COURSE MATERIAL

Required text:
• Materials Science and Engineering: An Introduction
W.D. Callister, Jr., 6th edition, John Wiley and
Sons, Inc. (2003). Both book and
accompanying CD-ROM are needed.
Optional Material:
• _____
________.
• _____
________.
• _____
________.

  Chapter 1- f
 READING SCHEDULE
Week Topic Chapter
1 General Intro; Atomic Bonding 1,2
2 Crystalline Structure; Imperfections 3*,4
3 Diffusion; Mechanical Properties 5,6*
4 Strengthening Mechanisms; Failure 7*,8*
5 Phase Diagrams 9*
6 Kinetics & Phase Transformations 10*
Processing & Applications of Metals 11
7 Struc., Prop., Proc., Applic. of Ceramics 12,13*
8 Struc., Prop. of Polymers; Composites 15,16
9 Corrosion; Elec. & Thermal Prop. 17*,18*,19*
10 Magnetic & Optical Prop. 20,21
Econ. & Envir. Issues; Materials Selection 22*
Lectures: will highlight important portions of each
chapter.
*
One or more sections of this chapter are on the CD-ROM.
  Chapter 1- i
 CHAPTER 1: MATERIALS
SCIENCE & ENGINEERING
Materials are...
engineered structures...not blackboxes!
Structure...has many dimensions...

Structural feature Dimension (m)

atomic bonding < 10-10
missing/extra atoms 10-10
crystals (ordered atoms) 10-8-10-1
second phase particles 10-8-10-4
crystal texturing > 10-6
  Chapter 1- 1
Structure, Processing, & Properties
• Properties depend on structure
ex: hardness vs structure of steel
(d)

600
Hardness (BHN)

30m
500 (c)
Data obtained from Figs. 10.21(a)
400 (b) and 10.23 with 4wt%C composition,
(a) and from Fig. 11.13 and associated
4m discussion, Callister 6e.
300 Micrographs adapted from (a) Fig.
10.10; (b) Fig. 9.27;(c) Fig. 10.24;
30m
and (d) Fig. 10.12, Callister 6e.
200 30m

100
0.01 0.1 1 10 100 1000
Cooling Rate (C/s)
• Processing can change structure
ex: structure vs cooling rate of steel
  Chapter 1- 2
 The Materials Selection Process
1. Pick Application Determine required Properties
Properties: mechanical, electrical, thermal,
magnetic, optical, deteriorative.

2. Properties Identify candidate Material(s)

Material: structure, composition.

3. Material Identify required Processing

Processing: changes structure and overall shape
ex: casting, sintering, vapor deposition, doping
forming, joining, annealing.

  Chapter 1- 3
 ELECTRICAL
• Electrical Resistivity of Copper:
6 i
t % N Adapted from Fig. 18.8, Callister 6e.

2 a (Fig. 18.8 adapted from: J.O. Linde,

5 .3 Ann Physik 5, 219 (1932); and
+3
Resistivity, 

C.A. Wert and R.M. Thomson,

Cu N i
(10-8 Ohm-m)

at % Ni Physics of Solids, 2nd edition,

4 2 .1 6 at % McGraw-Hill Company, New York,
2
+ 1.1
1970.)
Cu +
3 d Cu
f orme % N i
de 2 at
2 1. 1
+
Cu
1 ” C u
re
“Pu
0
-200 -100 0 T (°C)
• Adding “impurity” atoms to Cu increases resistivity.
• Deforming Cu increases resistivity.
  Chapter 1- 4
 THERMAL
• Space Shuttle Tiles: • Thermal Conductivity
--Silica fiber insulation of Copper:
offers low heat conduction. --It decreases when
Fig. 19.0, Callister 6e. you add zinc!
(Courtesy of Lockheed
Missiles and Space
Company, Inc.)
400

Thermal Conductivity
300

(W/m-K)
200

100
0
0 10 20 30 40
Composition (wt%Zinc)
Adapted from Adapted from Fig. 19.4, Callister 6e.
Fig. 19.4W, Callister (Fig. 19.4 is adapted from Metals
6e. (Courtesy of Handbook: Properties and Selection:
Lockheed Aerospace Nonferrous alloys and Pure Metals, Vol. 2,
Ceramics Systems, 9th ed., H. Baker, (Managing Editor),
Sunnyvale, CA) American Society for Metals, 1979, p.
(Note: "W" denotes 315.)
100m   fig. is on CD-ROM.) Chapter 1- 5
 MAGNETIC
• Magnetic Storage: • Magnetic Permeability
--Recording medium vs. Composition:
is magnetized by --Adding 3 atomic % Si
recording head. makes Fe a better
recording medium!

Magnetization
Fe+3%Si

Fe

Fig. 20.18, Callister 6e.
(Fig. 20.18 is from J.U. Lemke, MRS
Bulletin,
Vol. XV, No. 3, p. 31, 1990.)
Magnetic Field
Adapted from C.R. Barrett, W.D. Nix, and
A.S. Tetelman, The Principles of
Engineering Materials, Fig. 1-7(a), p. 9,
1973. Electronically reproduced
by permission of Pearson Education, Inc.,
Upper Saddle River, New Jersey.

  Chapter 1- 6
 OPTICAL
• Transmittance:
--Aluminum oxide may be transparent, translucent, or
opaque depending on the material structure.

polycrystal: polycrystal:
single crystal low porosity high porosity

Adapted from Fig. 1.2,

Callister 6e.
(Specimen preparation,
P.A. Lessing; photo by J.
Telford.)

  Chapter 1- 7
 DETERIORATIVE
• Stress & Saltwater... • Heat treatment: slows
--causes cracks! crack speed in salt water!

crack speed (m/s)

10-8 “as-is”
“held at
160C for 1hr
before testing”
10-10 Alloy 7178 tested in
saturated aqueous NaCl
solution at 23C

increasing load
Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation
and Fracture Mechanics of Engineering Materials" (4th ed.),
Adapted from Fig. 17.0, Callister 6e. p. 505, John Wiley and Sons, 1996. (Original source:
(Fig. 17.0 is from Marine Corrosion, Markus O. Speidel, Brown Boveri Co.)
Causes, and Prevention, John Wiley and
4m
Sons, Inc., 1975.)
--material:
7150-T651 Al
"alloy"
(Zn,Cu,Mg,Zr)
Adapted from Fig. 11.24,
Callister 6e. (Fig. 11.24 provided courtesy of G.H.

 
Narayanan and A.G. Miller, Boeing Commercial
Airplane Company.) Chapter 1- 8
 SUMMARY
Course Goals:

• Use the right material for the job.

• Understand the relation between properties,

structure, and processing.

• Recognize new design opportunities offered

by materials selection.

  Chapter 1- 9