TECs with performance
characteristics ranges as shown in the table:

I max Umax Qmax Height Size


(A) (V) (W) (mm) (sq. mm)
0.55 - 9.7 0.48-11.5 0.27-62 1.65-4.1 1.6х3.2 -
21х21
«S-Series» is divided to the next subseries:
SS – standard rectangular TECs;
SL – linear TECs;
SR – round TECs;
SH – TECs with holes;
SI – TECs with increased cooling capacity.
PRODUCTS
M-SERIES TECS
«ST» presents «M-Series» TECs - from 2 to 5
cascades thermoelectric cooling devices with
maximum temperature difference between its
cold and hot side up to 130°C. «M-Series» is
divided to the next subseries:
MS – cascade TECs with standard pyramidal
design;
ME – TECs with enlarged surface of the top
cascade (TEC cold side = TEC hot side). These
TECs are able to provide the same cooling
capacities and temperature differences as
traditional pyramidal TECs but at bigger surface
area of the cold side. Increased area and
mechanical strength of the top cascades gives a
possibility to work with relatively big cooled
objects.
ML – linear cascade TECs. The variation of ME-
subseries TECs especially designed for deep
cooling of oblong objects (CCDs, detector
arrays etc.).
PRODUCTS
ASSEMBLIES

Big part of our standard TECs are installed to the


various sockets, packages and housings. “ST” can
propose the following benefits:

- Saving of lead-time at the customer’s facility


- Saving of costs for the customer
- exclusion of the possibility of TECs damage
during installation
- a wide range of standard enclosures
- the possibility of installation in the customer's
enclosures
Manufacturing Options

1. TEC substrates c) Metallized and pretinned with:


a) High Purity Aluminum Oxide (Al2O3, - InSn (m/p: 117°C);
99.6 %) - BiSn (m/p: 138°C);
b) Aluminum Oxide (Al2O3, 96 %) - In (m/p: 157°C);
c) Aluminum Nitride d) Other options can be implemented
on request
2. TEC internal solder
a) PbSn (m/p: 183°C ) 4. TEC current leads
b) SnBi (m/p: 230 °C, Pb-free) a) Pretinned copper wires (length can
c) AuSn (m/p: 280 °C, Pb-free) on be varied on request)
request b) Insulated wires (length can be varied
on request)
3. TEC outer surfaces treatment c) Cu posts Au plated
a) Naked ceramic (no metallization)
b) Au plated (ready for wire bonding 5. Thermistor
process) Can be installed to the TEC cold/hot side
on request
PRODUCTS
CUSTOMIZED TECS

Despite variety of standard TECs we offer, we are


permanently getting requests from our clients for
developing something new - thermoelectric
products which will satisfy exactly their special
demands.

Such parameters as TEC thermal or electrical


characteristics, geometrical design, coating of the
outer TEC surfaces or any other parameter can be
ideally suited to your requirements.
SCIENTIFIC ACTIVITY

Main directions of ST research :

- New applications of thermoelectric cooling in various


industries

- The reliability of thermoelectric modules


SCIENTIFIC ACTIVITY
Dekhtiaruk R.I., «Thermoelectrically Cooled High Power LEDs for Automotive Industry», Proceedings of the 16-th International Forum
on Thermoelectricity, May 19 – 22, Paris, France, 2015.
Dekhtiaruk R.I. Thermoelectric cooling of high power electronic and optoelectronic components. PhD dissertation. ONAFT, Odessa,
2012. (in Russian)
Dekhtiaruk R.I., Semenyuk V.А. «Novel Thermoelectric Modules for Сooling Powerful LEDs: Experimental Results», Journal of
Electronic Materials, Proc. Of ICT/ECT, 2012, Aalborg, Denmark.
Semenyuk V.А., Dekhtiaruk R.I. «Prospects for Improvement in LED Performance Using Thermoelectrics», in Proc. 9th European
Conference on Thermoelectrics, Special Volume of the American Institute of Physics (AIP) Conference Series, 2011, Thessaloniki,
Greece, pp. 552-571
Semenyuk V.А., Dekhtiaruk R.I. «Increase in CPU Power by Integrating TEC into the Standard Heat Sink: Experimental Results», Journal
of Thermoelectricity, №2, 2011, pp. 75-86.
Semenyuk V.А., Dekhtiaruk R.I. «Thermoelectric Cooling of Powerful Microprocessors», Journal of Thermoelectricity , №4, 2010, pp.
67-76.
Semenyuk V.А., Dekhtiaruk R.I. «Prospects for Thermal Management of Powerful Microprocessors Using Thermoelectrics», in Proc.
8th European Conference on Thermoelectrics, 2010, Como, Italy, pp. 106-111.
Semenyuk V.А., Dekhtiaruk R.I. «Thermoelectric Cooling With Constrained Heat Removal», in Proc. 5th European Conference on
Thermoelectric (ECT), 2007, Odessa, Ukraine, pp. 94-97
Semenyuk V.А., Dekhtiaruk R.I. «Thermoelectric Cooling Under Dimensional Constraints», Journal of Thermoelectricity №4, 2007, pp.
69-75.
Semenyuk V.A., Antonenko A.V. “Issledovanie nadezhnosti termoelektricheskih ohladitelej,” Refrigeration engineering and technology,
№ 2 (106) (2007), p. 17-24 (in Russian).
V. Semenyuk, O. Antonenko «Diffusion Protection of Thermoelectric Coolers Junctions as a Means of Increasing Their Reliability»,
Proceedings of the 5-th European Conference on Thermoelectric (2007), pp. 90-93
V. A. Semenyuk, O. V. Antonenko «Improvement of thermoelectric coolers reliability» Journal of Thermoelectricity №4, 2007, pp. 70-
73.
Semenyuk V.A., Antonenko A.V. “Issledovanie nadezhnosti termoelektricheskih ohladitelej,” Refrigeration engineering and technology,
№ 2 (106) (2007), p. 17-24 (in Russian).
Thanks for attention!

2018

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